Patents by Inventor Sung-Hui Huang

Sung-Hui Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8350260
    Abstract: A transistor structure comprises a patterned N-type transparent oxide semiconductor formed over a substrate as a base, and a patterned p-type organic polymer semiconductor formed on the patterned N-type transparent oxide semiconductor comprising a first portion and a second portion so that the patterned N-type transparent oxide semiconductor and the first portion and the second portion of the patterned p-type organic polymer semiconductor form heterojunctions therebetween respectively, wherein the first portion of the patterned p-type organic polymer semiconductor is used as an emitter, and the second portion of the patterned p-type organic polymer semiconductor is used as a collector.
    Type: Grant
    Filed: January 26, 2011
    Date of Patent: January 8, 2013
    Assignee: E Ink Holdings Inc.
    Inventors: Chia-Chun Yeh, Henry Wang, Yao-Chou Tsai, Sung-Hui Huang
  • Publication number: 20130002530
    Abstract: A segment display device includes an e-paper segmented display module, a first circuit module and a second circuit module. The e-paper segmented display module includes a group of first contacts. The first circuit module includes a first substrate, a first control unit, a group of second contacts and a group of third contacts. The first control unit, the second contacts and the third contacts are disposed on the first substrate. The first control unit is electrically connected with the second contacts and the third contacts. The second contacts are electrically connected to the first contacts. The second circuit module includes a second substrate, a second control unit and a group of fourth contacts. The second control unit and the fourth contact group are electrically connected with each other and both are disposed on the second substrate. The fourth contacts are electrically connected to the third contacts.
    Type: Application
    Filed: June 8, 2012
    Publication date: January 3, 2013
    Applicant: E Ink Holdings Inc.
    Inventors: Ming-Chuan Hung, Sung-Hui Huang, Po-Wen Hsiao, Huai-Tse Yang, Chien-Feng Hsu
  • Patent number: 8336358
    Abstract: A wire stretching device for applying a drag force onto a wire wound around an object is provided. The wire stretching device comprises a primary platform, a first sub-platform, a second sub-platform and a driving device. The primary platform comprises a plate, a fixed stick and a track, wherein the fixed stick and the track are disposed on a surface of the plate, and the fixed stick has a first fixing device for fixing a first end of the wire. The object is fixed on a first stage of the first sub-platform, and a second fixing device is disposed on a second stage of the second sub-platform for fixing the second end of the wire. The second sub-platform is moved by the driving device for adjusting the tension of the wire. The first sub-platform is passively moved along the track corresponding to the tension of the wire.
    Type: Grant
    Filed: July 16, 2009
    Date of Patent: December 25, 2012
    Assignee: E Ink Holdings Inc.
    Inventors: Yao-Chou Tsai, Kai-Cheng Chuang, Sung-Hui Huang, Tzu-Ming Wang
  • Publication number: 20120319239
    Abstract: A semiconductor structure includes a through-substrate-via (TSV) structure disposed in a substrate. A first etch stop layer is disposed over the TSV structure. A first dielectric layer is disposed in contact with the first etch stop layer. A first conductive structure is disposed through the first etch stop layer and the first dielectric layer. The first conductive structure is electrically coupled with the TSV structure. The TSV structure is substantially wider than the first conductive structure. A second etch stop layer is disposed in contact with the first dielectric layer. A metal-insulator-metal (MIM) capacitor structure is disposed in contact with the second etch stop layer.
    Type: Application
    Filed: June 15, 2011
    Publication date: December 20, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chun Hua CHANG, Sung-Hui HUANG, Der-Chyang YEH
  • Publication number: 20120314275
    Abstract: An electrophoresis display apparatus includes an electronic-ink (E-Ink) layer, a passive-matrix substrate, and a conducting layer. The passive-matrix substrate has an electrode surface, and the electrode surface has a plurality of electrodes. The conducting layer has a predetermined shape. The conducting layer is disposed between the electronic-ink layer and the electrode surface of the passive-matrix substrate and is used for transmitting the signals on the electrodes contacting the conducting layer to the electronic-ink layer, so that the electronic-ink layer can display an image with the predetermined shape.
    Type: Application
    Filed: May 25, 2012
    Publication date: December 13, 2012
    Applicant: E Ink Holdings Inc.
