Abstract: A switch device includes a plurality of communication ports; a switch unit configured to relay a frame, which has been transmitted from a function unit and to which information including an ID of a VLAN is added, to another function unit via a communication port; and a duplication unit configured to, when the diagnosis device is connected to another switch device, duplicate the frame to be relayed via a designated communication port among the plurality of communication ports, and generate a duplicate frame for diagnosis that is a frame obtained by adding, to a duplicate frame obtained through the duplication, specific information indicating that the duplicate frame for diagnosis should be transmitted to the diagnosis device. The switch unit outputs the duplicate frame for diagnosis generated by the duplication unit from a communication port corresponding to the other switch device.

Abstract: A mounting substrate manufacturing method for soldering a terminal of an electronic component to a land 2 of a substrate 1 includes: a paste disposing step of disposing a solder paste on the land 2; a melting and solidifying step of melting and solidifying the solder paste, to form a precoated area 3 coated with solder, on the land 2; a breaking step of breaking a residue covering a surface of the precoated area 3 by pressing a tool 432, 442 against the precoated area 3; a flux disposing step of disposing a flux F on the precoated area 3; a component placement step of placing an electronic component on the substrate 1, with the terminal of the electronic component aligned with the precoated area 3; and a reflow step of heating the substrate 1 to melt the precoated area 3, to solder the terminal to the land 2. This can provide a mounting substrate manufacturing method that can reduce the occurrence of soldering defects.

Abstract: The unit coil is formed by: bending the coil end portions of the intermediate body such that, in a layer in which a length in an axial direction between the coil end portions is large, positions of the coil end portions projecting furthest from the accommodation portions in the axial direction move away from positions of the accommodation portions in the stacking direction, compared to the previous state; and aligning the positions, in the axial direction, of the coil end portions at an inner side of the annular shape, for each of the layers.

Abstract: A filtering medium includes a nonwoven fabric and a first electrode having an input terminal of power. The first electrode is provided on a surface of the nonwoven fabric. Alternatively, in a case where the nonwoven fabric has a plurality of fiber layers, the first electrode may be provided between the fiber layers. An air purifier includes the filtering medium disposed between a sucker and a discharger of a gas, and an output terminal via which power is output to the first electrode of the filtering medium.

Abstract: A semiconductor device includes a first semiconductor chip including a first plurality of wiring layers, and a first coil, a first bonding pad, and first dummy wires formed in an uppermost layer of the first plurality of the wiring layers, and a second semiconductor chip including a second plurality of wiring layers, a second coil, a second bonding pad, and second dummy wires formed in an uppermost layer of the second plurality of the wiring layers. The first semiconductor chip and the second semiconductor chip face each other via an insulation sheet. The first coil and the second coil are magnetically coupled with each other.

Abstract: A connection structure of circuit members includes a first circuit member, a second circuit member, and a joint portion. The first circuit member has a first main surface on which a light-transparent electrode is provided. The second circuit member has a second main surface on which a metal electrode is provided. The joint portion is interposed between the first main surface and the second main surface. The joint portion includes a resin portion and a solder portion. The solder portion electrically connects the light-transparent electrode and the metal electrode. The light-transparent electrode contains an oxide that includes indium and tin, and the solder portion contains bismuth and indium.

Abstract: A semiconductor device includes a first semiconductor chip including a first plurality of wiring layers, and a first coil, a first bonding pad, and first dummy wires formed in an uppermost layer of the first plurality of the wiring layers, and a second semiconductor chip including a second plurality of wiring layers, a second coil, a second bonding pad, and second dummy wires formed in an uppermost layer of the second plurality of the wiring layers. The first semiconductor chip and the second semiconductor chip face each other via an insulation sheet. The first coil and the second coil are magnetically coupled with each other.

Abstract: A filtering medium includes a nonwoven fabric and a first electrode having an input terminal of power. The first electrode is provided on a surface of the nonwoven fabric. Alternatively, in a case where the nonwoven fabric has a plurality of fiber layers, the first electrode may be provided between the fiber layers. An air purifier includes the filtering medium disposed between a sucker and a discharger of a gas, and an output terminal via which power is output to the first electrode of the filtering medium.

Abstract: Dielectric breakdown is prevented between opposing two semiconductor chips, to improve the reliability of a semiconductor device. A first semiconductor chip has a wiring structure including a plurality of wiring layers, a first coil formed in the wiring structure, and an insulation film formed over the wiring structure. A second semiconductor chip has a wiring structure including a plurality of wiring layers, a second coil formed over the wiring structure, and an insulation film formed over the wiring structure. The first semiconductor chip and the second semiconductor chip are stacked via an insulation sheet with the insulation film of the first semiconductor chip and the insulation film of the second semiconductor chip facing each other. The first coil and the second coil are magnetically coupled with each other. Then, in each of the first and second semiconductor chips, wires and dummy wires are formed at the uppermost-layer wiring layer.

Abstract: A connection structure of circuit members includes a first circuit member, a second circuit member, and a joint portion. The first circuit member has a first main surface on which a light-transparent electrode is provided. The second circuit member has a second main surface on which a metal electrode is provided. The joint portion is interposed between the first main surface and the second main surface. The joint portion includes a resin portion and a solder portion. The solder portion electrically connects the light-transparent electrode and the metal electrode. The light-transparent electrode contains an oxide that includes indium and tin, and the solder portion contains bismuth and indium.

