Abstract: The present invention provides a new data writing method for an MRAM which can suppress deterioration of a tunnel barrier layer. A magnetic memory cell 1 has a magnetic recording layer 10 and a pinned layer 30 connected to the magnetic recording layer 10 through a non-magnetic layer 20. The magnetic recording layer 10 includes a magnetization switching region 13, a first magnetization fixed region 11 and a second magnetization fixed region 12. The magnetization switching region 13 has reversible magnetization and faces the pinned layer 30. The first magnetization fixed region 11 is connected to a first boundary B1 of the magnetization switching region 13 and its magnetization direction is fixed to a first direction. The second magnetization fixed region 12 is connected to a second boundary B2 of the magnetization switching region 13 and its magnetization direction is fixed to a second direction.

Abstract: A memory cell is used which includes a plurality of magneto-resistive elements and a plurality of laminated ferrimagnetic structure substances. The plurality of the magneto-resistive elements are placed corresponding to respective positions where a plurality of first wirings extended in a first direction intersects with a plurality of second wirings extended in a second direction which is substantially perpendicular to the first direction. The plurality of the laminated ferrimagnetic structure substances corresponds to the plurality of the magneto-resistive elements, respectively, is placed to have a distance of a predetermined range from the respective plurality of the magneto-resistive elements, and has a laminated ferrimagnetic structure. The magneto-resistive element includes a free layer having a laminated ferrimagnetic structure, a fixed layer, and a nonmagnetic layer interposed between the free layer and the fixed layer.

Abstract: A magnetic random access memory of the present invention includes: a plurality of first wirings and a plurality of second wirings extending in a first direction; a plurality of third wirings and a plurality of fourth wirings extending in a second direction; and a plurality of memory cells provided at intersections of the plurality of first wirings and the plurality of third wirings, respectively. Each of the plurality of memory cells includes: a first transistor and a second transistor connected in series between one of the plurality of first wirings and one of the plurality of second wirings and controlled in response to a signal on one of the plurality of third wirings, a first magnetic resistance element having one end connected to a write wiring through which the first transistor and the second transistor are connected, and the other end grounded; and a second magnetic resistance element having one end connected to the write wiring, and the other end connected to the fourth wiring.

Abstract: A semiconductor memory device of the present invention comprises a memory array and a read circuit that reads data of a selected cell. The memory array includes a plurality of memory cells and a reference cell each having a memory element that stores data based on change in resistance value. The read circuit includes: a voltage comparison unit that compares a value corresponding to a sense current from the selected cell with a value corresponding to a reference current from the reference cell; a first switch; and a second switch. Both of the first and second switches are provided at a subsequent stage of a decoder and at a preceding stage of the voltage comparison unit. The second switch circuit controls input of the value corresponding to the sense current to the voltage comparison unit, while the first switch circuit controls input of the value corresponding to the reference current to the voltage comparison unit.

Abstract: The present invention relates to a transistor for selecting a storage cell and a switch using a solid electrolyte. In a storage cell, a metal is stacked on a drain diffusion layer of a field-effect transistor formed on a semiconductor substrate surface. The solid electrolyte using the metal as a carrier is stacked on the metal. The solid electrolyte contacts with the metal via a gap, and the metal is connected to a common grounding conductor. A source of the field-effect transistor is connected to a column address line, and a gate of the field-effect transistor is connected to a row address line.

Abstract: Provided is an operation method which can be applied to a PRAM, an ReRAM, and a solid electrolyte memory which stores error correction codes, each of which comprises of symbols, each of which comprises bits, and which codes allow error correction in units of symbols. In the operation method, the respective symbols are read by using different reference cells 12. When a correctable error is detected in read data from data cells forming the error correction codes and corresponding to an input address, a data in a data cell corresponding to the error bit is corrected for a first error symbol of an one bit error pattern, and data in a reference cell that is used to read the second error symbol are corrected for a second error symbol related to a multi-bit error pattern.

