Patents by Inventor Sung-Kwon Lee

Sung-Kwon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11919122
    Abstract: A substrate processing apparatus includes: a conveyor belt configured to have an outer surface on which a bottom surface of a substrate is seated; and a polishing head unit configured to face an upper surface of the substrate, wherein the polishing head unit includes: a polishing head connected to a driver; a polishing pad configured to face the polishing head; a polishing pad fixing ring disposed between the polishing head and the polishing pad; and a temperature sensor configured to overlap the polishing pad fixing ring and to be spaced apart from the polishing pad fixing ring.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: March 5, 2024
    Assignees: SAMSUNG DISPLAY CO., LTD., KCTECH CO., LTD.
    Inventors: Seung Bae Kang, Sung Hyeon Park, Jung Gun Nam, Joon-Hwa Bae, Kyung Bo Lee, Keun Woo Lee, Woo Jin Cho, Byoung Kwon Choo
  • Publication number: 20240058428
    Abstract: The present invention relates to: an M3 mutant peptide; a composition for alleviating, inhibiting, preventing or treating myopathy, obesity or diabetes, comprising same as an active ingredient; a method for alleviating, inhibiting, preventing or treating myopathy, obesity or diabetes by using the M3 mutant peptide; and uses of the M3 mutant peptide for alleviating, inhibiting, preventing or treating myopathy, obesity or diabetes.
    Type: Application
    Filed: December 14, 2021
    Publication date: February 22, 2024
    Inventors: Bong Keun CHOI, Sung Kwon LEE, Sang Hyup LEE
  • Patent number: 10406230
    Abstract: The present disclosure relates to an exendin-4 analog PEGylated with polyethylene glycol or a derivative thereof, a preparation method, and a pharmaceutical composition for prevention or treatment of diabetes containing the same as an active ingredient. According to the present invention, the yield of an exendin-4 analog can be increased via the selective PEGylation by using exendin-4 in which a cysteine is introduced into #40 site of the C-terminal, and treatment effect of medications can be increased, so that the exendin-4 analog can be usefully applied as a composition for prevention or treatment of diseases caused by insulin hypersecretion.
    Type: Grant
    Filed: January 23, 2017
    Date of Patent: September 10, 2019
    Assignee: D&D Pharmatech Inc.
    Inventors: Sung Kwon Lee, Won Bae Kim, Seulki Lee, Tae Hyung Kim
  • Patent number: 10022412
    Abstract: The present invention provides a composition for preventing, improving or treating periodontal diseases comprising extract of mangosteen. The composition of the present invention has excellent anti-bacterial and anti-inflammatory effects against bacteria inducing periodontal diseases as comprising extract of mangosteen, or alpha-mangosteen or gamma-mangosteen derived from thereof, and thereby it can be widely used for medicines and foods for preventing, improving or treating periodontal diseases.
    Type: Grant
    Filed: September 16, 2015
    Date of Patent: July 17, 2018
    Assignee: MEDI BIO LAB. CO., LTD.
    Inventors: Dae Sung Lee, Yoon Seok Ko, Chan Ho Kim, Min Jung Ryu, Young Jin Kim, Ik Jin In, Sung Kwon Lee
  • Publication number: 20170296604
    Abstract: The present invention provides a composition for preventing, improving or treating periodontal diseases comprising extract of mangosteen. The composition of the present invention has excellent anti-bacterial and anti-inflammatory effects against bacteria inducing periodontal diseases as comprising extract of mangosteen, or alpha-mangosteen or gamma-mangosteen derived from thereof, and thereby it can be widely used for medicines and foods for preventing, improving or treating periodontal diseases.
    Type: Application
    Filed: September 16, 2015
    Publication date: October 19, 2017
    Inventors: Dae Sung LEE, Yoon Seok KO, Chan Ho KIM, Min Jung RYU, Young Jin KIM, Ik Jin IN, Sung Kwon LEE
  • Publication number: 20170189545
    Abstract: The present disclosure relates to an exendin-4 analogue PEGylated with polyethylene glycol or a derivative thereof, a preparation method, and a pharmaceutical composition for prevention or treatment of diabetes containing the same as an active ingredient. According to the present invention, the yield of an exendin-4 analogue can be increased via the selective PEGylation by using exendin-4 in which a cysteine is introduced into #40 site of the C-terminal, and treatment effect of medications can be increased, so that the exendin-analogue can be usefully applied as a composition for prevention or treatment of diseases caused by insulin hypersecretion.
    Type: Application
    Filed: January 23, 2017
    Publication date: July 6, 2017
    Inventors: Sung Kwon Lee, Won Bae Kim, Seulki Lee, Tae Hyung Kim
  • Patent number: 9437444
    Abstract: A method for fabricating a semiconductor device includes forming a plurality of first hard mask patterns separated by a plurality of trenches on a target layer, forming a plurality of second hard mask patterns filling the plurality of trenches, forming a plurality of first opening units in the plurality of second hard mask patterns, forming a plurality of second opening units in the plurality of first hard mask patterns and forming a plurality of patterns using the plurality of first opening units and the plurality of second opening units, which are transferred by etching the target layer.
