Abstract: A chip antenna module array includes a first chip antenna module including: a first solder layer disposed below a first dielectric layer; a first feed via disposed in the first dielectric layer; a first patch antenna pattern disposed above the first dielectric layer and having a first resonant frequency; and a first coupling pattern spaced apart from the first patch antenna pattern, and not vertically overlapping the first patch antenna pattern. The chip antenna module array includes a second chip antenna module including: a second solder layer disposed below a second dielectric layer; a second feed via disposed in the second dielectric layer; a second patch antenna pattern disposed above the second dielectric layer and having a second resonant frequency; and a second coupling pattern disposed above and vertically overlapping the second patch antenna pattern. The first and second chip antenna modules are disposed spaced apart on a connection member.

Abstract: A chip antenna is provided. The chip antenna includes a first dielectric layer; a second dielectric layer disposed on an upper surface of the first dielectric layer; a patch antenna pattern disposed in the second dielectric layer; first and second feed vias disposed to penetrate through at least one of the first and second dielectric layers, respectively and electrically connected to a corresponding feed point among different first and second feed points of the patch antenna pattern; and first and second filters disposed between the first and second dielectric layers, respectively and electrically connected to a corresponding feed via among the first and second feed vias.

Abstract: Proposed is an yttrium-based granular powder for thermal spraying. The yttrium-based granular powder includes at least one yttrium compound powder selected from the group consisting of Y2O3, YOF, YF3, Y4Al2O9, Y3Al5O12, and YAlO3, and a silica (SiO2) powder. The yttrium-based granular powder is prepared by mixing the yttrium compound powder having a mean grain diameter of 50 nm to 900 nm and the silica powder having a mean grain diameter of 50 nm to 900 nm. The yttrium-based granular powder includes less than 10 wt % of a Y—Si—O mesophase. A thermal spray coating produced using the yttrium-based granular powder can exhibit low porosity, high density, and excellent plasma resistance.

Abstract: A fluidic lens according to the present invention comprises: a first membrane and a second membrane which face each other; a first means for forming a magnetic field in the first membrane and a second means which exhibits a magnetic force with respect to an external magnetic field formed in the second membrane; a fluid chamber which forms a space between the first membrane and the second membrane and is filled with fluid; and a supplementary chamber connected to the fluid chamber, wherein the second means generates a magnetic force via the magnetic field generated by the first means, thereby causing attraction and repulsion between the first membrane and the second membrane to adjust the focal length of the lens.

Abstract: An apparatus for treating a substrate is disclosed. The apparatus for treating the substrate includes a housing having a treatment space inside the housing, a plate to support the substrate inside the housing, a heating member provided inside the plate to heat the substrate and including a plurality of heating zones, a temperature measuring member to measure a temperature of the substrate with respect to each of the plurality of heating zones of the heating member, and a control unit to control a temperature for the heating member in a dynamic section of a temperature change graph measured in the temperature measuring member. The control unit performs temperature control with respect to each of the plurality of heating zones of the heating member to uniformize the thickness of the thin film on the substrate.

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.

Abstract: An air-cooled heat exchanger is provided. A reinforcement beam is laterally attached to an upper surface of a guide housing which is formed to have a dome shape having an area gradually increasing in a downward direction from the stack to guide air discharged to the stack. In another aspect, an air-cooled heat exchanger may further include an enclosure surrounding a power transmission part configured to transmit a rotation force of a motor to the fan to rotate the fan.

Abstract: Provided is a full-body modeling method and apparatus based on new model predictive control (MPC) with a visuomotor system in which visual perception and full-body motion control are integrated. The full-body modeling method includes determining a partial observation value associated with a state of an object based on a point of sight of a character, estimating the state of the object using the determined partial observation value based on a partially observable Markov decision process (POMDP), controlling a state of the character based on the estimated state of the object, and visualizing a motion of the character.

