Patents by Inventor Sung yong An
Sung yong An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11238135Abstract: One aspect of the present invention discloses a license authentication method in a wireless access point (AP). The method comprises receiving a license authentication request including license information from a client; calculating a distance of the client from the wireless access point in response to the received license authentication request; based on the calculated distance, determining whether the client exists within a range of allowed positions for license authentication related to license location information for allowing authentication of a license included in the license information; and determining whether to authenticate in response to the license authentication request based on the determination result.Type: GrantFiled: January 4, 2019Date of Patent: February 1, 2022Assignee: N3N CO., LTD.Inventors: Sung Yong Kim, Hye Yong Oh, Dae Hee Kim
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Publication number: 20220029274Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.Type: ApplicationFiled: October 12, 2021Publication date: January 27, 2022Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Sung Nam CHO, Sung Yong AN, Ji Hyung JUNG, Chin Mo KIM
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Patent number: 11233336Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on one surface of the first ceramic substrate to operate as a feeding patch, a second patch disposed on the second ceramic substrate to operate as a radiation patch, at least one feed via penetrating through the first ceramic substrate in a thickness direction to provide a feed signal to the first patch, and a bonding pad disposed on a second surface of the first ceramic substrate opposite the first surface. A thickness of the first ceramic substrate is greater than a thickness of the second ceramic substrate.Type: GrantFiled: October 31, 2019Date of Patent: January 25, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ju Hyoung Park, Kyu Bum Han, Jae Yeong Kim, Jeong Ki Ryoo, Sung Nam Cho, Sung Yong An
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Patent number: 11230505Abstract: Disclosed herein are microbial consortia and compositions including microbes, for example, for use in agricultural or biodegradation applications. In some embodiments, soil, plants, and/or plant parts (such as seeds, seedlings, shoots, roots, leaves, fruit, stems, or branches) are contacted with a disclosed microbial consortia or composition including microbes. The microbial consortia or microbe-containing compositions may be applied to soil, plant, and/or plant parts alone or in combination with additional components (such as chitin, chitosan, glucosamine, amino acids, and/or liquid fertilizer). In additional embodiments, the disclosed microbial consortia or compositions including microbes are used in methods of degrading biological materials, such as chitin-containing biological materials.Type: GrantFiled: June 21, 2019Date of Patent: January 25, 2022Assignee: AMVAC Chemical CorporationInventors: Sung-Yong H. Yoon, Kathleen Swords, D. Ry Wagner, Selvasundaram Rajagopal
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Patent number: 11230506Abstract: Disclosed herein are microbial consortia and compositions including microbes for use in agricultural or biodegradation applications. In some embodiments, soil, plants, and/or plant parts (such as seeds, seedlings, shoots, roots, leaves, fruit, stems, or branches) are contacted with a disclosed microbial consortia or composition including microbes. The microbial consortia or microbe-containing compositions may be applied to soil, plant, and/or plant parts alone or in combination with additional components (such as chitin, chitosan, glucosamine, amino acids, and/or liquid fertilizer). In additional embodiments, the disclosed microbial consortia or compositions including microbes are used in methods of degrading biological materials, such as chitin-containing biological materials.Type: GrantFiled: June 24, 2019Date of Patent: January 25, 2022Assignee: AMVAC Chemical CorporationInventors: Sung-Yong H. Yoon, Kathleen Swords, D. Ry Wagner, Selvasundaram Rajagopal
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Publication number: 20220021103Abstract: A chip antenna module includes a first dielectric layer; a solder layer disposed on a first surface of the first dielectric layer; a patch antenna pattern disposed on a second surface of the first dielectric layer; a coupling pattern disposed on the second surface of the first dielectric layer, and spaced apart from the patch antenna pattern without overlapping the patch antenna pattern in a thickness direction; a first feed via extending through the first dielectric layer in the thickness direction so as not to overlap the patch antenna pattern and the coupling pattern in the thickness direction; a first feed pattern extending from a first end of the first feed to overlap at least a portion of the coupling pattern; and a second feed pattern extending from a second end of the first feed via to overlap at least a portion of the coupling pattern.Type: ApplicationFiled: September 29, 2021Publication date: January 20, 2022Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Ju Hyoung PARK, Myeong Woo HAN, Jae Yeong KIM, Young Sik HUR, Sung Yong AN, Dae Ki LIM
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Patent number: 11223133Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.Type: GrantFiled: February 27, 2020Date of Patent: January 11, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Yeong Kim, Chin Mo Kim, Ji Hyung Jung, Sung Nam Cho, Sung Yong An