Abstract: A nonvolatile latch circuit includes: first and second inverters cross-coupled to hold 1-bit data; first and second magnetoresistive elements each having first to third terminals; and a current supply circuitry configured to supply a magnetization reversal current for changing the magnetization states of the first and second maqnetoresistive elements in response to the 1-bit data. The power terminal of the first inverter is connected to the first terminal of the first magnetoresistive element and the power terminal of the second inverter is connected to the first terminal of the second magnetoresistive element. The current supply circuitry is configured to supply the magnetization reversal current to the second terminals of the first and second magnetoresistive elements. The third terminal of the first magnetoresistive element is electrically connected to the third terminal of the second magnetoresistive element.

Abstract: A nonvolatile latch circuit includes: a latch circuit; a first magnetoresistance element and a second magnetoresistance element; and a current supply portion. The latch circuit temporarily holds data. Each of the first magnetoresistance element and the second magnetoresistance element includes a first magnetic layer and a second magnetic layer that are stacked with an insulating film sandwiched therebetween. The current supply portion complementarily changes magnetization states of the first magnetoresistance element and the second magnetoresistance element based on a state of the latch circuit. The first magnetic layer of the first magnetoresistance element and the first magnetic layer of the second magnetoresistance element are series-connected to each other in. The latch circuit has a function that brings data corresponding to the magnetization states to data held by the latch circuit.

Abstract: MRAM includes a first wiring, a second wiring, and a memory cell. The first wiring extends to a first direction, and the second wiring extends to a second direction. The memory cell includes a free magnetic layer in which a plurality of magnetic layers coupled anti-ferromagnetically through non-magnetic layers are laminated, and is provided at an intersection of the first and second wirings. The magnetization direction of the free magnetic layer is different from the first and second directions. The writing method includes (a) reading a first data stored in the memory cell; (b) comparing a second data to be written to the memory cell and the first data; and (c) changing a direction of a first write current supplied to the first wiring and a direction of the second write current to be supplied to the second wiring, when the first data and second data are different.

Abstract: A magneto-resistance element includes a free layer, a fixed layer and a non-magnetic layer interposed between the free layer and the fixed layer. The free layer has a first magnetic layer, a second magnetic layer, a third magnetic layer, a first non-magnetic layer interposed between the first magnetic layer and the second magnetic layer, and a second non-magnetic layer interposed between the second magnetic layer and the third magnetic layer. The first magnetic layer, the second magnetic layer and the third magnetic layer are coupled such that spontaneous magnetizations have a helical structure.

Abstract: A MRAM includes: first and second bit lines provided to extend in a first direction; a storage block including at least one magnetroresistive element for storing data; and a reading circuit. The reading circuit includes a first terminal electrically connected to the first bit line, and a second terminal electrically connected to the second bit line. The second terminal has a high impedance preventing a steady-state current from flowing into at a time of a reading operation. The reading circuit supplies a reading current from the first terminal to the first bit line at the time of the reading operation. The storage block is configured such that the reading current flows from the first bit line to the magnetroresistive element and the magnetroresistive element is connected to the second bit line at the time of the reading operation. The reading circuit controls the reading current on the basis of a voltage applied to the second terminal through the second bit line.

Abstract: A magnetic random access memory includes: a first and second wirings, a plurality of third wirings, a plurality of memory cells and a terminating unit. The first and second wirings extend in a Y direction. The plurality of third wirings extends in an X direction. The memory cell is provided correspondingly to an intersection between the first and second wirings and the third wiring. The terminating unit is provided between the plurality of memory cells and connected to the first and second wirings. The memory cell includes transistors and a magnetoresistive element. The transistors are connected in series between the first and second wirings and controlled based on a signal of the third wiring. The magnetoresistive element is connected to a wiring through which the transistors are connected. At a time of a writing operation, when the write current 1w is supplied from one of the first and second wiring to the other through the transistors, the terminating unit grounds the other.

