Patents by Inventor Sung yong An

Sung yong An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip antenna
    Patent number: 11223133
    Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: January 11, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Yeong Kim, Chin Mo Kim, Ji Hyung Jung, Sung Nam Cho, Sung Yong An
  • Chip antenna
    Patent number: 11223100
    Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.
    Type: Grant
    Filed: January 2, 2020
    Date of Patent: January 11, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Yeong Kim, Sung Nam Cho, Sung Yong An, Ji Hyung Jung, Chin Mo Kim
  • Touch sensor and sensor array
    Patent number: 11216129
    Abstract: A touch sensor including a sensor array including a first touch node and a second touch node adjacent to each other in at least one of a first direction or a second direction, the second direction perpendicular to the first direction, the first touch node and the second touch node electrically separated from each other, each of the first touch node and the second touch node including a driving electrode and a sensing electrode, and a controller configured to output a first driving signal having a first phase to the driving electrode of the first touch node and output a second driving signal having a second phase opposite to the first phase of the first driving signal to the driving electrode of the second touch node may be provided. The controller may be further configured to output the first driving signal and the second driving signal simultaneously.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: January 4, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yoon Kyung Choi, Ki Up Kim, Jin Bong Kim, Sung Yong Cho
  • Chip antenna
    Patent number: 11211689
    Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate, a first patch antenna, a second patch antenna, and a feed via. The second ceramic substrate is disposed to oppose the first ceramic substrate. The first patch antenna includes a seed layer, disposed on a surface of the first ceramic substrate, and a plating layer disposed on the seed layer. The second patch antenna disposed on the second ceramic substrate. The feed via includes a seed layer, formed along an internal wall of a via hole penetrating through the first ceramic substrate in a thickness direction, and a conductive material surrounded by the seed layer in the via hole. The seed layer of the first patch antenna and the seed layer of the feed via are connected to each other.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: December 28, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ji Hyung Jung, Sung Yong An
  • CHIP ANTENNA
    Publication number: 20210384633
    Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.
    Type: Application
    Filed: September 1, 2021
    Publication date: December 9, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Yeong KIM, Chin Mo KIM, Ji Hyung JUNG, Sung Nam CHO, Sung Yong AN
  • CHIP ANTENNA AND ANTENNA MODULE INCLUDING CHIP ANTENNA
    Publication number: 20210384609
    Abstract: A chip antenna is provided. The chip antenna includes a first dielectric layer; a second dielectric layer disposed on an upper surface of the first dielectric layer; a patch antenna pattern disposed in the second dielectric layer; first and second feed vias disposed to penetrate through at least one of the first and second dielectric layers, respectively and electrically connected to a corresponding feed point among different first and second feed points of the patch antenna pattern; and first and second filters disposed between the first and second dielectric layers, respectively and electrically connected to a corresponding feed via among the first and second feed vias.
    Type: Application
    Filed: September 16, 2020
    Publication date: December 9, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sung Yong AN, Joong Jin NAM, Jae Yeong KIM
  • Method of manufacturing a corrosion-resistant zirconium alloy for a nuclear fuel cladding tube
    Patent number: 11195628
    Abstract: A method of manufacturing a zirconium alloy for a nuclear fuel cladding tube includes melting a mixture of 0.5 wt % of Nb, 0.4 wt % of Mo, 0.1 to 0.15 wt % of Cu, 0.15 to 0.2 wt % of Fe, and a balance of zirconium to prepare a melted ingot; heat treating the melted ingot at 1,000 to 1,050° C. for 30 to 40 min. followed by quenching in water to prepare a heat-treated ingot; preheating the heat-treated ingot at 630 to 650° C. for 20 to 30 min. to prepare a preheated ingot followed by hot rolling the preheated ingot at a reduction ratio of 60 to 65% to provide a hot-rolled material; thrice performing vacuum annealing followed by cold-rolling; and vacuum annealing a third cold-rolled material in a final vacuum annealing at 510 to 520° C. for 7 to 9 hrs. to provide the zirconium alloy as a cold-rolled material.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: December 7, 2021
    Assignee: KEPCO NUCLEAR FUEL CO., LTD.
    Inventors: Min Young Choi, Yong Kyoon Mok, Yoon Ho Kim, Yeon Soo Na, Chung Yong Lee, Hun Jang, Tae Sik Jung, Dae Gyun Go, Sung Yong Lee, Seung Jae Lee, Jae Ik Kim
  • COLOR SHIFTING FILM, AND BACKLIGHT UNIT AND DISPLAY DEVICE COMPRISING SAME
    Publication number: 20210371676
    Abstract: The present specification relates to a color conversion film, and a backlight unit and a display device, including the same.
