Patents by Inventor T. Lin

T. Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6512122
    Abstract: A method of preparing a compound of formula I is described. In this compound, each of R1-R6 is, independently, in which Y is O, S, NH, or C(R7)═C(R8). Each of R7-R11 is, independently, H, substituted or unsubstituted C1-6 alkyl, substituted or unsubstituted C2-6 alkenyl, substituted or unsubstituted C2-6 alkynyl, substituted or unsubstituted C6-20 aryl, or substituted or unsubstituted C4-20 heteroaryl. Alternatively, each of R7-R11 is OH, C1-6 alkoxy, or N(R12)(R13), in which each of R12 and R13 is, independently, H, substituted or unsubstituted C1-6 alkyl, substituted or unsubstituted C2-6 alkenyl, substituted or unsubstituted C2-6 alkynyl, or substituted or unsubstituted C6-20 aryl. Each of R7-R11 can also be NO2, CN, or CO2R14, in which R14 is H or C1-6 alkyl.
    Type: Grant
    Filed: November 21, 2001
    Date of Patent: January 28, 2003
    Assignee: Academia Sinica
    Inventors: Jiann T'suen Lin, Iuan-Yuan Wu, Yu-Tai Tao, E. Balasubramaniam
  • Publication number: 20030010947
    Abstract: A gas control valve includes two blocks with a mediate plate located therebetween. Each of the two parts has a gas path facing the mediate plate which has a passage which communicates with the two gas paths. A sleeve is engaged with a hole in one of the two parts and a rod is movably received in said sleeve. A first end of said rod is movably inserted in said second gas path and can be lowered to seal the passage in the mediate plate. A memory member or bi-metal has a first plate fixedly connected on a top of said sleeve and a second plate fixedly mounted to said second end of said rod. The memory member or bi-metal is located in the gas combustion chamber and can be deformed according to the temperature to lower the rod to obtain less gas flow.
    Type: Application
    Filed: July 12, 2001
    Publication date: January 16, 2003
    Inventor: Arlo H. T. Lin
  • Publication number: 20020189861
    Abstract: The present invention provides an interconnect between layers of a circuit board. A conductive object is embedded in the layer of a circuit board.
    Type: Application
    Filed: June 19, 2001
    Publication date: December 19, 2002
    Applicant: International Business Machines Corporation
    Inventors: Richard R. Hall, How T. Lin, Christopher J. Majka, Matthew F. Seward, Ronald V. Smith
  • Patent number: 6491688
    Abstract: A method and apparatus for presbyopia correction are disclosed. The disclosed preferred embodiments of the system consists of a beam spot controller, a beam delivery device, a slit lamp, a visible aiming beam and a selected solid state laser having a wavelength of (0.9-1.4) microns. Presbyopia is treated by the thermal contraction of the human zonnulas with a temperature increase of about (15-50) degree-C generated by the selected lasers. The near infrared laser is focused and delivered by a gonio lens to the target zonnulas area and viewed by a surgeon using a slip lamp. The selected laser having an optimal absorption characteristics is tightly focused such that only the target zonnulas is heated, while the cornea, the lens body and the adjacent areas are not damaged.
    Type: Grant
    Filed: June 21, 2000
    Date of Patent: December 10, 2002
    Inventors: J. T. Lin, Heraldo Sa Martins
  • Publication number: 20020154869
    Abstract: An optical coupler that provides for the direct mounting of integrated circuit(s). The coupler includes a two-part housing with grooves for accommodating optical fibers that are held in place when the two parts are put together. Circuitry is formed on the housing and solder balls, when heated to a liquid state and cooled (reflowed), are used to attach integrated circuit(s) onto the housing. At least one of these integrated circuit(s) is an optical die that is positioned in close proximity to the optical fibers to provide for the receipt and/or transmission of optical signals. The reflowing of the solder balls forms an electrical connection between the circuitry on the housing and the integrated circuit(s) and provides for alignment of these components. The housing is attached to a circuitized substrate using reflowed solder balls or wirebonds.
    Type: Application
    Filed: April 19, 2001
    Publication date: October 24, 2002
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Benson Chan, Richard R. Hall, How T. Lin, John H. Sherman
  • Patent number: 6457628
    Abstract: A safety switch device for a gas jet soldering gun includes a ignition push button having an outer periphery provided with a locking drive block, a housing having an inner wall defining an L-shaped drive slot mating with the locking drive block, and a spring mounted in the ignition push button for providing an axial thrust and a rotational torque. In such a manner, the user has to rotate the ignition push button to a proper position so that the ignition push button can be pressed to drive the igniter to ignite the fire, thereby preventing a child from freely opening the gas jet soldering gun.
    Type: Grant
    Filed: January 8, 2001
    Date of Patent: October 1, 2002
    Inventor: Arlo H. T. Lin
  • Publication number: 20020127288
    Abstract: A soy protein material containing reduced amounts of ribonucleic acids is provided. The soy protein material contains at most 4000 mg/kg of ribonucleic acids and is substantially devoid of ribonuclease enzymes.
