Patents by Inventor Sung-gi Kim

Sung-gi Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11939425
    Abstract: The present invention relates to a polyester resin. The polyester resin is useful for bottles, sheets, multilayer sheets, stretched films and fiber applications due to excellent heat resistance and transparency, and in particular, the polyester resin has little deterioration of physical properties such as yellowing, etc., during processing. A process for making the polyester resin includes an esterification reaction between a dicarboxylic acid that includes terephthalic acid and a diol that includes isosorbide in the presence of a catalyst, followed by a polycondensation reaction on a product of the esterification reaction. In some embodiments, an initial mixing ratio of the dicarboxylic acid and the diol is between 1:1.02 and 1:1.04.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: March 26, 2024
    Assignee: SK Chemicals Co., Ltd.
    Inventors: Yoo Jin Lee, Su-Min Lee, Sung-Gi Kim, Min-Young Han, Dong-jin Han
  • Patent number: 11926117
    Abstract: The present invention relates to an MDO thermoresistant heat-shrinkable multilayer film of a copolymer polyester having excellent thermal resistance. In particular, the present invention provides an MDO thermoresistant heat-shrinkable multilayer film that includes multiple skin layers capable of improving thermal resistance formed on a substrate layer capable of providing high shrinkage, and simultaneously has excellent thermal resistance and high shrinkage properties through MD orientation instead of the conventional TD orientation method.
    Type: Grant
    Filed: November 24, 2017
    Date of Patent: March 12, 2024
    Assignee: SK Chemicals Co., Ltd.
    Inventors: Seol-Hee Lim, Sung-Gi Kim, So-Yeon Kim
  • Publication number: 20240044051
    Abstract: The present invention relates to a polyester fiber, a preparation method thereof and a molded article prepared therefrom. The polyester fiber comprises a diol moiety derived from isosorbide in a specific amount and is formed into a polyester resin having a specific oligomer content, thereby providing a molded article having excellent saline water resistance, chemical resistance, light resistance and good knot strength, and capable of maintaining high transparency.
    Type: Application
    Filed: October 19, 2023
    Publication date: February 8, 2024
    Inventors: Boo-youn LEE, Sung-Gi KIM, Yoo Jin LEE
  • Patent number: 11787901
    Abstract: The present invention relates to a polyester container. The polyester container is formed from a polyester resin containing a particular content of diol moieties derived from isosorbide and diethylene glycol, and thus can show high transparency in spite of a great wall thickness thereof.
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: October 17, 2023
    Assignee: SK Chemicals Co., Ltd.
    Inventors: Yoo Jin Lee, Sung-Gi Kim, Boo-Youn Lee
  • Publication number: 20230304155
    Abstract: Provided is a precursor for depositing a silicon-containing layer, the silicon precursor having a heterocyclic group, and a method of depositing a silicon-containing layer using the same. The silicon precursor is represented by Formula 1. In Formula 1, A1 is a heterocyclic group including one or more nitrogen, and R1 is hydrogen or an alkyl group of 1˜6 carbon atoms. R2 may be an alkyl group of 1˜6 carbon atoms. R3 may be an alkyl group of 1˜6 carbon atoms.
    Type: Application
    Filed: March 24, 2023
    Publication date: September 28, 2023
    Applicants: Samsung Electronics Co., Ltd., DNF Co., LTD
    Inventors: Sunhye HWANG, Sung Gi Kim, Jihyun Lee, Yujin Cho, Seung Son, Gyun Sang Lee, Younjoung Cho, Byungkeun Hwang
  • Publication number: 20230307227
    Abstract: Provided are a silicon precursor having a heterocyclic group, a composition for depositing a silicon-containing layer including the same, and a method of depositing a silicon-containing layer using the same. The silicon precursor is represented by Formula 1. In Formula 1, A1 is a heterocyclic group including one or more nitrogen, and R1 is hydrogen or an alkyl group of 1-6 carbon atoms. R2 and R3 may be each independently an alkyl group of 1-6 carbon atoms.
    Type: Application
    Filed: March 24, 2023
    Publication date: September 28, 2023
    Applicants: Samsung Electronics Co., Ltd., DNF Co., Ltd.