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate, a first patch antenna, a second patch antenna, and a feed via. The second ceramic substrate is disposed to oppose the first ceramic substrate. The first patch antenna includes a seed layer, disposed on a surface of the first ceramic substrate, and a plating layer disposed on the seed layer. The second patch antenna disposed on the second ceramic substrate. The feed via includes a seed layer, formed along an internal wall of a via hole penetrating through the first ceramic substrate in a thickness direction, and a conductive material surrounded by the seed layer in the via hole. The seed layer of the first patch antenna and the seed layer of the feed via are connected to each other.

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.

Abstract: A color conversion film having: a substrate film; and a color conversion functional layer including a solid phase change material; and a backlight unit and a display apparatus including the color conversion film.

Abstract: Provided is a pharmaceutical combination comprising an antibody specific for CD19 and a natural killer cell, and a treatment method using the same. Such a pharmaceutical combination is capable of exhibiting synergistic therapeutic effects on a malignant tumor of B-cell origin such as non-Hodgkin's lymphoma, chronic lymphocytic leukemia, and/or acute lymphoblastic leukemia.

Abstract: A chip antenna comprises a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate a second patch, provided on the second substrate, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a bonding pad provided on a second surface of the first substrate. The first substrate comprises a dielectric substance and a magnetic substance.

Abstract: A memory device is described. Generally, the device includes a string of memory transistors, a source select transistor coupled to a first end of the string of memory transistor and a drain select transistor coupled to a second end of the string of memory transistor. Each memory transistor includes a gate electrode formed adjacent to a charge trapping layer and there is neither a source nor a drain junction between adjacent pairs of memory transistors or between the memory transistors and source select transistor or drain select transistor. In one embodiment, the memory transistors are spaced apart from adjacent memory transistors and the source select transistor and drain select transistor, such that channels are formed therebetween based on a gate fringing effect associated with the memory transistors. Other embodiments are also described.

Abstract: One aspect of the present invention discloses a license authentication method in a wireless access point (AP). The method comprises receiving a license authentication request including license information from a client; calculating a distance of the client from the wireless access point in response to the received license authentication request; based on the calculated distance, determining whether the client exists within a range of allowed positions for license authentication related to license location information for allowing authentication of a license included in the license information; and determining whether to authenticate in response to the license authentication request based on the determination result.

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.

Abstract: Disclosed herein are microbial consortia and compositions including microbes for use in agricultural or biodegradation applications. In some embodiments, soil, plants, and/or plant parts (such as seeds, seedlings, shoots, roots, leaves, fruit, stems, or branches) are contacted with a disclosed microbial consortia or composition including microbes. The microbial consortia or microbe-containing compositions may be applied to soil, plant, and/or plant parts alone or in combination with additional components (such as chitin, chitosan, glucosamine, amino acids, and/or liquid fertilizer). In additional embodiments, the disclosed microbial consortia or compositions including microbes are used in methods of degrading biological materials, such as chitin-containing biological materials.

Abstract: Disclosed herein are microbial consortia and compositions including microbes, for example, for use in agricultural or biodegradation applications. In some embodiments, soil, plants, and/or plant parts (such as seeds, seedlings, shoots, roots, leaves, fruit, stems, or branches) are contacted with a disclosed microbial consortia or composition including microbes. The microbial consortia or microbe-containing compositions may be applied to soil, plant, and/or plant parts alone or in combination with additional components (such as chitin, chitosan, glucosamine, amino acids, and/or liquid fertilizer). In additional embodiments, the disclosed microbial consortia or compositions including microbes are used in methods of degrading biological materials, such as chitin-containing biological materials.

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.

Abstract: A chip antenna module includes a first dielectric layer; a solder layer disposed on a first surface of the first dielectric layer; a patch antenna pattern disposed on a second surface of the first dielectric layer; a coupling pattern disposed on the second surface of the first dielectric layer, and spaced apart from the patch antenna pattern without overlapping the patch antenna pattern in a thickness direction; a first feed via extending through the first dielectric layer in the thickness direction so as not to overlap the patch antenna pattern and the coupling pattern in the thickness direction; a first feed pattern extending from a first end of the first feed to overlap at least a portion of the coupling pattern; and a second feed pattern extending from a second end of the first feed via to overlap at least a portion of the coupling pattern.