Abstract: An information storage device includes a storage that stores transfer data from an information processing device, the information storage device being removably connected to the information processing device, a switch unit that switches a data transfer mode of the information processing device in accordance with manipulation by a user, and a controller that controls the information processing device to transfer data in a mode in which data temporarily stored in a data storing area is transferred to the storage or in a mode in which data is transferred to the storage without being temporarily stored in the data storing area in accordance with the selection of the data transfer mode by the switch unit.

Abstract: A cooling device of an electric motor for a vehicle for receiving cooling air into the electric motor through a suction port according to the rotation of a rotor shaft on which a rotor core, which is disposed opposite to a stator core, is installed. The cooling device includes an air volume regulating mechanism regulating a cooling air volume received therein through the suction port according to an ambient temperature. Since the cooling air volume received in the cooling device through the suction port is regulated according to the ambient temperature, the cooling of the electric motor can be optimized, and noise generated can be efficiently reduced according to the ambient temperature.

Abstract: A first frequency generator outputs a signal at first frequency f1 which satisfies a relationship of f1>f0 with desired frequency f0. A second frequency generator outputs a signal at second frequency f2 which satisfies a relationship of f2>f0 with desired frequency f0. A frequency discriminator frequency combines the signal generated from the first frequency generator with the signal generated from the second frequency generator to generate a signal which contains a component at desired frequency f0. The frequency discriminator further passes therethrough only a frequency region lower than a predetermined threshold frequency of the generated signal.

Abstract: A variation of a threshold of diode-connected transistors is compensated for to maintain a constant rectification efficiency of a rectifier circuit, thereby enabling stable detection of a start signal. A constant voltage is applied to DC bias terminal of cascaded half-wave voltage doubler rectifier circuits (including MOS transistors M1 to M4 and capacitors C1 to C4) forming a rectifier circuit, and a voltage equal to the sum of the constant voltage applied to DC bias terminal 103 and a variation ?Vt of a threshold voltage of the MOS transistors is applied to DC bias terminal 104 of cascaded half-wave voltage doubler rectifier circuits (including MOS transistors M5 to M8 and capacitors C5 to C8) forming a bias circuit.

Abstract: There is provided a flux for soldering and a soldering process which form better solder connection without the occurrence of the poor connection nor the insulation degradation. Such flux which is placed between a solder portion formed on a first electrode and a second electrode when the first electrode is soldered to the second electrode contains: a liquid base material made of a resin component which is dissolved in a solvent, an active component which removes an oxide film, and a metal powder made of a metal of which melting point is higher than that of a solder material which forms the solder portion, and the flux contains the metal powder in an amount in the range between 1% and 9% by volume based on a volume of the flux.

Abstract: It provides metal-powder-contained flux disposed between bumps and circuit electrodes when electronic parts are mounted by soldering, the metal powder comprises a core metal formed of metal such as tin and zinc and a surface metal covering surfaces of the core metal formed of noble metal such as gold and silver. Accordingly, metal powder will not remain as residue that is liable to cause migration after the reflow process, and it is possible to assure both soldering effect and insulation effect.

Abstract: In a solder paste 3 formed by allowing a resin component 3a having oxide removability to contain solder particles 4A, 4B, and 4C which are formed by coating the surfaces of core particles 6A, 6B, and 6C made of tin (Sn) or an alloy of tin with silver (Ag) coating films 7A, 7B, and 7C, the core particles are distributed to have such a particle distribution that the average particle diameter is in the range of 3 ?m to 7 ?m and 75% or more of the particles is in the range of 1 ?m to 9 ?m and the coating film is formed so that the core particles are coated with a silver coating film of an amount which occupies 1 to 4 wt % of the solder particles. Accordingly, it is possible to prevent oxide from being formed on the surfaces of the solder particles and to enhance the solder wettability at the time of soldering. In addition, it is possible to secure printability onto fine electrodes and to secure excellent solder adhesion with respect to a fine-pitch part by the use of a simple and low-cost method.

