Abstract: A semiconductor device includes: first and second terminal switches connected correspondingly between the first and second terminals of a sense amplifier and corresponding first and second nodes; first and second recycle switches connected correspondingly between the first and second nodes and corresponding third and fourth nodes; and first and second capacitors connected correspondingly between the third and fourth nodes; and wherein the first and second recycle switches are configured to selectively connect the first and second capacitors correspondingly to the first and second nodes in phases including as follows: during a recovery phase in which first and second gleaned amounts of charge (first and second gleaned charges) are recovered from corresponding selected ones of bit lines; and during a reuse phase in which the first and second gleaned charges are reused from correspondingly onto selected corresponding ones of the array of bit lines.

Abstract: A polypeptide copolymer, a preparation method thereof, a porous fibrous scaffold including the same, and a method for nerve regeneration or growth are disclosed. The polypeptide copolymer comprises: a glutamate unit; and a glutamic acid unit, wherein a ratio of a content of the glutamic acid unit to a content of the glutamate unit is in a range from 10:90 to 90:10.

Abstract: Embodiments of the present disclosure relate to methods for defect inspection. After pattern features are formed in a structure layer, a dummy filling material having dissimilar optical properties from the structure layer is filled in the pattern features. The dissimilar optical properties between materials in the pattern features and the structure layer increase contrast in images captured by an inspection tool, thus increasing the defect capture rate.

Abstract: A method for manufacturing micropowder is provided, which includes (a) mixing a silicon precursor and a carbon precursor to form a mixture, and heating and keeping the mixture at 1600° C. to 1800° C. under a vacuum and non-oxygen condition for 120 to 180 minutes to form a silicon carbide powder; and (b) heating and keeping the silicon carbide powder at 1900° C. to 2100° C. under non-oxygen condition for 5 to 15 minutes, and then cooling and keeping the silicon carbide powder at 1800° C. to 2000° C. under the non-oxygen condition for 5 to 15 minutes to form micropowder, wherein the micropowder includes a silicon carbide core covered by a carbon film.

Abstract: Method of treating gas and gas treatment device, the gas treatment device comprising: a first chamber, comprising a first inlet, a first outlet and a first energy supply system, allowing the gas to enter the first chamber through the first inlet; a second chamber comprising a second outlet and a second energy supply system; a third chamber comprising a third inlet in communication with the first outlet and the second outlet; and a fourth chamber comprising a fourth inlet and a scrubbing system containing a solvent comprising water molecules (H2O), wherein the third outlet of the third chamber is in communication with the fourth inlet of the fourth chamber.

Abstract: A method includes forming a material layer over a substrate, forming a first hard mask (HM) layer over the material layer, forming a first trench, along a first direction, in the first HM layer. The method also includes forming first spacers along sidewalls of the first trench, forming a second trench in the first HM layer parallel to the first trench, by using the first spacers to guard the first trench. The method also includes etching the material layer through the first trench and the second trench, removing the first HM layer and the first spacers, forming a second HM layer over the material layer, forming a third trench in the second HM layer. The third trench extends along a second direction that is perpendicular to the first direction and overlaps with the first trench. The method also includes etching the material layer through the third trench.

Abstract: A semiconductor device including: a sense amplifier; a branched line selectively connectable to the amplifier; a recycling arrangement selectively connectable to the branched line; an array of bit lines connected to corresponding memory cells; a multiplexer configured to selectively connect the branched line to a selected one of the memory cells through a corresponding line amongst the array of bit lines; and a controller configured to control the recycling arrangement and the multiplexer to perform intra-sense-amplifier recycling of a gleaned amount of charge (gleaned charge) recovered from a first read operation to a second read operation.

Abstract: A method for manufacturing micropowder is provided, which includes (a) mixing a silicon precursor and a carbon precursor to form a mixture, and heating and keeping the mixture at 1600° C. to 1800° C. under a vacuum and non-oxygen condition for 120 to 180 minutes to form a silicon carbide powder; and (b) heating and keeping the silicon carbide powder at 1900° C. to 2100° C. under non-oxygen condition for 5 to 15 minutes, and then cooling and keeping the silicon carbide powder at 1800° C. to 2000° C. under the non-oxygen condition for 5 to 15 minutes to form micropowder, wherein the micropowder includes a silicon carbide core covered by a carbon film.

Abstract: A method for manufacturing micropowder is provided, which includes (a) mixing a silicon precursor and a carbon precursor to form a mixture, and heating and keeping the mixture at 1600° C. to 1800° C. under a vacuum and non-oxygen condition for 120 to 180 minutes to form a silicon carbide powder; and (b) heating and keeping the silicon carbide powder at 1900° C. to 2100° C. under non-oxygen condition for 5 to 15 minutes, and then cooling and keeping the silicon carbide powder at 1800° C. to 2000° C. under the non-oxygen condition for 5 to 15 minutes to form micropowder, wherein the micropowder includes a silicon carbide core covered by a carbon film.

Abstract: Directional patterning methods are disclosed herein. An exemplary method includes performing a lithography process to form a pattered hard mask layer over a wafer, wherein the patterned hard mask layer includes a hard mask feature having an associated horizontally-defined characteristic; tuning an etching process to direct etching species in a substantially horizontal direction relative to a horizontal surface of the wafer, such that the etching process horizontally removes portions of the patterned hard mask layer, thereby modifying the horizontally-defined characteristic of the hard mask feature; and forming an integrated circuit feature that corresponds with the hard mask feature having the modified horizontally-defined characteristic. Horizontally-defined characteristic can include a length, a width, a line edge roughness, a line width roughness, a line end profile, other horizontally-defined characteristics, or combinations thereof.