    Type: Application
    Filed: January 11, 2019
    Publication date: December 2, 2021
    Applicant: LG CHEM, LTD.
    Inventors: Ji Ho KIM, Dong Mok SHIN, Nari KIM, Hye Mi OH, Sung Yong MIN
  • CHIP ANTENNA MODULE
    Publication number: 20210376490
    Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.
    Type: Application
    Filed: August 11, 2021
    Publication date: December 2, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jae Yeong KIM, Sung Nam CHO, Ju Hyoung PARK, Jeong Ki RYOO, Kyu Bum HAN, Sung Yong AN
  • CONNECTOR
    Publication number: 20210364112
    Abstract: A connector for connecting two fluid-conducting elements, in particular for connecting two motor vehicle pipelines, with a female plug-in part and a male plug-in part that can be plugged into the female plug-in part. The male plug-in part can be fixed on the female plug-in part via at least one fixing element. At least one indicator element is provided, which indicates the properly or completely fixed state of the male plug-in part which has been reached via the fixing element. When the male plug-in part is inserted into the female plug-in part, the indicator element is displaced outward in the radial direction. A radial outer position of the indicator element shows the properly fixed state of the male plug-in part on the female plug-in part.
    Type: Application
    Filed: May 19, 2021
    Publication date: November 25, 2021
    Inventors: Iris BARTHEL, Kay BUBE, Reiner ROHDE, Harald KNOBLOCH, Seong-hwa CHOO, Jeong-ho LIM, Dong-hyeok LEE, Sung-yong EOM
  • VERTICAL POLARIZED ANTENNA AND TERMINAL DEVICE
    Publication number: 20210367345
    Abstract: The present disclosure provides technology that proposes an ultra-high frequency band (mmWave band) vertical polarization antenna having a new structure applicable to a slim planar structure (e.g., a terminal).
    Type: Application
    Filed: January 16, 2019
    Publication date: November 25, 2021
    Inventors: Hee Chang SEONG, Joon Young SHIN, Sung Yong KANG, Won Bin HONG, Jun Ho PARK
  • Method for batch casting high-fluidity high-performance concrete and low-fluidity high-performance concrete
    Patent number: 11168449
    Abstract: A method of batch-casting high-fluidity high performance concrete and low-fluidity high performance concrete, wherein the method is capable of batch-casting high-fluidity high performance concrete for forming a girder portion of a bridge and low-fluidity high performance concrete for forming a deck plate portion of the bridge by using a concrete casting apparatus. Accordingly, the construction cost can be reduced and the construction period can be shortened. In addition, because a cold joint does not occur, durability can be improved, and thus the life of the bridge can be increased.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: November 9, 2021
    Assignee: KOREA INSTITUTE OF CIVIL ENGINEERING AND BUILDING TECHNOLOGY
    Inventors: Kyung Taek Koh, Gum Sung Ryu, Gi Hong An, Byung Suk Kim, Sung Yong Park
  • Chip antenna and manufacturing method thereof
    Patent number: 11165156
    Abstract: A chip antenna includes: a hexahedral-shaped body portion having a permittivity, and including a first surface and a second surface opposite to the first surface; a hexahedral-shaped radiation portion coupled to the first surface of the body portion; and a hexahedral-shaped ground portion coupled to the second surface of the body portion, wherein a width of each of the radiation portion and the ground portion is in a range of 100 ?m to 500 ?m.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: November 2, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Yeong Kim, Sung Yong An
  • Chip antenna module
    Patent number: 11158928
    Abstract: A chip antenna module includes a first dielectric layer; a solder layer disposed on a first surface of the first dielectric layer; a patch antenna pattern disposed on a second surface of the first dielectric layer; a coupling pattern disposed on the second surface of the first dielectric layer, and spaced apart from the patch antenna pattern without overlapping the patch antenna pattern in a thickness direction; a first feed via extending through the first dielectric layer in the thickness direction so as not to overlap the patch antenna pattern and the coupling pattern in the thickness direction; a first feed pattern extending from a first end of the first feed to overlap at least a portion of the coupling pattern; and a second feed pattern extending from a second end of the first feed via to overlap at least a portion of the coupling pattern.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: October 26, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ju Hyoung Park, Myeong Woo Han, Jae Yeong Kim, Young Sik Hur, Sung Yong An, Dae Ki Lim
  • Method for manufacturing thermoplastic polymer particles
    Patent number: 11149120
    Abstract: Provided is a method for manufacturing thermoplastic polymer particles, the method comprising the steps of: supplying a thermoplastic polymer resin to an extruder and extruding the same; supplying the extruded thermoplastic polymer resin and air to a nozzle, bringing the thermoplastic polymer resin into contact with the air to granulate the thermoplastic polymer resin, and then discharging the granulated thermoplastic polymer resin; and supplying discharged thermoplastic polymer particles to a cooling unit to cool the thermoplastic polymer particles, and then collecting the cooled thermoplastic polymer particles.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: October 19, 2021
    Inventors: Hee-Jung Lee, Sung Yong Kang, Kyoung Min Kang, Min Gyung Kim, Chang-Young Park, Jae Ho Lim, Jun Ho Choi, Jae Han Song, Yu Jin Go
  • Colour conversion film, and back light unit and display device comprising same
    Patent number: 11143909
    Abstract: A color conversion film having: a substrate film, a color conversion layer provided on the substrate film and a phase transformation adhesive layer including an adhesive resin matrix and a phase change material, and a backlight unit and a display apparatus including the color conversion film.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: October 12, 2021
    Assignee: LG CHEM, LTD.