Abstract: A semiconductor device includes a first semiconductor chip that includes a first main surface, a first inductor formed on the first main surface, and a first external connection terminal formed on the first main surface; a second semiconductor chip that includes a second main surface, a second inductor formed on the second main surface, a second external connection terminal formed on the second main surface; and a first insulating film that is located between the first semiconductor chip and the second semiconductor chip, wherein the first semiconductor chip and the second semiconductor chip overlap each other such that the first main surface and the second main face each other, the semiconductor device includes a facing region in which the first semiconductor chip and the second semiconductor chip overlap each other when seen in a plan view.

Abstract: Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream.

Abstract: A semiconductor device includes a first semiconductor chip that includes a first main surface, a first inductor formed on the first main surface, and a first external connection terminal formed on the first main surface; a second semiconductor chip that includes a second main surface, a second inductor formed on the second main surface, a second external connection terminal formed on the second main surface; and a first insulating film that is located between the first semiconductor chip and the second semiconductor chip, wherein the first semiconductor chip and the second semiconductor chip overlap each other such that the first main surface and the second main face each other, the semiconductor device includes a facing region in which the first semiconductor chip and the second semiconductor chip overlap each other when seen in a plan view.

Abstract: Dielectric breakdown is prevented between opposing two semiconductor chips, to improve the reliability of a semiconductor device. A first semiconductor chip has a wiring structure including a plurality of wiring layers, a first coil formed in the wiring structure, and an insulation film formed over the wiring structure. A second semiconductor chip has a wiring structure including a plurality of wiring layers, a second coil formed over the wiring structure, and an insulation film formed over the wiring structure. The first semiconductor chip and the second semiconductor chip are stacked via an insulation sheet with the insulation film of the first semiconductor chip and the insulation film of the second semiconductor chip facing each other. The first coil and the second coil are magnetically coupled with each other. Then, in each of the first and second semiconductor chips, wires and dummy wires are formed at the uppermost-layer wiring layer.

Abstract: In a first semiconductor chip, a first multilayer interconnect layer is formed on a first substrate, and a first inductor is formed in the first multilayer interconnect layer. In a second semiconductor chip, a second multilayer interconnect layer is formed on a second substrate. A second inductor is formed in the second multilayer interconnect layer. The first semiconductor chip and the second semiconductor chip overlap each other in a direction in which the first multilayer interconnect layer and the second multilayer interconnect layer face each other. In addition, the first inductor and the second inductor overlap each other when seen in a plan view. At least one end of a first insulating film does not overlap the end of a facing region, in a Y direction.

Abstract: Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine for feeding the substrate; a screen printing machine for applying solder paste to the substrate; a first electronic component placement machine for placing a first electronic component on the substrate; a resin dispensing machine for dispensing a thermosetting resin onto at least one reinforcement position arranged on the substrate; a second electronic component placement machine for placing a second electronic component on the substrate, such that its peripheral edge portion comes in contact with the thermosetting resin; and a reflow machine for bonding the first and second electronic components to the substrate, by heating and cooling the resultant.

Abstract: In a first semiconductor chip, a first multilayer interconnect layer is formed on a first substrate, and a first inductor is formed in the first multilayer interconnect layer. In a second semiconductor chip, a second multilayer interconnect layer is formed on a second substrate. A second inductor is formed in the second multilayer interconnect layer. The first semiconductor chip and the second semiconductor chip overlap each other in a direction in which the first multilayer interconnect layer and the second multilayer interconnect layer face each other. In addition, the first inductor and the second inductor overlap each other when seen in a plan view. At least one end of a first insulating film does not overlap the end of a facing region, in a Y direction.

Abstract: The totally-enclosed fan-cooled motor includes the stator; the rotor; the drive side bracket; the counter drive side bracket; a pair of the bearings; the external fan that sends cooling air to the stator; the internal fan; the heat radiator that is arranged on an outer side of the drive side bracket and is mounted on the rotation shaft; the cover that contains a joint, which connects the rotation shaft extending to an outer side of the drive side bracket of the motor and a reduction gear, and is provided in parallel with the joint; and the ventilation path that is arranged between the drive side bracket and an end of the cover, and includes the outlet causes the cooling air induced by rotation of the heat radiator to flow to the heat radiator and discharges the cooling air outside the motor.

Abstract: There is provided a flux for soldering and a soldering process which form better solder connection without the occurrence of the poor connection nor the insulation degradation. Such flux which is placed between a solder portion formed on a first electrode and a second electrode when the first electrode is soldered to the second electrode contains: a liquid base material made of a resin component which is dissolved in a solvent, an active component which removes an oxide film, and a metal powder made of a metal of which melting point is higher than that of a solder material which forms the solder portion, and the flux contains the metal powder in an amount in the range between 1% and 9% by volume based on a volume of the flux.

Abstract: Disclosed is an electronic component mounting line on which a substrate undergoes solder paste printing, electronic component placements, and then reflow, while being moved from upstream to downstream. The line includes: a substrate feeding machine for feeding the substrate; a screen printing machine for applying solder paste to the substrate; a first electronic component placement machine for placing a first electronic component on the substrate; a resin dispensing machine for dispensing a thermosetting resin onto at least one reinforcement position arranged on the substrate; a second electronic component placement machine for placing a second electronic component on the substrate, such that its peripheral edge portion comes in contact with the thermosetting resin; and a reflow machine for bonding the first and second electronic components to the substrate, by heating and cooling the resultant.