Abstract: A semiconductor device including: a sense amplifier; a branched line selectively connectable to the amplifier; a recycling arrangement selectively connectable to the branched line; an array of bit lines connected to corresponding memory cells; a multiplexer configured to selectively connect the branched line to a selected one of the memory cells through a corresponding line amongst the array of bit lines; and a controller configured to control the recycling arrangement and the multiplexer to perform intra-sense-amplifier recycling of a gleaned amount of charge (gleaned charge) recovered from a first read operation to a second read operation.

Abstract: A method for manufacturing micropowder is provided, which includes (a) mixing a silicon precursor and a carbon precursor to form a mixture, and heating and keeping the mixture at 1600° C. to 1800° C. under a vacuum and non-oxygen condition for 120 to 180 minutes to form a silicon carbide powder; and (b) heating and keeping the silicon carbide powder at 1900° C. to 2100° C. under non-oxygen condition for 5 to 15 minutes, and then cooling and keeping the silicon carbide powder at 1800° C. to 2000° C. under the non-oxygen condition for 5 to 15 minutes to form micropowder, wherein the micropowder includes a silicon carbide core covered by a carbon film.

Abstract: The present invention provides a method to convert the intrinsic sugar of a juice into indigestible oligosaccharides (such as, low-polymerization fructose and sorbitol). The present method comprises using a Zymomonas mobilis biomass and fructosyltransferase as well as pressure treatment. Taking advantage of the present method, the drawbacks of drinking juices, such as too many sugar and calorie intake can be obviated, and thereby the present invention can offer healthier option to the consumers.

Abstract: Directional patterning methods are disclosed herein. An exemplary method includes performing a lithography process to form a pattered hard mask layer over a wafer, wherein the patterned hard mask layer includes a hard mask feature having an associated horizontally-defined characteristic; tuning an etching process to direct etching species in a substantially horizontal direction relative to a horizontal surface of the wafer, such that the etching process horizontally removes portions of the patterned hard mask layer, thereby modifying the horizontally-defined characteristic of the hard mask feature; and forming an integrated circuit feature that corresponds with the hard mask feature having the modified horizontally-defined characteristic. Horizontally-defined characteristic can include a length, a width, a line edge roughness, a line width roughness, a line end profile, other horizontally-defined characteristics, or combinations thereof.

Abstract: A semiconductor device includes: a sense amplifier; a branched line selectively connectable to the sense amplifier; a recycling arrangement selectively connectable to the branched line; an array of bit lines connected to corresponding memory cells; a multiplexer configured to selectively connect the branched line to a selected one of the memory cells through a corresponding line amongst the array of bit lines; and a controller. The controller is configured to: permit, during a recovery phase in which a gleaned amount of charge (gleaned charge) is recovered, flow of charge (charge-flow) between the recycling arrangement and the branched line; interrupt, during a drainage phase in which the gleaned charge is preserved, charge-flow between the recycling arrangement and the branched line; and permit, during a reuse phase in which the gleaned charge is reused, charge-flow between the recycling arrangement and the branched line.

Abstract: Various patterning methods involved with manufacturing semiconductor devices are disclosed herein. A method for fabricating a semiconductor structure (for example, interconnects) includes forming a patterned photoresist layer over a dielectric layer. An opening (hole) is formed in the patterned photoresist layer. In some embodiments, a surrounding wall of the patterned photoresist layer defines the opening, where the surrounding wall has a generally peanut-shaped cross section. The opening in the patterned photoresist layer can be used to form an opening in the dielectric layer, which can be filled with conductive material. In some embodiments, a chemical layer is formed over the patterned photoresist layer to form a pair of spaced apart holes defined by the chemical layer, and an etching process is performed on the dielectric layer using the chemical layer as an etching mask to form a pair of spaced apart holes through the dielectric layer.

Abstract: A method includes forming a dielectric layer over a conductive feature. A first mask having a first opening is formed over the dielectric layer. A second mask is formed over the first mask. A third mask having a second opening is formed over the second mask. A fourth mask having a third opening is formed over the third mask, a portion of the third opening overlapping with the second opening. The portion of the third opening is transferred to the second mask to form a fourth opening, a portion of the fourth opening overlapping with the first opening. The portion of the fourth opening is transferred to the dielectric layer to form a fifth opening. The fifth opening is extended into the dielectric layer to form an extended fifth opening, the extended fifth opening exposing the conductive feature. The extended fifth opening is filled with a conductive material.

Abstract: A method includes forming a dielectric layer over a conductive feature. A first mask having a first opening is formed over the dielectric layer. A second mask is formed over the first mask. A third mask having a second opening is formed over the second mask. A fourth mask having a third opening is formed over the third mask, a portion of the third opening overlapping with the second opening. The portion of the third opening is transferred to the second mask to form a fourth opening, a portion of the fourth opening overlapping with the first opening. The portion of the fourth opening is transferred to the dielectric layer to form a fifth opening. The fifth opening is extended into the dielectric layer to form an extended fifth opening, the extended fifth opening exposing the conductive feature. The extended fifth opening is filled with a conductive material.

Abstract: Method of treating gas and gas treatment device, the gas treatment device comprising: a first chamber, comprising a first inlet, a first outlet and a first energy supply system, allowing the gas to enter the first chamber through the first inlet; a second chamber comprising a second outlet and a second energy supply system; a third chamber comprising a third inlet in communication with the first outlet and the second outlet; and a fourth chamber comprising a fourth inlet and a scrubbing system containing a solvent comprising water molecules (H2O), wherein the third outlet of the third chamber is in communication with the fourth inlet of the fourth chamber.