Abstract: A chip antenna module includes: a solder layer disposed on a lower surface of the first dielectric layer; a first patch antenna pattern disposed on upper surface of the first dielectric layer and having a through-hole; a second patch antenna pattern spaced apart from an upper surface of the first patch antenna pattern and having an area less than an area of the first patch antenna pattern; a first feed via extending through the first dielectric layer and electrically connected to the first patch antenna pattern; a second feed via extending through the first dielectric layer and the through-hole, and electrically connected to the second patch antenna pattern; and shielding vias extending through the first dielectric layer, electrically connected to the first patch antenna pattern, and at least partially surrounding the second feed via.

Abstract: An embodiment of the disclosure provides a vision recovery training device, which includes a housing formed to be worn on a face around the eyes, a pair of rotation modules mounted to an inside of the housing, and a lens provided in each rotation module, at least one of the rotation modules including: a rotation disc; a magnetic body inserted in the rotation disc; and a sensor module provided in the housing at a radial position corresponding to the magnetic body.

Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.

Abstract: A chip antenna module array includes a first chip antenna module including: a first solder layer disposed below a first dielectric layer; a first feed via disposed in the first dielectric layer; a first patch antenna pattern disposed above the first dielectric layer and having a first resonant frequency; and a first coupling pattern spaced apart from the first patch antenna pattern, and not vertically overlapping the first patch antenna pattern. The chip antenna module array includes a second chip antenna module including: a second solder layer disposed below a second dielectric layer; a second feed via disposed in the second dielectric layer; a second patch antenna pattern disposed above the second dielectric layer and having a second resonant frequency; and a second coupling pattern disposed above and vertically overlapping the second patch antenna pattern. The first and second chip antenna modules are disposed spaced apart on a connection member.

Abstract: An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an integrated circuit (IC) disposed on a first surface of the connection member and electrically connected to the at least one wiring layer; and a plurality of antenna cells each disposed on a second surface of the connection member. Each of the plurality of antenna cells includes an antenna member configured to transmit or receive a radio frequency (RF) signal, a feed via having one end electrically connected to the antenna member and the other end electrically connected to a corresponding wire of the at least one wiring layer, a dielectric layer surrounding side surfaces of the feed via and having a height greater than that of the at least one insulating layer, and a plating member surrounding side surfaces of the dielectric layer.

Abstract: Provided is an integrated steep slope collapse simulation system including: a base; a tower provided at one end of the base; a soil tank structure having one side being connected to the tower so that the soil tank structure is inclined, the soil tank structure being filled with soil, and the soil being rammed; a work platform provided with a working stand moving along the base and moving up and down; a soil moving device supplying soil to an interior of the soil tank structure; an artificial rainfall device provided above the soil tank structure, the artificial rainfall device injecting water downward toward the soil rammed inside the soil tank structure; and an underground water reproduction device injecting water upward through the bottom surface of the soil tank structure from the underside of the soil rammed in the soil tank structure. There is an effect that it is possible to accurately analyze an actual behavior of soil in the natural environment.

Abstract: A heat treatment method of a substrate includes setting a temperature profile over the course of stabilization to a target temperature after the substrate is loaded as a reference, and controlling a temperature of the hot plate supporting the substrate on the basis of the reference.

Abstract: Disclosed is a washing machine capable of improving the efficiency of washing and product quality by improving a pivoting structure of a door assembly having a door and an auxiliary washing unit forming an auxiliary washing space. Also, the door and the auxiliary washing unit may be coupled by a locking part so that a user can open and close the door assembly conveniently when manual washing is not needed. When manual washing is needed, the user may release a locked state of the locking part to move the door and the auxiliary washing unit separately.

Abstract: A digital pixel sensor for correcting and reducing a mismatch between a pixel and an analog digital converter provided. The digital pixel sensor includes a pixel array including a plurality of pixels; and a bank disposed on the pixel array. The bank includes: a plurality of comparators disposed on the plurality of pixels and configured to compare each of a plurality of pixel signals output from the plurality of pixels with a reference signal to output a plurality of comparison result signals; and a counter connected to the plurality of comparators, and configured to receive the plurality of comparison result signals and latch count code based on the plurality of comparison result signals.

Abstract: According to an embodiment of the present disclosure, a recipe providing system may include a user cooking apparatus that cooks a product to be cooked according to a recipe, a user terminal that provides identification information on the product to be cooked and information on the user cooking apparatus, and a recipe providing device that generates a recipe based on performance of the user cooking apparatus and identification information on the product to be cooked provided from the user terminal, and provides the generated recipe to the user cooking apparatus and the user terminal.

Abstract: The present specification relates to a color conversion film comprising a color conversion functional layer including a phase change material, and a backlight unit and a display apparatus including the color conversion film.