    Inventors: Sunhye HWANG, Sung Gi KIM, Jihyun LEE, Yujin CHO, Seung SON, Gyun Sang LEE, Younjoung CHO, Byungkeun HWANG
  • Patent number: 11749522
    Abstract: Provided are a composition for depositing a silicon-containing thin film containing a bis(aminosilyl)alkylamine compound and a method for manufacturing a silicon-containing thin film using the same, and more particularly, a composition for depositing a silicon-containing thin film, containing the bis(aminosilyl)alkylamine compound capable of being usefully used as a precursor of the silicon-containing thin film, and a method for manufacturing a silicon-containing thin film using the same.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: September 5, 2023
    Assignee: DNF CO., LTD.
    Inventors: Sung Gi Kim, Jeong Joo Park, Joong Jin Park, Se Jin Jang, Byeong-Il Yang, Sang-Do Lee, Sam Dong Lee, Sang Ick Lee, Myong Woon Kim
  • Patent number: 11713373
    Abstract: The present invention relates to a polyester resin. The polyester resin contains a particular content of diol moieties, derived from isosorbide and diethylene glycol, and thus can provide a resin molded product exhibiting high transparency in spite of a large wall thickness thereof.
    Type: Grant
    Filed: August 11, 2022
    Date of Patent: August 1, 2023
    Inventors: Yoo Jin Lee, Sung-Gi Kim, Boo-Youn Lee
  • Publication number: 20230089296
    Abstract: Provided is a composition containing a silylamine compound and a method for manufacturing a silicon-containing thin film using the same, and more particularly, a composition for depositing a silicon-containing thin film, containing a silylamine compound capable of forming a silicon-containing thin film having a significantly excellent water vapor transmission rate to thereby be usefully used as a precursor of the silicon-containing thin film and an encapsulant of a display, and a method for manufacturing a silicon-containing thin film using the same.
    Type: Application
    Filed: March 2, 2022
    Publication date: March 23, 2023
    Inventors: Sung Gi KIM, Jeong Joo PARK, Joong Jin PARK, Se Jin JANG, Byeong-il YANG, Sang-Do LEE, Sam Dong LEE, Sang Ick LEE, Myong Woon KIM
  • Patent number: 11560457
    Abstract: The present invention relates to an MDO heat-shrinkable film of a copolymer polyester having excellent thermal resistance. In particular, the present invention provides a copolymer polyester MDO (machine direction orientation) thermoresistant heat-shrinkable film that consists of a copolymer polyester resin including isosorbide and 1,4-cyclohexanedimethanol at an optimized content ratio as a diol component copolymerized with an acid component including terephthalic acid, and having a number average molecular weight of 18,000 g/mol or more, and can be used for labels, cap seals, direct packaging, etc. of various containers due to the high shrink initiation temperature.
    Type: Grant
    Filed: November 24, 2017
    Date of Patent: January 24, 2023
    Inventors: Seol-Hee Lim, Sung-Gi Kim, So-Yeon Kim
  • Publication number: 20220380595
    Abstract: The present invention relates to a polyester container. The polyester container is formed from a polyester resin containing a particular content of diol moieties derived from isosorbide and diethylene glycol, and thus can show high transparency in spite of a great wall thickness thereof.
    Type: Application
    Filed: August 5, 2022
    Publication date: December 1, 2022
    Inventors: Yoo Jin Lee, Sung-Gi KIM, Boo-Youn LEE
  • Publication number: 20220380529
    Abstract: The present invention relates to a polyester resin. The polyester resin contains a particular content of diol moieties, derived from isosorbide and diethylene glycol, and thus can provide a resin molded product exhibiting high transparency in spite of a large wall thickness thereof.
    Type: Application
    Filed: August 11, 2022
    Publication date: December 1, 2022
    Inventors: Yoo Jin LEE, Sung-Gi KIM, Boo-Youn LEE
  • Patent number: 11492444
    Abstract: The present invention relates to a polyester container. The polyester container is formed from a polyester resin containing a particular content of diol moieties derived from isosorbide and diethylene glycol, and thus can show high transparency in spite of a great wall thickness thereof.
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: November 8, 2022
    Assignee: SK CHEMICALS CO., LTD.
    Inventors: Yoo Jin Lee, Sung-Gi Kim, Boo-Youn Lee
  • Patent number: 11447603
    Abstract: The present invention relates to a polyester resin. The polyester resin contains a particular content of diol moieties, derived from isosorbide and diethylene glycol, and thus can provide a resin molded product exhibiting high transparency in spite of a large wall thickness thereof.