    Inventors: MING-CHUAN HUNG, Po-Wen Hsiao, Sung-Hui Huang, Tsung-Yi Lin, Wei-Chun Hsu
  • Patent number: 8314020
    Abstract: Disclosed herein is a method for patterning a metal layer, which includes the following steps. A substrate having a metal layer thereon is provided. A patterned conductive polymeric layer is formed on the metal layer, wherein a portion of the metal layer is exposed by the patterned conductive polymeric layer. The substrate having the patterned conductive polymer layer is disposed in an electrolytic cell, so that the exposed portion of the metal layer is immersed in the electrolytic solution of the electrolytic cell. The anode of the electrolytic cell is electrically coupled to the patterned conductive polymeric layer, while the cathode of the electrolytic cell is immersed in the electrolytic solution. Sequentially, an electrical potential is applied across the anode and the cathode to perform an electrolysis reaction so that the exposed portion of the metal layer is dissolved in the electrolytic solution.
    Type: Grant
    Filed: February 10, 2011
    Date of Patent: November 20, 2012
    Assignee: E Ink Holdings Inc.
    Inventors: Sung-Hui Huang, Wei-Chou Lan, Chia-Chun Yeh, Ted-Hong Shinn
  • Publication number: 20120280358
    Abstract: An integrated circuit includes a substrate and a first metal-insulator-metal (MIM) capacitor disposed over the substrate. The MIM capacitor includes a first metallic capacitor plate disposed over the substrate. At least one first insulator layer is disposed over the first metallic capacitor plate. A second metallic capacitor plate is disposed over the at least one first insulator layer. At least one first dielectric layer is disposed over the substrate. At least a portion of the at least one first dielectric layer is disposed between the first metallic capacitor plate and the at least one first insulator layer.
    Type: Application
    Filed: May 5, 2011
    Publication date: November 8, 2012
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Sung-Hui HUANG, Yuan-Hung LIU, Ming-Fa CHEN
  • Publication number: 20120256316
    Abstract: The signal line structure is disposed between a gate driver and a display area of a display. The signal line structure includes a substrate, first metal layers, a first insulation layer, second metal layers, a second insulation layer and third metal layers. The first metal layers are arranged in parallel and toward a first direction in the substrate. The first insulation layer is disposed in the substrate and covers the first metal layers. The second metal layers are disposed on the positions of the first insulation layer corresponding to the first metal layers. The second insulation layer is disposed on the second metal layers and the first insulation layer. The third metal layers are disposed on the positions corresponding to the second metal layers in the second insulation layer. The distance between two adjacent second metal layers is less than that between two adjacent first metal layers.
    Type: Application
    Filed: June 23, 2011
    Publication date: October 11, 2012
    Applicant: E INK HOLDINGS INC.
    Inventors: Wei-Chou LAN, Sung-Hui HUANG, Chia-Chun YEH, Ted-Hong SHINN
  • Patent number: 8274085
    Abstract: The present invention discloses pixel structures and fabrication methods thereof. The pixel includes a thin film transistor forming at a thin film transistor region and a storage capacitor forming at a pixel electrode region. The method includes: forming a gate conduction layer on a substrate; forming a gate insulation layer on the gate conduction layer; forming a source conduction layer and a drain conduction layer on the gate insulation layer, in which the drain conduction layer has an extension section extending to the pixel electrode region; forming a channel layer on the source conduction layer and the drain conduction layer; and forming a protection layer on the channel layer. The extension section and an electrode layer serve as the upper and lower electrode of the storage capacitor, respectively. Wherein the gate conduction layer, the source conduction layer, the drain conduction layer, and the channel layer are made of metallic oxides.
    Type: Grant
    Filed: May 28, 2010
    Date of Patent: September 25, 2012
    Assignee: E Ink Holdings Inc.
    Inventors: Sung-Hui Huang, Henry Wang, Fang An Shu, Ted-Hong Shinn
  • Publication number: 20120168428
    Abstract: An electrothermal transfer device includes a substrate, a plurality of electrothermal components and a heating circuit. The electrothermal components are disposed on a surface of the substrate and arranged in a pattern. The heating circuit is electrically connected to the electrothermal components. In an electrothermal transfer method, at first, a transfer substrate is disposed on a workpiece substrate. Then, the electrothermal transfer device is disposed on the transfer substrate so that the electrothermal components contact with the transfer substrate. Thereafter, the heating circuit is used to heat the electrothermal transfer components so that the transfer substrate is heated to be transferred to the workpiece substrate. The electrothermal transfer device and the electrothermal transfer method can reduce cost.