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Patent number: 11223100Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate disposed to face the first ceramic substrate, a first patch disposed on the first ceramic substrate to operate as a feed patch, and a second patch disposed on the second ceramic substrate to operate as a radiation patch. One or both of the first ceramic substrate and the second ceramic substrate include a groove, and one or both of the first patch and the second patch is disposed in the groove of the respective first ceramic substrate and second ceramic substrate and protrudes from the groove.Type: GrantFiled: January 2, 2020Date of Patent: January 11, 2022Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong Kim, Sung Nam Cho, Sung Yong An, Ji Hyung Jung, Chin Mo Kim
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Patent number: 11216129Abstract: A touch sensor including a sensor array including a first touch node and a second touch node adjacent to each other in at least one of a first direction or a second direction, the second direction perpendicular to the first direction, the first touch node and the second touch node electrically separated from each other, each of the first touch node and the second touch node including a driving electrode and a sensing electrode, and a controller configured to output a first driving signal having a first phase to the driving electrode of the first touch node and output a second driving signal having a second phase opposite to the first phase of the first driving signal to the driving electrode of the second touch node may be provided. The controller may be further configured to output the first driving signal and the second driving signal simultaneously.Type: GrantFiled: January 9, 2020Date of Patent: January 4, 2022Assignee: Samsung Electronics Co., Ltd.Inventors: Yoon Kyung Choi, Ki Up Kim, Jin Bong Kim, Sung Yong Cho
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Patent number: 11211689Abstract: A chip antenna includes a first ceramic substrate, a second ceramic substrate, a first patch antenna, a second patch antenna, and a feed via. The second ceramic substrate is disposed to oppose the first ceramic substrate. The first patch antenna includes a seed layer, disposed on a surface of the first ceramic substrate, and a plating layer disposed on the seed layer. The second patch antenna disposed on the second ceramic substrate. The feed via includes a seed layer, formed along an internal wall of a via hole penetrating through the first ceramic substrate in a thickness direction, and a conductive material surrounded by the seed layer in the via hole. The seed layer of the first patch antenna and the seed layer of the feed via are connected to each other.Type: GrantFiled: January 9, 2020Date of Patent: December 28, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ji Hyung Jung, Sung Yong An
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Publication number: 20210384633Abstract: A chip antenna includes a first substrate, a second substrate overlapping the first substrate, a first patch, provided on a first surface of the first substrate, operating as a feed patch, a second patch, provided on the second substrate, operating as a radiation patch, at least one feed via penetrating through the first substrate in a thickness direction and configured to provide a feed signal to the first patch, and a ground pad provided on the other surface of the first substrate. The first substrate comprises a ceramic sintered material. The ceramic sintered material comprises an Mg2SiO4 phase, an MgAl2O4 phase, and a CaTiO3 phase, and a content of the CaTiO3 phase in the ceramic sintered material ranges from 5.1 mol % to 15.1 mol %.Type: ApplicationFiled: September 1, 2021Publication date: December 9, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Chin Mo KIM, Ji Hyung JUNG, Sung Nam CHO, Sung Yong AN
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Publication number: 20210384609Abstract: A chip antenna is provided. The chip antenna includes a first dielectric layer; a second dielectric layer disposed on an upper surface of the first dielectric layer; a patch antenna pattern disposed in the second dielectric layer; first and second feed vias disposed to penetrate through at least one of the first and second dielectric layers, respectively and electrically connected to a corresponding feed point among different first and second feed points of the patch antenna pattern; and first and second filters disposed between the first and second dielectric layers, respectively and electrically connected to a corresponding feed via among the first and second feed vias.Type: ApplicationFiled: September 16, 2020Publication date: December 9, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Sung Yong AN, Joong Jin NAM, Jae Yeong KIM
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Patent number: 11195628Abstract: A method of manufacturing a zirconium alloy for a nuclear fuel cladding tube includes melting a mixture of 0.5 wt % of Nb, 0.4 wt % of Mo, 0.1 to 0.15 wt % of Cu, 0.15 to 0.2 wt % of Fe, and a balance of zirconium to prepare a melted ingot; heat treating the melted ingot at 1,000 to 1,050° C. for 30 to 40 min. followed by quenching in water to prepare a heat-treated ingot; preheating the heat-treated ingot at 630 to 650° C. for 20 to 30 min. to prepare a preheated ingot followed by hot rolling the preheated ingot at a reduction ratio of 60 to 65% to provide a hot-rolled material; thrice performing vacuum annealing followed by cold-rolling; and vacuum annealing a third cold-rolled material in a final vacuum annealing at 510 to 520° C. for 7 to 9 hrs. to provide the zirconium alloy as a cold-rolled material.Type: GrantFiled: November 8, 2019Date of Patent: December 7, 2021Assignee: KEPCO NUCLEAR FUEL CO., LTD.Inventors: Min Young Choi, Yong Kyoon Mok, Yoon Ho Kim, Yeon Soo Na, Chung Yong Lee, Hun Jang, Tae Sik Jung, Dae Gyun Go, Sung Yong Lee, Seung Jae Lee, Jae Ik Kim