    Type: Application
    Filed: July 24, 2001
    Publication date: September 12, 2002
    Applicant: Protein Technologies International, Inc.
    Inventors: Thoedore M. Wong, David A. Singer, Santa H. Lin, Terry T. Lin
  • Publication number: 20020123090
    Abstract: A method of reducing the ribonucleic acid content in a vegetable protein material is provided. A vegetable material containing protein and ribonucleic acids is treated with an enzyme preparation containing an acid phosphatase to degrade the ribonucleic acids in the vegetable protein material.
    Type: Application
    Filed: July 24, 2001
    Publication date: September 5, 2002
    Applicant: Protein Technologies International INc.
    Inventors: Theodore M. Wong, David A. Singer, Santa H. Lin, Terry T. Lin
  • Patent number: 6432349
    Abstract: A method of manufacturing an articulating bearing surface for use in an orthopaedic implant is disclosed. A block of ultra-high molecular weight polyethylene is irradiated with sufficient radiation energy to crosslink at least a portion of the ultra-high molecular weight polyethylene. The irradiated block is placed within a reforming apparatus having a complimentary articulating bearing surface. The block is heated and pressed against the complimentary articulating bearing surface, thereby forming the articulating bearing surface.
    Type: Grant
    Filed: June 29, 1999
    Date of Patent: August 13, 2002
    Assignee: Zimmer, Inc.
    Inventors: Dirk Pletcher, Steve T. Lin
  • Publication number: 20020102072
    Abstract: An optical fiber guide includes a matrix of holes integrated directly into a substrate on which one or more optical chips are mounted. The substrate therefore functions both as a guide for optically coupling a plurality of optical fibers to an optical chip, as well as a carrier for the optical chip itself. The size of the fiber guide and its integration density is therefore improved over conventional fiber connectors. The substrate is preferably made of a material having a coefficient of thermal expansion substantially similar to the coefficient of thermal expansion of the optical chip. This ensures that the optical fibers will remain optically coupled to the chip through the matrix of holes in the substrate regardless of external temperature influences. If desired, integrated circuits may be mounted onto the substrate to increase the functionality of the fiber guide.
    Type: Application
    Filed: February 1, 2001
    Publication date: August 1, 2002
    Applicant: International Business Machines Corporation
    Inventors: Benson Chan, Richard R. Hall, How T. Lin, John H. Sherman
  • Patent number: 6381595
    Abstract: A system and method for compensating for functional differences between heterogeneous database management systems, wherein data associated with a client is distributed among the heterogeneous database management systems, is discussed. The system simulates support of multiple pending actions on a single connection in any of the heterogeneous database management systems which does not support multiple pending actions on a single connection.
    Type: Grant
    Filed: September 29, 1994
    Date of Patent: April 30, 2002
    Assignee: International Business Machines Corporation
    Inventors: James C. Kleewein, Eileen T. Lin, Yun Wang
  • Patent number: 6370530
    Abstract: A system and method for compensating for functional differences between heterogeneous database management systems, wherein data associated with a client is distributed among the heterogeneous database management systems, is discussed. The system simulates support of multiple pending actions on a single connection in any of the heterogeneous database management systems which does not support multiple pending actions on a single connection.
    Type: Grant
    Filed: April 26, 1996
    Date of Patent: April 9, 2002
    Assignee: International Business Machines Corporation
    Inventors: James C. Kleewein, Eileen T. Lin, Yun Wang
  • Patent number: 6369451
    Abstract: The present invention discloses an improved method for carry out a flip chip packaging process for attaching a semiconductor integrated circuit (IC) wafer having a plurality of input/output terminals, to a substrate. The method includes the steps of: 1) securely placing a plurality of solder balls on the substrate with each of said solder balls corresponding to a location of one of the input/output terminals on the integrated circuit wafer; 2) flipping the integrated circuit wafer for aligning each of the input/output terminals of the IC wafer to one of the solder balls; and 3) mounting the IC wafer onto the substrate for placing the I/O terminals on a corresponding solder ball and applying a reflow temperature for soldering the IC wafer to the substrate.
    Type: Grant
    Filed: January 12, 1999
    Date of Patent: April 9, 2002
    Inventor: Paul T. Lin
  • Patent number: 6360225
    Abstract: A system, method and computer program product for providing a common interface to a plurality of heterogeneous database management systems, wherein data associated with a client is distributed among the plurality of heterogeneous database management systems. The system simulates support of host variables in any of the heterogeneous database management systems which does not support host variables.