    Type: Application
    Filed: April 20, 2011
    Publication date: July 5, 2012
    Applicant: E Ink Holdings Inc.
    Inventors: Chia-Chun Yeh, Yao-Chou Tsai, Henry Wang, Sung-Hui Huang
  • Publication number: 20120169645
    Abstract: A sensing structure and a displayer comprising the same are provided. The displayer further comprises a substrate and a panel disposed opposite to the substrate. The sensing structure comprises a plurality of sensing elements, a conductive assembly, and a process module. Each of the sensing elements has a position data corresponding to the panel. Every several adjacent ones of the sensing elements form a plurality of sensing areas. The process module is electrically connected to the sensing elements via the conductive assembly. Each of the sensing elements generates a touch voltage in response to a touch on the sensing areas. The process module receives the touch voltages, and calculates a touch position of the one touch corresponding to the panel according to the position data and the touch voltages.
    Type: Application
    Filed: March 15, 2012
    Publication date: July 5, 2012
    Applicant: E INK HOLDINGS INC.
    Inventors: Kai-Cheng CHUANG, Sung-Hui HUANG
  • Publication number: 20120138919
    Abstract: A photo sensing unit used in a photo sensor includes a photo sensing transistor, a storage capacitor, and a switching transistor. The photo sensing transistor receives a light signal for inducing a photo current correspondingly, and a source and a gate thereof are respectively coupled to the first signal source and the second signal source. The storage capacitor stores electrical charges induced by the light signal, one terminal thereof is coupled to drain of the photo sensing transistor, and another terminal thereof is coupled to a low voltage. The switching transistor is controlled by the second signal source for outputting a readout signal from the storage capacitor to the signal readout line. The threshold voltage of the photo transistor is higher than that of the switching transistor.
    Type: Application
    Filed: December 21, 2010
    Publication date: June 7, 2012
    Applicant: E INK HOLDINGS INC.
    Inventors: WEI-CHOU LAN, SUNG-HUI HUANG, CHIA-CHUN YEH, TED-HONG SHINN
  • Publication number: 20120135588
    Abstract: Disclosed herein is a method for patterning a metal layer, which includes the following steps. A substrate having a metal layer thereon is provided. A patterned conductive polymeric layer is formed on the metal layer, wherein a portion of the metal layer is exposed by the patterned conductive polymeric layer. The substrate having the patterned conductive polymer layer is disposed in an electrolytic cell, so that the exposed portion of the metal layer is immersed in the electrolytic solution of the electrolytic cell. The anode of the electrolytic cell is electrically coupled to the patterned conductive polymeric layer, while the cathode of the electrolytic cell is immersed in the electrolytic solution. Sequentially, an electrical potential is applied across the anode and the cathode to perform an electrolysis reaction so that the exposed portion of the metal layer is dissolved in the electrolytic solution.
    Type: Application
    Filed: February 10, 2011
    Publication date: May 31, 2012
    Applicant: E INK HOLDINGS INC.
    Inventors: Sung-Hui HUANG, Wei-Chou LAN, Chia-Chun YEH, Ted-Hong SHINN
  • Patent number: 8164579
    Abstract: A sensing structure and a displayer comprising the same are provided. The displayer further comprises a substrate and a panel disposed opposite to the substrate. The sensing structure comprises a plurality of sensing elements, a conductive assembly, and a process module. Each of the sensing elements has a position data corresponding to the panel. Every several adjacent ones of the sensing elements form a plurality of sensing areas. The process module is electrically connected to the sensing elements via the conductive assembly. Each of the sensing elements generates a touch voltage in response to a touch on the sensing areas. The process module receives the touch voltages, and calculates a touch position of the one touch corresponding to the panel according to the position data and the touch voltages.
    Type: Grant
    Filed: January 14, 2009
    Date of Patent: April 24, 2012
    Assignee: E Ink Holdings Inc.
    Inventors: Kai-Cheng Chuang, Sung-Hui Huang
  • Publication number: 20120075689
    Abstract: An electronic paper structure is disclosed, which includes a hard substrate, a flexible substrate, at least one magnetic device for fastening the flexible substrate on the hard substrate temporally, a drive substrate formed on the flexible substrate, an electronic paper display layer formed on the drive substrate, and a protect layer formed on the electronic paper display layer. An electronic paper fabricating method using the same is also disclosed.
    Type: Application
    Filed: March 2, 2011
    Publication date: March 29, 2012
    Applicant: E INK HOLDINGS INC.