    Inventors: Sung Yong Min, Dong Mok Shin, Nari Kim, Ji Ho Kim, Hye Mi Oh
  • Stiffener and probe card including the same
    Patent number: 11137442
    Abstract: A stiffener of a probe card includes: a body plate arranged between a test head and a printed circuit board (PCB) of the probe card, wherein the test head is configured to apply a test signal to an object, and the PCB is configured to receive the test signal; a plurality of ribs radially extending from the body plate; an inner rim configured to surround the body plate to connect middle portions of the ribs with each other; and a plurality of contact members arranged on upper surfaces of at least two ribs among the ribs, and configured to make contact with the test head.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: October 5, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sang-Ik Lee, Sung-Yong Park
  • FULL-BODY MODELING METHOD AND APPARATUS BASED ON MODEL PREDICTIVE CONTROL WITH VISUOMOTOR SYSTEM
    Publication number: 20210304476
    Abstract: Provided is a full-body modeling method and apparatus based on new model predictive control (MPC) with a visuomotor system in which visual perception and full-body motion control are integrated. The full-body modeling method includes determining a partial observation value associated with a state of an object based on a point of sight of a character, estimating the state of the object using the determined partial observation value based on a partially observable Markov decision process (POMDP), controlling a state of the character based on the estimated state of the object, and visualizing a motion of the character.
    Type: Application
    Filed: July 28, 2020
    Publication date: September 30, 2021
    Inventors: Junyong Noh, Haegwang Eom, Daseong Han, Sung Yong Shin
  • Tablet form of cosmetic composition obtained by direct tableting without molding plate and method for preparing same
    Patent number: 11123268
    Abstract: The present disclosure relates to a tablet-form cosmetic composition obtained by mixing a powder blend containing makeup powder and a viscosity modifier with an aqueous dispersion containing water, an alcohol, a polymer for lubricant and a polysaccharide for binder, granulating the resultant mixture, and shaping the resultant granules with a tablet press, and a method for preparing the same. According to the present disclosure, there is provided a tablet-form cosmetic composition obtained by direct tablet pressing without using a shaping pan. The tablet-form cosmetic composition shows significantly improved aesthetic beauty and portability, while maintaining a cosmetic effect of the conventional powder- or cake-type powder cosmetic composition.
    Type: Grant
    Filed: February 24, 2017
    Date of Patent: September 21, 2021
    Assignee: COSMAX, INC.
    Inventors: Sung Ho Kwon, Sung Yong Kim, Eun Ju Seo, Myeong Sam Park
  • COSMETIC PRODUCT INCLUDING COSMETIC CONTAINER USING SPECIFIC RUBBER
    Publication number: 20210282530
    Abstract: Disclosed is a cosmetic product including: a cosmetic composition; and a cosmetic container in which the cosmetic composition is filled, wherein the cosmetic container includes nitrile butadiene rubber and has pores of which the average size is about 0.2 mm to about 1 mm, and the cosmetic composition has a viscosity of about 2,000 cps to about 10,000 cps.
    Type: Application
    Filed: July 24, 2017
    Publication date: September 16, 2021
    Applicants: COSMAX, INC., COSMAX, INC.
    Inventors: Na Rae JO, Sung Yong KIM, Kweon Jong YOO, Myeong Sam PARK, Chun Ho PARK, Sung Mi PARK