Abstract: The present invention relates to a pharmaceutical composition containing, as an active ingredient, niclosamide or pharmaceutically acceptable salts thereof, for treating or preventing disease related to Axin-GSK3 interaction, such as familial adenomatosis polyposis (FAP). According to the present invention, familial adenomatosis polyposis (FAP) which causes pain due to lack of specific treatment methods, can be effectively treated using niclosamide, which is a safe drug approved by the FDA.

Abstract: An antenna module includes a substrate having a first surface including a ground region and a feeder region; chip antennas mounted on the first surface of the substrate; and at least one patch antenna disposed inside of the substrate or at least partially disposed on a second surface of the substrate. The chip antennas include a body portion, a ground portion bonded to a first surface of the body portion, and a radiation portion bonded to a second surface of a body portion. The ground portion of each chip antenna is mounted on the ground region and the radiation portion of each chip antenna is mounted on the feeder region.

Abstract: An antenna module includes: a board having a first surface including a ground region and a feed region; and chip antennas mounted on the first surface, each of the chip antennas including a first antenna and a second antenna. The first antenna and the second antenna each include a ground portion bonded to the ground region, and a radiation portion bonded to the feed region. A length of a radiating surface of the first antenna is greater than a mounting height of the first antenna, and a mounting height of the second antenna is greater than a length of a radiating surface of the second antenna. A horizontal spacing distance between the radiation portion of the first antenna and the ground region is greater than a horizontal spacing distance between the radiation portion of the second antenna and the ground region.

Abstract: The present specification relates to a color conversion film comprising a color conversion functional layer including a microcapsule phase change material, and a backlight unit and a display apparatus including the same.

Abstract: A power conversion device includes a rectifying circuit that full-wave rectifies an input AC power, a first conversion circuit that includes a passive element, a first switching element, and a second switching element and digitally converts a rectified power while compensating a power factor of the rectified power through at least one of the passive element, the first switching element, and the second switching element, a second conversion circuit that converts the digitally-converted power into a power with a specified magnitude and output the power with the specified magnitude, a device circuit that consumes an output power of the second conversion circuit, a first control circuit that monitors current consumption of the device circuit and controls an amount of output current of the second conversion circuit based on the current consumption of the device circuit, and a second control circuit that controls a power factor compensation degree of the first conversion circuit based on the current consumption, wh

Abstract: A chip antenna includes a radiation portion having a block shape and a first surface and a second surface opposing each other, and configured to receive and radiate a feed signal as an electromagnetic wave; a first block made of a dielectric material and coupled to the first surface of the radiation portion; a second block made of a dielectric material and coupled to the second surface of the radiation portion; a ground portion having a block shape and coupled to the first block, and configured to reflect the electromagnetic wave radiated by the radiation portion back toward the radiation portion; and a director having a block shape and coupled to the second block, wherein an overall width of the ground portion, the first block, and the radiation portion is 2 mm or less, and the first block has a dielectric constant of 3.5 or more to 25 or less.

Abstract: A high-frequency heating method for a hot stamping process includes: a first heating step of high-frequency heating a steel sheet, which has an aluminum (Al) coating layer formed on an iron (Fe)-based base material, to a first target temperature at a first heating rate; a second heating step of melting the coating layer by high-frequency heating the steel sheet, which has passed through the first heating step, to a second target temperature at a second heating rate, wherein the second heating rate is lower than the first heating rate; and a third heating step of high-frequency heating the steel sheet, which has passed through the second heating step, to a third target temperature at a third heating rate, wherein the third heating rate is lower than the second heating rate. A compound is formed by a reaction between a material of the coating layer and a material of the base material in the second heating step.

Abstract: A chip antenna module includes a first dielectric layer; a solder layer disposed on a first surface of the first dielectric layer; a patch antenna pattern disposed on a second surface of the first dielectric layer; a coupling pattern disposed on the second surface of the first dielectric layer, and spaced apart from the patch antenna pattern without overlapping the patch antenna pattern in a thickness direction; a first feed via extending through the first dielectric layer in the thickness direction so as not to overlap the patch antenna pattern and the coupling pattern in the thickness direction; a first feed pattern extending from a first end of the first feed to overlap at least a portion of the coupling pattern; and a second feed pattern extending from a second end of the first feed via to overlap at least a portion of the coupling pattern.