    Type: Grant
    Filed: September 25, 1997
    Date of Patent: March 19, 2002
    Assignee: International Business Machines Corporation
    Inventors: James C. Kleewein, Eileen T. Lin, Yun Wang
  • Patent number: 6356912
    Abstract: A system, method and computer program product for providing a common interface to a plurality of heterogeneous database management systems, wherein data associated with a client is distributed among the plurality of heterogeneous database management systems. The system simulates support of multiple pending database actions on a single connection in any of the heterogenous database management systems which does not support multiple pending database actions on a single connection. Also, the system simulates support of cursors declared “with hold” in any of the heterogenous database management systems which does not support cursors declared “with hold”.
    Type: Grant
    Filed: September 25, 1997
    Date of Patent: March 12, 2002
    Assignee: International Business Machines Corporation
    Inventors: James C. Kleewein, Eileen T. Lin, Yun Wang
  • Publication number: 20010048158
    Abstract: The present invention discloses an improved method for carry out a flip chip packaging process for attaching a semiconductor integrated circuit (IC) wafer having a plurality of input/output terminals, to a substrate. The method includes the steps of: 1) securely placing a plurality of solder balls on the substrate with each of said solder balls corresponding to a location of one of the input/output terminals on the integrated circuit wafer; 2) flipping the integrated circuit wafer for aligning each of the input/output terminals of the IC wafer to one of the solder balls; and 3) mounting the IC wafer onto the substrate for placing the I/O terminals on a corresponding solder ball and applying a reflow temperature for soldering the IC wafer to the substrate.
    Type: Application
    Filed: January 12, 1999
    Publication date: December 6, 2001
    Inventor: PAUL T. LIN
  • Publication number: 20010029363
    Abstract: Presbyopia is treated by a system using various lasers to remove a portion of the scleral tissue and increase the accommodation of the presbyopic patient's eye. Stable accommodation is achieved by the filling of the sub-conjunctiva tissue to the laser-ablated scleral areas. The proposed laser wavelength ranges from ultraviolet to infrared of (0.15-0.36) microns, (0.5-1.4) microns and (0.9-3.2) microns. Both scanning and fiber delivered systems are proposed to generate the ablation patterns. Laser ablation of the sclera may be conducted with or without opening the conjunctiva layer.
    Type: Application
    Filed: March 30, 2001
    Publication date: October 11, 2001
    Inventor: J. T. Lin
  • Patent number: 6301121
    Abstract: The present invention comprises a single-substrate multiple chip module (MCM) assembly. The MCM assembly includes a repair-package-site ready MCM board having a top surface and a bottom surface, the top surface further includes a plurality of chip connection trace lines include a chip-select line. The MCM assembly further includes a plurality of bare integrated circuit (IC) chips mounted directly on the top surface of the MCM board each chip connected to the plurality of chip connection trace lines on the top surface. The repair-package-site ready MCM board further includes at least a repair-package-site disposed on the bottom surface having a plurality of connection terminals arranged according to a standard repair packaged-chip footprint. Each of the connection terminals is connected to a via connector disposed in the MCM board for electrically connecting to the conductive trace lines on the top surface.
    Type: Grant
    Filed: April 5, 1999
    Date of Patent: October 9, 2001
    Inventor: Paul T. Lin
  • Publication number: 20010018197
    Abstract: A method is provided for purifying a vegetable protein material by removing ribonucleic acids, phytic acid, and phytates from the protein material. An aqueous slurry is formed of a vegetable protein material having a pH of from about 3 to about 6. The protein material slurry is treated with an acid phosphatase enzyme, and optionally another phytase enzyme, at a temperature and for a time effective to degrade ribonucleic acids, and optionally phytic acid and phytates, in the protein material. The enzyme treated slurry is then washed to remove the degraded materials.
    Type: Application
    Filed: February 16, 2001
    Publication date: August 30, 2001
    Applicant: Protein Technologies International, Inc.
    Inventors: Theodore M. Wong, David A. Singer, Santa H. Lin, Terry T. Lin
  • Patent number: RE37504
    Abstract: A refractive laser surgery process is disclosed for using compact, low-cost ophthalmic laser systems which have computer-controlled scanning with a non-contact delivery device for both photo-ablation and photo-coagulation in corneal reshaping. The basic laser systems may include flash-lamp and diode pumped UV solid state lasers (193-215 nm), compact excimer laser (193 nm), free-running Er:glass (1.54 microns), Ho:YAG (2.1 microns), Q-switched Er:YAG (2.94 microns), and tunable IR lasers, (750-1100) nm and (2.5-3.2) microns. The advantages of the non-contact, scanning device used in the process over other prior art lasers include being safer, reduced cost, more compact and more precise and with greater flexibility. The theory of beam overlap and of ablation rate and coagulation patterns is also disclosed for system parameters. Lasers are selected with energy of (0.01-10) mJ, repetition rate of (1-10,000), pulse duration of 0.01 nanoseconds to a few hundreds of microseconds, and with spot size of (0.
    Type: Grant
    Filed: May 27, 1998
    Date of Patent: January 8, 2002
    Assignee: LaserSight Technologies, Inc.
    Inventor: J. T. Lin