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: September 6, 2016
    Assignee: SK HYNIX INC.
    Inventors: Sung-Kwon Lee, Jun-Hyeub Sun, Ho-Jin Jung, Chun-Hee Lee
  • Patent number: 9425072
    Abstract: A method for fabricating a semiconductor device includes forming an etching target layer over a substrate including a first region and a second region; forming a hard mask layer over the etching target layer; forming a first etch mask over the hard mask layer, wherein the first etch mask includes a plurality of line patterns and a sacrificial spacer layer formed over the line patterns; forming a second etch mask over the first etch mask, wherein the second etch mask includes a mesh type pattern and a blocking pattern covering the second region; removing the sacrificial spacer layer; forming hard mask layer patterns having a plurality of holes by etching the hard mask layer using the second etch mask and the first etch mask; and forming a plurality of hole patterns in the first region by etching the etching target layer using the hard mask layer patterns.
    Type: Grant
    Filed: July 17, 2014
    Date of Patent: August 23, 2016
    Assignee: SK Hynix Inc.
    Inventors: Jun-Hyeub Sun, Sung-Kwon Lee, Sang-Oh Lee
  • Patent number: 9321825
    Abstract: Disclosed herein are an N-terminal modified PEG-TRAIL conjugate and a preparation method and use thereof. The PEG-TAIL conjugate has pharmaceutical activity identical or similar to that of native TRAIL (TNF-related apoptosis-inducing ligand) with extended in vivo half-life and enhanced stability. Compared to native TRAIL, the PEG-TAIL conjugate exhibits high solubility and solution stability, with highly improved pharmacokinetic profiles. Thus, the PEG-TAIL conjugate may be very useful for preventing and treating proliferative diseases and autoimmune diseases.
    Type: Grant
    Filed: June 12, 2007
    Date of Patent: April 26, 2016
    Assignee: Theraly Pharmaceuticals Inc.
    Inventors: Kang Choon Lee, Su Young Chae, Yu Seok Youn, Won Bae Kim, Sung Kwon Lee
  • Publication number: 20140326408
    Abstract: A method for fabricating a semiconductor device includes forming an etching target layer over a substrate including a first region and a second region; forming a hard mask layer over the etching target layer; forming a first etch mask over the hard mask layer, wherein the first etch mask includes a plurality of line patterns and a sacrificial spacer layer formed over the line patterns; forming a second etch mask over the first etch mask, wherein the second etch mask includes a mesh type pattern and a blocking pattern covering the second region; removing the sacrificial spacer layer; forming hard mask layer patterns having a plurality of holes by etching the hard mask layer using the second etch mask and the first etch mask; and forming a plurality of hole patterns in the first region by etching the etching target layer using the hard mask layer patterns.
    Type: Application
    Filed: July 17, 2014
    Publication date: November 6, 2014
    Inventors: Jun-Hyeub SUN, Sung-Kwon LEE, Sang-Oh LEE
  • Publication number: 20140322915
    Abstract: A method for fabricating a semiconductor device includes forming a plurality of first hard mask patterns separated by a plurality of trenches on a target layer, forming a plurality of second hard mask patterns filling the plurality of trenches, forming a plurality of first opening units in the plurality of second hard mask patterns, forming a plurality of second opening units in the plurality of first hard mask patterns and forming a plurality of patterns using the plurality of first opening units and the plurality of second opening units, which are transferred by etching the target layer.
    Type: Application
    Filed: October 24, 2013
    Publication date: October 30, 2014
    Applicant: SK hynix Inc.
    Inventors: Sung-Kwon LEE, Jun-Hyeub SUN, Ho-Jin JUNG, Chun-Hee LEE
  • Patent number: 8846540
    Abstract: A semiconductor device includes a semiconductor substrate having an etch target layer provided on the surface thereof, and a hard mask layer formed over the etch target layer and including silicon, wherein the hard mask layer includes a dual structure including a first area and a second area having a larger etch rate than the first area, in order to increase an etching selectivity of the hard mask layer.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: September 30, 2014
    Assignee: SK Hynix Inc.
    Inventors: Sung-Kwon Lee, Jun-Hyeub Sun, Young-Kyun Jung
  • Patent number: 8785328
    Abstract: A method for fabricating a semiconductor device includes forming an etching target layer over a substrate including a first region and a second region; forming a hard mask layer over the etching target layer; forming a first etch mask over the hard mask layer, wherein the first etch mask includes a plurality of line patterns and a sacrificial spacer layer formed over the line patterns; forming a second etch mask over the first etch mask, wherein the second etch mask includes a mesh type pattern and a blocking pattern covering the second region; removing the sacrificial spacer layer; forming hard mask layer patterns having a plurality of holes by etching the hard mask layer using the second etch mask and the first etch mask; and forming a plurality of hole patterns in the first region by etching the etching target layer using the hard mask layer patterns.