Abstract: A chip antenna module array includes a first chip antenna module including: a first solder layer disposed below a first dielectric layer; a first feed via disposed in the first dielectric layer; a first patch antenna pattern disposed above the first dielectric layer and having a first resonant frequency; and a first coupling pattern spaced apart from the first patch antenna pattern, and not vertically overlapping the first patch antenna pattern. The chip antenna module array includes a second chip antenna module including: a second solder layer disposed below a second dielectric layer; a second feed via disposed in the second dielectric layer; a second patch antenna pattern disposed above the second dielectric layer and having a second resonant frequency; and a second coupling pattern disposed above and vertically overlapping the second patch antenna pattern. The first and second chip antenna modules are disposed spaced apart on a connection member.

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.

Abstract: Provided are thermoplastic polymer particles having an aspect ratio of 1.00 or more and less than 1.05, and a roundness of 0.95 to 1.00. The thermoplastic polymer particles are formed from a thermoplastic polymer resin in a continuous matrix phase. The thermoplastic polymer particles show a peak cold crystallization temperature (Tcc) at a temperature between a glass transition temperature (Tg) and the melting point (Tm) in a differential scanning calorimetry (DSC) curve which is derived from temperature rise analysis at 10° C./min by differential scanning calorimetry.

Abstract: Provided is a display device. The display device includes a display to display an image, a processor to control the display to display a predetermined image, a power supplier to generate a direct current (DC) power by receiving an alternating current (AC) power, and supply the generated DC power to each of the display and the processor, and a sensor to output a sensing signal corresponding to whether the AC power is input, and the display stops an image display operation according to the sensing signal.

Abstract: A chip antenna includes a first dielectric substrate, a second dielectric substrate spaced apart from and opposing the first dielectric substrate, a first patch disposed on the first dielectric substrate, a second patch disposed on the second dielectric substrate, and a mounting pad and a feed pad disposed on a mounting surface of the first dielectric substrate. The first dielectric substrate, mounted on a mounting substrate through the mounting pad, is electrically connected to the mounting substrate through the feed pad. One of the first dielectric substrate and the second dielectric substrate is formed of ceramic and another is formed of polytetrafluoroethylene (PTFE).

Abstract: An antenna module includes: a board having a first surface including a ground region and a feed region; and chip antennas mounted on the first surface, each of the chip antennas including a first antenna and a second antenna. The first antenna and the second antenna each include a ground portion bonded to the ground region, and a radiation portion bonded to the feed region. A length of a radiating surface of the first antenna is greater than a mounting height of the first antenna, and a mounting height of the second antenna is greater than a length of a radiating surface of the second antenna. A horizontal spacing distance between the radiation portion of the first antenna and the ground region is greater than a horizontal spacing distance between the radiation portion of the second antenna and the ground region.

Abstract: According to one embodiment of the present disclosure, an optical filter which makes light pass therethrough includes a first layer configured to polarize the light; a second layer disposed directly on a first surface of the first layer and to make only light with a first wavelength band pass therethrough; and a color conversion layer disposed on the first layer, to receive the light, and to convert the light with the first wavelength band into light with a second wavelength band.

Abstract: An antenna module includes a substrate having a first surface including a ground region and a feeder region; chip antennas mounted on the first surface of the substrate; and at least one patch antenna disposed inside of the substrate or at least partially disposed on a second surface of the substrate. The chip antennas include a body portion, a ground portion bonded to a first surface of the body portion, and a radiation portion bonded to a second surface of a body portion. The ground portion of each chip antenna is mounted on the ground region and the radiation portion of each chip antenna is mounted on the feeder region.

Abstract: An air-cooled heat exchanger is provided. A reinforcement beam is laterally attached to an upper surface of a guide housing which is formed to have a dome shape having an area gradually increasing in a downward direction from the stack to guide air discharged to the stack. In another aspect, an air-cooled heat exchanger may further include an enclosure surrounding a power transmission part configured to transmit a rotation force of a motor to the fan to rotate the fan.

Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.

Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to oppose the first ceramic substrate, a first patch, disposed on the first ceramic substrate, configured to operate as a feed patch, a second patch, disposed on the second ceramic substrate, configured to operate as a radiation patch, an insertion member disposed between the first ceramic substrate and the second ceramic substrate, and a shielding layer disposed on a side surface of the insertion member.