Abstract: A multifunctional ship for the collection and recycling of ocean debris and the system thereof may include a hull; a detection device provided on the hull to detect ocean debris floating on the sea or deposited on the seabed; a collection device installed on the hull to collect the ocean debris detected by the detection device; a sorting device installed on the hull to sort the ocean debris collected by the collection device; a compressing device installed on the hull to compress the sorted ocean debris to compress and remove moisture and reduce the volume; a waste plastic recycling device installed on the hull to produce recycled oil by thermally decomposing the waste plastic compressed in the compressing device; a storage tank installed at the bottom of the hull to store the recycled oil produced; and a purifier for purifying wastewater generated in the process of producing recycled oil.

Abstract: A memory device is described. Generally, the device includes a string of memory transistors, a source select transistor coupled to a first end of the string of memory transistor and a drain select transistor coupled to a second end of the string of memory transistor. Each memory transistor includes a gate electrode formed adjacent to a charge trapping layer and there is neither a source nor a drain junction between adjacent pairs of memory transistors or between the memory transistors and source select transistor or drain select transistor. In one embodiment, the memory transistors are spaced apart from adjacent memory transistors and the source select transistor and drain select transistor, such that channels are formed therebetween based on a gate fringing effect associated with the memory transistors. Other embodiments are also described.

Abstract: The present invention may provide an oil in water (O/W) cosmetic composition having water resistance and ease of facial cleansing, using an A-B-A type triblock copolymer which is included in the cosmetic, and thus may adjust the surfactant power. Further, it is possible to provide a method for imparting water resistance and ease of facial cleansing, using the A-B-A type triblock copolymer.

Abstract: According to an embodiment of the present disclosure, a recipe providing system may include a user cooking apparatus that generates identification information on a product to be cooked and cook the product to be cooked according to a recipe, and a recipe providing device that generates the recipe based on performance of the user cooking apparatus and the identification information on the product to be cooked.

Abstract: Embodiments relate to a touch panel and a method of operating the touch panel. The touch panel includes first electrodes and second electrodes separated from and intersecting the first electrodes. The first electrodes are applied with a touch driving pulse during a first sensing mode and a second sensing mode. The second electrodes sense a first touch sense signal responsive to the touch driving pulse in the first sensing mode. A subset of the second electrodes senses a second touch sense signal responsive to the touch driving pulse in the second sensing mode.

Abstract: An array antenna includes an antenna substrate including a first ceramic member, an insertion member and a second ceramic member sequentially stacked, antenna pattern portions arranged on the antenna substrate in an array form, and shielding vias disposed inside the antenna substrate and extending in a thickness direction of the antenna substrate. The shielding vias are disposed in thickness areas of the antenna substrate corresponding to the antenna pattern portions.

Abstract: A chip antenna module array includes a first chip antenna module including: a first solder layer disposed below a first dielectric layer; a first feed via disposed in the first dielectric layer; a first patch antenna pattern disposed above the first dielectric layer and having a first resonant frequency; and a first coupling pattern spaced apart from the first patch antenna pattern, and not vertically overlapping the first patch antenna pattern. The chip antenna module array includes a second chip antenna module including: a second solder layer disposed below a second dielectric layer; a second feed via disposed in the second dielectric layer; a second patch antenna pattern disposed above the second dielectric layer and having a second resonant frequency; and a second coupling pattern disposed above and vertically overlapping the second patch antenna pattern. The first and second chip antenna modules are disposed spaced apart on a connection member.

Abstract: A chip antenna is provided. The chip antenna includes a first dielectric layer; a second dielectric layer disposed on an upper surface of the first dielectric layer; a patch antenna pattern disposed in the second dielectric layer; first and second feed vias disposed to penetrate through at least one of the first and second dielectric layers, respectively and electrically connected to a corresponding feed point among different first and second feed points of the patch antenna pattern; and first and second filters disposed between the first and second dielectric layers, respectively and electrically connected to a corresponding feed via among the first and second feed vias.

Abstract: Proposed is an yttrium-based granular powder for thermal spraying. The yttrium-based granular powder includes at least one yttrium compound powder selected from the group consisting of Y2O3, YOF, YF3, Y4Al2O9, Y3Al5O12, and YAlO3, and a silica (SiO2) powder. The yttrium-based granular powder is prepared by mixing the yttrium compound powder having a mean grain diameter of 50 nm to 900 nm and the silica powder having a mean grain diameter of 50 nm to 900 nm. The yttrium-based granular powder includes less than 10 wt % of a Y—Si—O mesophase. A thermal spray coating produced using the yttrium-based granular powder can exhibit low porosity, high density, and excellent plasma resistance.