    Type: Grant
    Filed: September 10, 2012
    Date of Patent: July 22, 2014
    Assignee: SK Hynix Inc.
    Inventors: Jun-Hyeub Sun, Sung-Kwon Lee, Sang-Oh Lee
  • Publication number: 20140162453
    Abstract: A semiconductor device that may prevent an unexposed substrate and generation of bowing profile during a process for forming an open region having a high aspect ratio, and a method for fabricating the semiconductor device. The semiconductor device includes a first material layer formed over a substrate, an open region formed in the first material layer that exposes the first material layer, a second material layer formed on sidewalls of the open region, wherein the second material layer is a compound material including an element of the first material layer, and a conductive layer formed inside the open region.
    Type: Application
    Filed: February 14, 2014
    Publication date: June 12, 2014
    Applicant: SK hynix Inc.
    Inventors: Sung-Kwon LEE, Jun-Hyeub SUN, Su-Young KIM, Jong-Sik BANG
  • Publication number: 20140057442
    Abstract: A semiconductor device includes a semiconductor substrate having an etch target layer provided on the surface thereof, and a hard mask layer formed over the etch target layer and including silicon, wherein the hard mask layer includes a dual structure including a first area and a second area having a larger etch rate than the first area, in order to increase an etching selectivity of the hard mask layer.
    Type: Application
    Filed: December 12, 2012
    Publication date: February 27, 2014
    Applicant: SK hynix Inc.
    Inventors: Sung-Kwon LEE, Jun-Hyeub SUN, Young-Kyun JUNG
  • Publication number: 20130337652
    Abstract: A method for fabricating a semiconductor device includes forming an etching target layer over a substrate including a first region and a second region; forming a hard mask layer over the etching target layer; forming a first etch mask over the hard mask layer, wherein the first etch mask includes a plurality of line patterns and a sacrificial spacer layer formed over the line patterns; forming a second etch mask over the first etch mask, wherein the second etch mask includes a mesh type pattern and a blocking pattern covering the second region; removing the sacrificial spacer layer; forming hard mask layer patterns having a plurality of holes by etching the hard mask layer using the second etch mask and the first etch mask; and forming a plurality of hole patterns in the first region by etching the etching target layer using the hard mask layer patterns.
    Type: Application
    Filed: September 10, 2012
    Publication date: December 19, 2013
    Inventors: Jun-Hyeub SUN, Sung-Kwon Lee, Sang-Oh Lee
  • Publication number: 20130217622
    Abstract: The present disclosure relates to an exendin-4 analogue PEGylated with polyethylene glycol or a derivative thereof, a preparation method, and a pharmaceutical composition for prevention or treatment of diabetes containing the same as an active ingredient. According to the present invention, the yield of an exendin-4 analogue can be increased via the selective PEGylation by using exendin-4 in which a cysteine is introduced into #40 site of the C-terminal, and treatment effect of medications can be increased, so that the exendin-4 analogue can be usefully applied as a composition for prevention or treatment of diseases caused by insulin hypersecretion.
    Type: Application
    Filed: June 28, 2012
    Publication date: August 22, 2013
    Applicant: B & L DELIPHARM, CORP.
    Inventors: Sung Kwon Lee, Won Bae Kim, Seulki Lee, Tae Hyung Kim
  • Publication number: 20130037961
    Abstract: A semiconductor device that may prevent an unexposed substrate and generation of bowing profile during a process for forming an open region having a high aspect ratio, and a method for fabricating the semiconductor device. The semiconductor device includes a first material layer formed over a substrate, an open region formed in the first material layer that exposes the first material layer, a second material layer formed on sidewalls of the open region, wherein the second material layer is a compound material including an element of the first material layer, and a conductive layer formed inside the open region.
    Type: Application
    Filed: December 21, 2011
    Publication date: February 14, 2013
    Inventors: Sung-Kwon LEE, Jun-Hyeub SUN, Su-Young KIM, Jong-Sik BANG
  • Patent number: 8227176
    Abstract: A method is used in forming a fine pattern in a semiconductor device. The method includes forming an etch target layer; forming a photoresist pattern over the etch target layer; forming a polymer pattern including silicon-oxygen (Si—O) bonds on sidewalls of the photoresist pattern; removing the photoresist pattern; and etching the etch target layer using the polymer pattern as an etch mask.
    Type: Grant
    Filed: June 30, 2008
    Date of Patent: July 24, 2012
    Assignee: Hynix Semiconductor Inc.
    Inventor: Sung-Kwon Lee
  • Publication number: 20120142189
    Abstract: A method for fabricating a semiconductor device includes sequentially forming an etch stop layer and a mold layer over a substrate, forming an open region by selectively etching the mold layer until the etch stop layer is exposed, transforming a surface of the mold layer into an insulation layer by performing a surface treatment, and forming a conductive layer inside the open region.
    Type: Application
    Filed: September 20, 2011
    Publication date: June 7, 2012
    Inventor: Sung-Kwon LEE