Abstract: The present invention provides an amplifying circuit capable of accomplishing high-impedance input/output, and providing a high gain and low power consumption. The amplifier amplifies a signal received through an input terminal, and outputs the signal through an output terminal. A control circuit comprised of the inductors, and the switches turns input/output impedances of the amplifier into a high impedance.

Abstract: A CVD apparatus includes a vertical boat extending in a vertical direction and capable of holding plural substrates in a horizontal state such that the substrates are aligned in the vertical direction, an inner tube extending in the vertical direction and provided so as to surround the boat laterally, an outer tube surrounding the inner tube laterally from outside, the outer tube further covering a top part of the inner tube, a flange holding the inner tube and outer tube at respective bottom ends thereof, gas introducing nozzles provided on a flange sidewall at two locations thereof, the gas introducing nozzles introducing gases from outside to an interior of the inner tube at respective gas ejection ports, and a gas evacuation part evacuating a gas in the outer tube to outside thereof, wherein there is provided a guide part in the vicinity of the gas ejection ports of the gas introducing nozzles such that the gases ejected from the respective gas ejection ports are caused to flow generally parallel to a bot

Abstract: A PLL circuit comprises a phase comparator for comparing phases between a reference signal and an internal signal and outputting a phase difference signal according to a phase difference therebetween, a voltage controlled oscillator group composed of a plurality of oscillators which have mutually different frequency variable ranges and whose oscillation frequencies are respectively controlled in accordance with a phase control signal, a selecting means for selecting one of the outputs from the plurality of oscillators based on the phase difference signal or the phase control signal, and a frequency divider for generating the internal signal by dividing an output of an oscillator selected by the selecting means, and when the oscillator selecting state is changed, an output phase of the frequency divider is approximated to the phase of the reference signal. Thereby, a required voltage controlled oscillator can be selected in a short time according to a desirable oscillation frequency.

Abstract: The present invention provides an amplifying circuit capable of accomplishing high-impedance input/output, and providing a high gain and low power consumption. The amplifier amplifies a signal received through an input terminal, and outputs the signal through an output terminal. A control circuit comprised of the inductors, and the switches turns input/output impedances of the amplifier into a high impedance.

Abstract: A method of soldering electronic component (6) having solder bumps (7) formed thereon to substrate (12), wherein bumps (7) are pressed against a flux transferring stage on which a thin film is formed of flux (10) containing metal powder (16) of good wettability to solder so as to cause metal powder (16) to penetrate oxide films (7a) and embed in the surfaces on the bottom parts of bumps (7), and bumps (7) in this state are positioned and mounted to electrodes (12a) on substrate (12). Substrate (12) is then heated to melt bumps (7) and allow the melted solder to flow and spread along the surfaces of metal powder (16) toward electrodes (12a). The method can thus provide solder bonding portions of high quality without any soldering defect and deterioration of the insulating property.

Abstract: A PLL circuit comprises a phase comparator for comparing phases between a reference signal and an internal signal and outputting a phase difference signal according to a phase difference therebetween, a voltage controlled oscillator group composed of a plurality of oscillators which have mutually different frequency variable ranges and whose oscillation frequencies are respectively controlled in accordance with a phase control signal, a selecting means for selecting one of the outputs from the plurality of oscillators based on the phase difference signal or the phase control signal, and a frequency divider for generating the internal signal by dividing an output of an oscillator selected by the selecting means, and when the oscillator selecting state is changed, an output phase of the frequency divider is approximated to the phase of the reference signal. Thereby, a required voltage controlled oscillator can be selected in a short time according to a desirable oscillation frequency.