    Inventors: Sung-Hui HUANG, Chuan-I HUANG, Chin-Wen LIN, Ted-Hong SHINN
  • Publication number: 20120068172
    Abstract: An organic light emitting display device includes a substrate, a transparent electrode layer, a source/drain layer, an IGZO semiconductor layer, a first insulating layer, a gate layer, a second insulating layer and an organic light emitting diode. The organic light-emitting display device can have a simplified manufacturing process. In addition, the present invention also provides a method for manufacturing the organic light-emitting display device.
    Type: Application
    Filed: November 18, 2010
    Publication date: March 22, 2012
    Applicant: E Ink Holdings Inc.
    Inventors: SUNG-HUI HUANG, Wei-Chou Lan, Chia-Chun Yeh, Ted-Hong Shinn
  • Patent number: 8138548
    Abstract: A thin film transistor array substrate includes a substrate, a gate layer, a gate insulating layer, a source/drain layer, a patterned protective layer, an oxide semiconductor layer, a resin layer and a pixel electrode. The gate layer is disposed on the substrate. The gate insulating layer is disposed on the gate layer and the substrate. The source/drain layer is disposed on the gate insulating layer. The patterned protective layer is disposed on the source/drain layer and exposes a portion of the source/drain layer. The oxide semiconductor layer is disposed on the patterned protective layer and electrically connected to the source/drain layer. The resin layer is disposed on the oxide semiconductor layer and covers the oxide semiconductor layer. The pixel electrode is disposed on the resin layer and connects to the source/drain layer. The present invention also provides a method for making the thin film transistor array substrate. The thin film transistor array substrate can prevent leakage current.
    Type: Grant
    Filed: July 16, 2010
    Date of Patent: March 20, 2012
    Assignee: E Ink Holdings Inc.
    Inventors: Sung-Hui Huang, Wei-Chou Lan, Ted-Hong Shinn
  • Publication number: 20120061650
    Abstract: A transistor structure comprises a patterned N-type transparent oxide semiconductor formed over a substrate as a base, and a patterned p-type organic polymer semiconductor formed on the patterned N-type transparent oxide semiconductor comprising a first portion and a second portion so that the patterned N-type transparent oxide semiconductor and the first portion and the second portion of the patterned p-type organic polymer semiconductor form heterojunctions therebetween respectively, wherein the first portion of the patterned p-type organic polymer semiconductor is used as an emitter, and the second portion of the patterned p-type organic polymer semiconductor is used as a collector.
    Type: Application
    Filed: January 26, 2011
    Publication date: March 15, 2012
    Applicant: E INK HOLDINGS INC.
    Inventors: Chia-Chun YEH, Henry WANG, Yao-Chou TSAI, Sung-Hui HUANG
  • Publication number: 20120030111
    Abstract: A service platform utilizing an electronic paper device for financial institutions, comprising: an option input device, used for sensing an entry operation and outputting a financial business option signal accordingly; a control unit, having an option input interface, a display interface, a host interface, and a slips storage unit, wherein the option input interface is used to receive the financial business option signal, the host interface is used to communicate with a financial institution host, the slips storage unit is used to store financial business slips; and an electronic paper device, having a touch input function, coupled to the display interface to display one financial business slip for related information input by a touch pen, or transmit the related information through the control unit to the financial institution host, or display an informing message sent from the financial institution host through the control unit.
    Type: Application
    Filed: July 30, 2010
    Publication date: February 2, 2012
    Inventors: Sung-Hui HUANG, Yao-Chou Tsai, Ted-Hong Shinn
  • Publication number: 20110304593
    Abstract: A pixel driving circuit, a pixel driving method and a light emitting display device are provided in the present invention. The pixel driving circuit includes first through fifth transistors and a capacitor and is for driving a light emitting diode. The third transistor forms a diode connection to make information of the threshold voltages of both the third transistor and the light emitting diode be stored in the capacitor in a data writing period. In a light emitting period, the second transistor compensates drift variation of the threshold voltages of the third transistor and the light emitting diode according to the information stored in the capacitor to provide a stable driving current for driving the light emitting diode.
    Type: Application
    Filed: July 2, 2010
    Publication date: December 15, 2011
    Applicant: E Ink Holdings Inc.
    Inventors: Sung-Hui HUANG, Ted-Hong Shinn, Wei-Chou Lan, Chin-Wen Lin