Abstract: A Video Tape Recorder (VTR) with a liquid crystal display (LCD) projector free from a radiating blower is disclosed. The VTR with LCD projector includes a plurality of fins positioned on a top surface of a rotary head drum for generating air currents during rotation of a rotary head drum of a VTR part. A polarizing plate of the LCD projector part is cooled by the air currents generated by the fins. The VTR with LCD projector achieves compactness and reduction of cost, in keeping with the recent market trend.

Abstract: An video signal processing circuit of a double deck VCR capable of preventing a deterioration of picture when dubbing, which includes a reproducing video cassette tape recorder and a recording video cassette tape recorder disposed in a single body, wherein the reproducing VCR transmits a luminance signal and a chrominance signal, respectively, to the recording VCR and includes a luminance reproduction processing circuit generating a high band detection signal to be transmitted to the recording VCR, and the recording VCR includes a first switch for switching an input signal and an output signal of a low pass filter for luminance signal in response to the high band detection signal so that the output of the low pass filter is outputted to a luminance signal recording processing circuit when a high band signal is detected and the input of the low pass filter is outputted when the high band signal is not detected, and a second switch for switching an input signal and an output signal of a band pass filter in resp

Abstract: A nonvolatile semiconductor memory device is provided in which a negative voltage is applied to a gate electrode of a memory cell transistor during an erase mode. The memory device includes a row decoder circuit having an N-channel transistor connected to a word line. The N-channel transistor is provided on a P-type well region of a semiconductor substrate. A negative voltage is applied to the P-type well region during the erase mode, while ground potential is applied thereto during other modes.

Abstract: In a flash memory EEPROM, a memory cell MC is formed in a P-type semiconductor substrate. A peripheral transistor TR is formed in an N-type well. Another peripheral transistor TR is formed in a P-type well. The P-type well is by turn formed an N-type well and electrically insulated from the substrate. The substrate is typically provided with a metal back structure and its substrate voltage is set to predetermined voltages respectively for data erasure, data storage and data retrieval with such an arrangement, the level of voltage stress with which the device is loaded during data erasure can be remarkably reduced to allow a down-sizing and an enhanced quality to be realized for the device.

Abstract: In a nonvolatile semiconductor memory having a two-stage sense read circuit using a level shift circuit and a single-end sense amplifier, relationships of sizes of a main memory cell bit line charge transistor, a main memory cell bit line transfer gate transistor, a main memory cell bit line load transistor, a dummy cell bit line charge transistor, a dummy cell bit line transfer gate transistor, and a dummy cell bit line load transistor are set to simultaneously satisfy conditions for equalizing a bit line and a dummy cell bit line and conditions for equalizing a sense line and a dummy cell sense line. Therefore, the potentials of the bit line and the dummy cell bit line and the potentials of the sense line and the dummy cell sense line can be simultaneously equalized, and a high-speed read operation can be achieved.

Abstract: A nonvolatile semiconductor memory device is provided in which a negative voltage is applied to a gate electrode of a memory cell transistor during an erase mode. The memory device includes a row decoder circuit having an N-channel transistor connected to a word line. The N-channel transistor is provided on a P-type well region of a semiconductor substrate. A negative voltage is applied to the P-type well region during the erase mode, while ground potential is applied thereto during other modes.

Abstract: A VTR equipped with an LCD projector integral therewith, capable of eliminating the complexity of wirings and preventing degradation of video signals. The VTR includes a front screen, a rear screen disposed on a front panel of a VCR body and constructed to be openable and closable for the LCD projector projecting the image, a closing detecting unit for detecting an openable or closable state of the rear screen, an image inverting unit for laterally inverting a direction of the image to be projected onto the rear screen, the rear screen being opened when a viewer observes the image projected on the front screen, while being closed when the viewer observes the image projected on the rear screen, the detecting unit informing the image inverting means of the closed state of the rear screen, and the image inverting unit laterally inverting the image to be projected onto the rear screen upon receiving the information.

Abstract: In a flash memory EEPROM, a memory cell MC is formed in a P-type semiconductor substrate. A peripheral transistor TR is formed in an N-type well. Another peripheral transistor TR is formed in a P-type well. The P-type well is by turn formed an N-type well and electrically insulated from the substrate. The substrate is typically provided with a metal back structure and its substrate voltage is set to predetermined voltages respectively for data erasure, data storage and data retrieval. With such an arrangement, the level of voltage stress with which the device is loaded during data erasure can be remarkably reduced to allow a down-sizing and an enhanced quality to be realized for the device.

Abstract: A nonvolatile semiconductor memory device is provided in which a negative voltage is applied to a gate electrode of a memory cell transistor during an erase mode. The memory device includes a row decoder circuit having an N-channel transistor connected to a word line. The N-channel transistor is provided on a P-type well region of a semiconductor substrate. A negative voltage is applied to the P-type well region during the erase mode, while ground potential is applied thereto during another modes.

Abstract: Disclosed is a semiconductor integrated circuit device, which comprises a booster circuit for boosting a source voltage, a voltage limiter having one end connected to the output terminal of the booster circuit, for limiting the output voltage of the booster circuit to a given value, and a voltage setting circuit, connected to the other end of the voltage limiter, for arbitrarily adjusting a voltage at the other end of the voltage limiter. This design can keep the output voltage of the booster circuit at a constant level and can set that output voltage to an arbitrary voltage.

Abstract: A semiconductor nonvolatile memory apparatus is composed of differential cells in which data can be written electrically, data reading sense amplifiers for reading data from these cells, and threshold voltage shift checking sense amplifier connected to respective sense inputs of the sense amplifiers through selecting switching elements and checking threshold voltages of respective transistors within the differential type cells. According to this semiconductor nonvolatile memory apparatus, data can be read out at high speed without increasing the chip size.