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Publication number: 20210371676Abstract: The present specification relates to a color conversion film, and a backlight unit and a display device, including the same.Type: ApplicationFiled: January 11, 2019Publication date: December 2, 2021Applicant: LG CHEM, LTD.Inventors: Ji Ho KIM, Dong Mok SHIN, Nari KIM, Hye Mi OH, Sung Yong MIN
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Publication number: 20210376490Abstract: A chip antenna module includes a substrate, a plurality of chip antennas disposed on a first surface of the substrate, and an electronic element mounted on a second surface of the substrate, wherein each of the plurality of chip antennas includes a first ceramic substrate mounted on the first surface of the substrate, a second ceramic substrate opposing the first ceramic substrate, a first patch disposed on the first ceramic substrate, and a second patch disposed on the second ceramic substrate, and the first ceramic substrate and the second ceramic substrate are spaced apart from each other.Type: ApplicationFiled: August 11, 2021Publication date: December 2, 2021Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Jae Yeong KIM, Sung Nam CHO, Ju Hyoung PARK, Jeong Ki RYOO, Kyu Bum HAN, Sung Yong AN
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Publication number: 20210364112Abstract: A connector for connecting two fluid-conducting elements, in particular for connecting two motor vehicle pipelines, with a female plug-in part and a male plug-in part that can be plugged into the female plug-in part. The male plug-in part can be fixed on the female plug-in part via at least one fixing element. At least one indicator element is provided, which indicates the properly or completely fixed state of the male plug-in part which has been reached via the fixing element. When the male plug-in part is inserted into the female plug-in part, the indicator element is displaced outward in the radial direction. A radial outer position of the indicator element shows the properly fixed state of the male plug-in part on the female plug-in part.Type: ApplicationFiled: May 19, 2021Publication date: November 25, 2021Inventors: Iris BARTHEL, Kay BUBE, Reiner ROHDE, Harald KNOBLOCH, Seong-hwa CHOO, Jeong-ho LIM, Dong-hyeok LEE, Sung-yong EOM
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Publication number: 20210367345Abstract: The present disclosure provides technology that proposes an ultra-high frequency band (mmWave band) vertical polarization antenna having a new structure applicable to a slim planar structure (e.g., a terminal).Type: ApplicationFiled: January 16, 2019Publication date: November 25, 2021Inventors: Hee Chang SEONG, Joon Young SHIN, Sung Yong KANG, Won Bin HONG, Jun Ho PARK
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Patent number: 11168449Abstract: A method of batch-casting high-fluidity high performance concrete and low-fluidity high performance concrete, wherein the method is capable of batch-casting high-fluidity high performance concrete for forming a girder portion of a bridge and low-fluidity high performance concrete for forming a deck plate portion of the bridge by using a concrete casting apparatus. Accordingly, the construction cost can be reduced and the construction period can be shortened. In addition, because a cold joint does not occur, durability can be improved, and thus the life of the bridge can be increased.Type: GrantFiled: December 11, 2017Date of Patent: November 9, 2021Assignee: KOREA INSTITUTE OF CIVIL ENGINEERING AND BUILDING TECHNOLOGYInventors: Kyung Taek Koh, Gum Sung Ryu, Gi Hong An, Byung Suk Kim, Sung Yong Park
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Patent number: 11165156Abstract: A chip antenna includes: a hexahedral-shaped body portion having a permittivity, and including a first surface and a second surface opposite to the first surface; a hexahedral-shaped radiation portion coupled to the first surface of the body portion; and a hexahedral-shaped ground portion coupled to the second surface of the body portion, wherein a width of each of the radiation portion and the ground portion is in a range of 100 ?m to 500 ?m.Type: GrantFiled: March 25, 2020Date of Patent: November 2, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Yeong Kim, Sung Yong An
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Patent number: 11158928Abstract: A chip antenna module includes a first dielectric layer; a solder layer disposed on a first surface of the first dielectric layer; a patch antenna pattern disposed on a second surface of the first dielectric layer; a coupling pattern disposed on the second surface of the first dielectric layer, and spaced apart from the patch antenna pattern without overlapping the patch antenna pattern in a thickness direction; a first feed via extending through the first dielectric layer in the thickness direction so as not to overlap the patch antenna pattern and the coupling pattern in the thickness direction; a first feed pattern extending from a first end of the first feed to overlap at least a portion of the coupling pattern; and a second feed pattern extending from a second end of the first feed via to overlap at least a portion of the coupling pattern.Type: GrantFiled: February 27, 2020Date of Patent: October 26, 2021Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Ju Hyoung Park, Myeong Woo Han, Jae Yeong Kim, Young Sik Hur, Sung Yong An, Dae Ki Lim