Abstract: A semiconductor device having a thinned semiconductor element that can be easily handled is manufactured with a method of manufacturing. The semiconductor device includes a semiconductor element and a bumper member bonded, as a reinforcing member, to a back surface opposite to an electrode-formed surface of the semiconductor element with an adhesive. The adhesive has a low elastic modulus and easily expands and contracts after bonding, and bonds the semiconductor element to the bumper member while allowing the semiconductor element to be deformed. Thus, the semiconductor device can be easily handled, and the semiconductor element can be deformed in response to the deformation of a substrate after being mounted. In addition, a thermal stress in a heat cycle can be alleviated effectively.

Abstract: A receiving circuit for receiving a signal transmitted to a signal transmission path, the receiving circuit comprising: a signal potential detection means for detecting signal potential of the received signal, a signal logic value discrimination means for discriminating a logic value of the received signal, and a reference signal generation means for generating a reference signal for the signal logic value discrimination means, based on a signal potential detected by the signal potential detection means and a discrimination result of the signal logic value discrimination means.

Abstract: A semiconductor device having a thinned semiconductor element allowed to be easily handled, and a method of manufacturing the device are provided. The semiconductor device includes a semiconductor element and a bumper member bonded, as a reinforcing member, to a back surface opposite to an electrode-formed surface of the semiconductor element with an adhesive. The adhesive has a low elastic modulus and easily expands and contracts after bonding, and bonds the semiconductor element to the bumper member while allowing the semiconductor element to be deformed. Thus, the semiconductor device can easily be handled, and the semiconductor element can be deformed in responsive to the deformation of a substrate after being mounted. In addition, a thermal stress in a heat cycle can be alleviated effectively.

Abstract: A receiving circuit for receiving a signal transmitted to a signal transmission path, the receiving circuit comprising: a signal potential detection means for detecting signal potential of the received signal, a signal logic value discrimination means for discriminating a logic value of the received signal, and a reference signal generation means for generating a reference signal for the signal logic value discrimination means, based on a signal potential detected by the signal potential detection means and a discrimination result of the signal logic value discrimination means.

Abstract: A discharge lamp lighting device in which dim control can be performed for a discharge lamp continuously and stably in a wide range, and which is simple in circuit configuration and low in price. The discharge lamp lighting device comprises: an inverter (IV) for turning on/off switching elements (Q2, Q3) by an oscillation output signal of an IV control integrated circuit (IC2) to thereby invert a voltage of a DC power supply (E) into high-frequency electric power, a discharge lamp (LA) capable of being lighted by the high-frequency electric power from the inverter (IV), a feedback circuit (FB) having delay time T (unit: second) expressed by 1/f≦T≦1/10,000 when the frequency of the high-frequency electric power is f, the feedback circuit (FB) including a reference value setting means (R15) for setting a reference value, the feedback circuit outputting a voltage for controlling the IV control integrated circuit (IC2) to make the high-frequency electric power equal to the reference value.

Abstract: A solder bump formation method and solder bump mounting method for forming a solder bump by soldering a solder ball 9 onto an electrode 2 provided at the bottom of a cavity 3 on a substrate 2 which has an opening shape through which the solder ball 9 cannot go. Metal paste 5, containing metal having a higher liquidus temperature than that of solder used for the solder ball 9, is filled into the cavity 3. The solder ball 9 is placed on the cavity 3, and then heated to the temperature higher than the liquidus temperature of the solder ball 9. During the heating process, metal in the metal paste 5 remains unmelted in the cavity 3 when the solder ball 9 melts. This enables the metal to direct the melted solder to the electrode 2 at the bottom of the cavity 3, achieving good soldering.

Abstract: The average value of an input signal supplied to an input terminal is generated by an integrating circuit consisting of a series circuit of a capacitor, a constant-current source transistor, and a resistor. The average value is used as the reference voltage for the differential amplifier circuit. Further, to each of differential pair transistors the sources of which are commonly connected, other transistors are cascode connected, respectively. Supplied to each gate of the cascode connected transistors is a divisional voltage of the differential voltage between the average voltage from the integrating circuit and the circuit power supply voltage, which divisional voltage is obtained by a capacitive divider circuit.