Abstract: A semiconductor integrated circuit is provided that can prevent an internal voltage from the voltage generating circuit from varying during a long term. The semiconductor integrated circuit of the present invention includes a voltage generating circuit configured to generate a reference voltage; a function circuit configured to operate by using the reference voltage; a first capacitance connected to a first node between the voltage generating circuit and the function circuit; and a switch provided between the voltage generating circuit and the first node. The switch is in a turned-off state at least for a period during which the function circuit is in an activated state.

Abstract: An MRAM according to the present invention has: a memory cell array; a first word line and a second word line each connected to a group of memory cells arranged in a first direction; a plurality of blocks arranged in a matrix form; a common word line connected to a group of blocks arranged in the first direction; and a bit line pair connected to a group of blocks arranged in a second direction. Each block has a plurality of memory cells, and each memory cell has a first transistor and a magnetoresistance element. Each block further has a second transistor to which the plurality of memory cells are connected in parallel. A gate of the second transistor is connected to the common word line. A gate of the first transistor is connected to the first word line. One of source/drain of the first transistor is connected to the first bit line, and the other thereof is connected to one end of the magnetoresistance element and connected to the second bit line through the second transistor.

Abstract: An MRAM of a spin transfer type according to the invention is provided with a memory cell 10 and a word driver 30. The memory cell 10 has a magnetic resistance element 1 and a selection transistor TR having one of source/drain electrodes which is connected with one end of the magnetic resistance element 1. The word driver 30 drives a word line WL connected with a gate electrode of the selection transistor TR. The word driver 30 changes a drive voltage of the word line WL according to the write data DW to be written in the magnetic resistance element 1.

Abstract: The present invention provides a new data writing method for an MRAM which can suppress deterioration of a tunnel barrier layer. A magnetic memory cell 1 has a magnetic recording layer 10 and a pinned layer 30 connected to the magnetic recording layer 10 through a non-magnetic layer 20. The magnetic recording layer 10 includes a magnetization switching region 13, a first magnetization fixed region 11 and a second magnetization fixed region 12. The magnetization switching region 13 has reversible magnetization and faces the pinned layer 30. The first magnetization fixed region 11 is connected to a first boundary B1 of the magnetization switching region 13 and its magnetization direction is fixed to a first direction. The second magnetization fixed region 12 is connected to a second boundary B2 of the magnetization switching region 13 and its magnetization direction is fixed to a second direction.

Abstract: A semiconductor integrated circuit includes: an oxide resistance change element, a constant current source circuit supplying a write current to the oxide resistance change element, and a voltage clamper clamping a voltage in a path in which a write current flows. The voltage clamper is arranged in parallel with the path between the constant current source circuit and the oxide resistance change element.

Abstract: A semiconductor device having a nonvolatile variable resistor, includes: a resistance value conversion circuit unit configured to convert a resistance value of the nonvolatile variable resistor into a potential or a current and which outputs the converted potential or current; a comparison circuit unit configured to compare the output from the resistance value conversion circuit unit and a potential or current at a node of a portion within the semiconductor device; and a resistance value changing circuit unit configured to change the resistance value of the nonvolatile variable resistor based on the comparison results from the comparison circuit unit.

Abstract: A semiconductor storage device is provided with a memory array including a plurality of memory cells. The plurality of memory cells includes: first and third memory cells arranged along one of an even-numbered row and an odd-numbered row, and a second memory cell arranged along the other. Each of the plurality of memory cells includes: a first transistor comprising first and second diffusion layers; a second transistor comprising third and fourth diffusion layers; and a magnetoresistance element having one of terminals thereof connected to an interconnection layer which provides an electrical connection between the second and third diffusion layers. The fourth diffusion layer of the first memory cell is also used as the first diffusion layer of the second memory cell. In addition, the fourth diffusion layer of the second memory cell is also used as the first diffusion layer of the third memory cell.

Abstract: An MRAM is provided with a memory main body (2) having at least one cell array, and a magnetic field detecting section (4) which detects a magnetic field in the vicinity of the memory main body (2) and outputs the detection signal to the memory main body (2). In the cell array, a memory main body (2), which has a plurality of magnetic memory cells including a multilayer ferri-structure as a free layer, stops a prescribed operation of the memory main body (2), based on the detection signal.