Abstract: A semiconductor integrated circuit includes a circuit block whose operation is controlled by a inverted control signal whose significant potential level is set at a ground potential, and a wiring for transmitting a control signal for controlling the operation of the circuit block. An inverting circuit provided near the circuit block inverts the control signal and then supplies the inverted signal to the circuit block via a wiring. The inverter includes a first capacitor connected between the power source terminal and a node which is set at a high potential level in the inverter circuit when the control signal is set at the non-significant potential level and a second capacitor connected between a ground potential terminal and a node which is set at a ground potential level when the control signal is set at the non-significant potential level.

Abstract: A bias voltage generating circuit supplies a bias voltage to a memory's bit lines. One end of a first transistor is connected to a first power supply. The first transistor conducts in response to a control signal. A second transistor is connected to another end of the first transistor. Another end of the second transistor and a gate of the second transistor are connected to an output node. One end of a third transistor and a gate connected to the output node. One end of a fourth transistor and a gate are connected to a second end of the third transistor. A second end of the fourth transistor is connected to a second power supply. One end of a fifth transistor is connected to the first power supply. The fifth transistor also conducts in response to the control signal. A sixth transistor is connected to a second end of the fifth transistor. A second end of the sixth transistor is connected to the output node and the gate of the sixth transistor is connected to a potential source.

Abstract: A semiconductor non-volatile memory device having non-volatile memory cells for storing binary data, a plurality of column lines respectively connected to the plurality of memory cells and a plurality of row lines respectively connected to the plurality of memory cells comprising a plurality of dummy cells, having the same structure as the memory cells, respectively connected to the column lines and arranged to be set in an ON state upon being selected, a dummy row line connected to the plurality of dummy cells, a dummy row line selector for selecting the dummy row line for a predetermined period in response to a chip selection signal for selecting the memory device. Therefore, since the dummy row line is selected for the predetermined period before the memory device is selected by a computer system or the like, each of the column lines is set at a ground potential by a dummy memory cell set in an ON state.

Abstract: The current paths of column selection transistors are inserted between a pair of input nodes, on the one hand, of a sense amplifier constituted by a current-mirror type differential amplifier, and column lines, on the other hand. The current paths of transistors for clamping column potential are inserted between the input nodes of the sense amplifier, on the one hand, and a power source, on the other. The gates of the transistors for clamping column potential are supplied with a bias potential lower than the potential of the power source. When data is read out from selected memory cells, the potential of the input nodes of the sense amplifier is clamped to a value lower than the potential Vcc of the power source by the transistors for clamping column potential. The storage data in the selected memory cells is input directly to the input nodes of the sense amplifier through the current paths of the column selection transistors.

Abstract: An address detector of a redundancy memory cell is provided including a programming element for storing address data for replacing a defective cell with the redundancy cell. In a test mode, the redundancy cell may be written to regardless of whether or not a memory cell is defective. Thus, the redundancy cell may be tested without programming a programming element that replaces a defective cell with a redundancy cell. The detector further includes a latch for latching the state of the programming element, and a data setting element for setting the latch in a test mode.

Abstract: A nonvolatile semiconductor memory device comprising a power source terminal and a P-channel MOS transistor. A low power-source voltage is applied to the terminal during a read period. The source of the P-channel MOS transistor is coupled to the power source terminal. The conduction of the MOS transistor is controlled by data-writing operation. The drain of the MOS transistor is connected by a node to a plurality of bit lines. The device further comprises a plurality of memory cells and a plurality of N-channel MOS transistor. The memory cells have double-gate structure, each having a source coupled to the ground and a drain coupled to the corresponding bit line. Each N-channel MOS transistor has a source and a drain connected to the ground and the corresponding bit line, respectively, for discharging the bit line.

Abstract: A memory cell array includes data storing memory cells which are arranged in a matrix form of m rows.times.n columns. The data storing memory cells are selected by means of m word lines and n bit lines. Dummy capacitance cells are arranged on the (n+1)th column of the memory cell array, and are connected to the word lines. The dummy capacitance cells are each formed of a transistor which has the same construction as a field transistor having a gate electrode formed of a polysilicon layer or the data storing memory cell and whose source is set in the electrically floating condition. Array edge memory cells are arranged on the (m+1)th row of the memory cell array, and are connected to n bit lines. The array edge memory cells have no influence on the circuit operation. A dummy memory cell is arranged in an intersecting position of the (m+1)th row and the (n+1)th column.

Abstract: A semiconductor integrated circuit having a test mode in addition to a normal mode, includes a mode detecting circuit for detecting a state of each mode and generating a mode signal, a prebuffer circuit for receiving the mode signal generated by the mode detecting circuit, amplifying an input signal by using an output driving capacity corresponding to the mode signal, and outputting the amplified signal, and an output buffer circuit for receiving an output from the prebuffer circuit and outputting data outside the integrated circuit.

Abstract: A semiconductor memory device includes a memory cell transistor, a voltage switching circuit supplied with a first voltage for data readout and a second voltage for data write and selectively generating one of the first and second voltages in response to a write control signal, a first driving circuit supplied with an output from the voltage switching circuit and driving the gate of the memory cell transistor in response to a memory cell selection signal, a sense circuit for sensing data of the memory cell transistor by comparing a sense potential corresponding to data from the memory cell transistor with a reference potential, a reference cell transistor for generating the reference potential, and a second driving circuit supplied with the output from the voltage switching circuit and driving the gate of the reference cell transistor in response to the write control signal.