    Type: Grant
    Filed: May 29, 2018
    Date of Patent: September 20, 2022
    Assignee: SK Chemicals Co., Ltd.
    Inventors: Yoo Jin Lee, Sung-Gi Kim, Boo-Youn Lee
  • Publication number: 20220275010
    Abstract: Provided is a novel silylcyclodisilazane compound, a composition for depositing a silicon-containing thin film containing the same, and a method for manufacturing the silicon-containing thin film using the same, and since the silylcyclodisilazane compound of the present invention has high reactivity, thermal stability and high volatility, it can be used as a silicon-containing precursor, thereby manufacturing a high-quality silicon-containing thin film by various deposition methods.
    Type: Application
    Filed: August 13, 2020
    Publication date: September 1, 2022
    Inventors: Se Jin JANG, Sung Gi KIM, Jeong Joo PARK, Tae Seok BYUN, Yong Hee KWONE, Yeong Hun KIM, Haengdon LIM, Sang Yong JEON, Sang Ick LEE
  • Patent number: 11396579
    Abstract: The present invention relates to a polyester film and a preparation method thereof. The polyester film is formed of a polyester resin having a specific content of isosorbide and diethylene glycol introduced therein, containing a low content of oligomer, and exhibiting a specific intrinsic viscosity, thereby exhibiting excellent mechanical properties, heat resistance and chemical resistance, and good heat sealability.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: July 26, 2022
    Assignee: SK Chemicals Co., Ltd.
    Inventors: Yoo Jin Lee, Sung-Gi Kim, Boo-youn Lee
  • Patent number: 11393676
    Abstract: Provided are a composition for depositing a silicon-containing thin film containing a bis(aminosilyl)alkylamine compound and a method for manufacturing a silicon-containing thin film using the same, and more particularly, a composition for depositing a silicon-containing thin film, containing the bis(aminosilyl)alkylamine compound capable of being usefully used as a precursor of the silicon-containing thin film, and a method for manufacturing a silicon-containing thin film using the same.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: July 19, 2022
    Assignee: DNF CO., LTD.
    Inventors: Sung Gi Kim, Jeong Joo Park, Joong Jin Park, Se Jin Jang, Byeong-Il Yang, Sang-Do Lee, Sam Dong Lee, Sang Ick Lee, Myong Woon Kim
  • Patent number: 11390635
    Abstract: Provided are a composition for depositing a silicon-containing thin film, containing a trisilylamine compound and a method for producing a silicon-containing thin film using the same, and more particularly, a composition for depositing a silicon-containing thin film, containing a trisilylamine compound which is capable of forming a silicon-containing thin film at a very high deposition rate at a low temperature to be usable as a precursor of a silicon-containing thin film and an encapsulant of a display, and a method for producing a silicon-containing thin film by using the same.
    Type: Grant
    Filed: November 22, 2018
    Date of Patent: July 19, 2022
    Assignee: DNF CO., LTD.
    Inventors: Sung Gi Kim, Joong Jin Park, Byeong-il Yang, Se Jin Jang, Gun-Joo Park, Jeong Joo Park, Hee Yeon Jeong, Sam Dong Lee, Sang Ick Lee, Myong Woon Kim
  • Patent number: 11390714
    Abstract: The present invention relates to a polyarylene sulfide which has more improved compatibility with other polymer materials or fillers, and a method for preparing the same. The polyarylene sulfide is characterized in that at least part of end groups of the main chain of the polyarylene sulfide is hydroxyl group (—OH), the polyarylene sulfide contains iodine bonded to its main chain and free iodine, and the content of iodine bonded to the main chain and free iodine is 10 to 10,000 ppmw.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: July 19, 2022
    Assignee: HDC POLYALL CO., LTD.
    Inventors: Se-Ho Lee, Sung-Gi Kim
  • Patent number: 11370915
    Abstract: The present invention relates to a polyarylene sulfide resin composition having good processability and showing excellent properties due to its more improved miscibility with other polymer materials or fillers, and a formed article. Such polyarylene sulfide resin composition includes a polyarylene sulfide including a disulfide repeating unit in the repeating units of the main chain; and at least one component selected from the group consisting of a thermoplastic resin, a thermoplastic elastomer, and a filler.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: June 28, 2022
    Assignee: HDC POLYALL Co., Ltd.
    Inventors: Se-Ho Lee, Sung-Gi Kim