Patents by Inventor Tadatomo Suga

Tadatomo Suga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220142005
    Abstract: A joint structure includes a first member, a second member and a metal joint layer. The first member has including a first surface and is made of material having one of copper, copper alloy, aluminum, or aluminum alloy. The second member includes a second surface that faces the first surface of the first material. The metal joint layer includes a gold joint layer made of material having gold or gold alloy and is disposed between the first surface of the first material and the second surface of the second material. A thickness of the metal joint layer is smaller than flatness of the first surface of the first material and flatness of the second surface of the second material. Fluorine is dispersed inside at least the gold joint layer included in the metal joint layer.
    Type: Application
    Filed: October 25, 2021
    Publication date: May 5, 2022
    Inventors: TOSHIHIRO MIYAKE, TADATOMO SUGA, EIJI HIGURASHI
  • Publication number: 20210265300
    Abstract: A chip bonding system including an activation treatment device including a frame holder and a particle beam source that irradiates a sheet, to which a chip held by the frame holder is stuck, with a particle beam, to thereby activate a bonding surface of the chip; and a bonding device that brings the chip, of which the bonding surface is activated by the activation treatment device, into contact with a substrate, to thereby bond the chip to the substrate. The frame holder supports a holding frame in a posture in which one side, to which the chip is stuck, in the sheet, of the holding frame that holds the sheet TE, which is formed of a resin, and to which the chip is stuck, is exposed to the particle beam source.
    Type: Application
    Filed: November 14, 2018
    Publication date: August 26, 2021
    Applicants: BONDTECH CO., LTD.
    Inventors: Akira YAMAUCHI, Tadatomo SUGA
  • Publication number: 20210017075
    Abstract: Methods of bonding substrates are provided, including forming a thin film of a metal oxide on a bonding surface of both or either of a pair of substrates, at least one of which is a transparent substrate, and contacting the bonding surfaces of the pair of substrates with each other via the thin film of the metal oxide.
    Type: Application
    Filed: December 21, 2018
    Publication date: January 21, 2021
    Applicants: LAN TECHNICAL SERVICE CO., LTD.
    Inventors: Tadatomo SUGA, Yoshiie MATSUMOTO
  • Patent number: 10204785
    Abstract: A substrate bonding apparatus includes a vacuum chamber, a surface activation part for activating respective bonding surfaces of a first substrate and a second substrate, and stage moving mechanisms for bringing the two bonding surfaces into contact with each other, to thereby bond the substrates. In order to activate the bonding surfaces in the vacuum chamber, the bonding surfaces are irradiated with a particle beam for activating the bonding surfaces, and concurrently the bonding surfaces are also irradiated with silicon particles. It is thereby possible to increase the bonding strength of the substrates.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: February 12, 2019
    Assignees: BONDTECH CO., LTD.
    Inventors: Tadatomo Suga, Akira Yamauchi
  • Patent number: 10166749
    Abstract: [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: January 1, 2019
    Assignees: LAN TECHNICAL SERVICE CO., LTD., TADATOMO SUGA
    Inventors: Tadatomo Suga, Akira Yamauchi, Ryuichi Kondou, Yoshiie Matsumoto
  • Patent number: 10043975
    Abstract: [Problem] To provide a technology that allows a film or glass to be bonded to a transport substrate and to be easily separated during the manufacture of a substrate. [Solution] Provided is a method for manufacturing a substrate having an electronic device formed on a surface, the method comprising a formation step for forming an inorganic material layer on at least one of a bonding surface by which the substrate having an electronic device formed on a surface is to be bonded to a transport substrate, and a bonding surface on the transport substrate for transporting the substrate; a bonding step for pressing the substrate and the transport substrate against each other and bonding the substrate and the transport substrate by the inorganic material layer; and a separation step for separating the substrate and the transport substrate.
    Type: Grant
    Filed: July 16, 2015
    Date of Patent: August 7, 2018
    Assignee: LAN TECHNICAL SERVICE CO., LTD.
    Inventors: Tadatomo Suga, Yoshiie Matsumoto
  • Patent number: 9962908
    Abstract: The present invention provides a method for firmly and inexpensively bonding at low temperature a polymer film to another polymer film or to a glass substrate without the use of an organic adhesive. A method for bonding a polymer film includes a step (S1) for forming a first inorganic material layer on part or all of a first polymer film; a step (S3) for forming a second inorganic material layer on part or all of a second polymer film; a step (S2) for surface-activating the surface of the first inorganic material layer by bombarding with particles having a predetermined kinetic energy; a step (S4) for surface-activating the surface of the second inorganic material layer by bombarding with particles having a predetermined kinetic energy; and a step (S5) for abutting the surface-activated surface of the first inorganic material layer against the surface-activated surface of the second inorganic material layer and bonding the first polymer film and second polymer film together.
    Type: Grant
    Filed: April 9, 2013
    Date of Patent: May 8, 2018
    Assignee: LAN TECHNICAL SERVICE CO., LTD.
    Inventors: Tadatomo Suga, Yoshiie Matsumoto
  • Publication number: 20180068854
    Abstract: A substrate bonding apparatus includes a vacuum chamber, a surface activation part for activating respective bonding surfaces of a first substrate and a second substrate, and stage moving mechanisms for bringing the two bonding surfaces into contact with each other, to thereby bond the substrates. In order to activate the bonding surfaces in the vacuum chamber, the bonding surfaces are irradiated with a particle beam for activating the bonding surfaces, and concurrently the bonding surfaces are also irradiated with silicon particles. It is thereby possible to increase the bonding strength of the substrates.
    Type: Application
    Filed: November 13, 2017
    Publication date: March 8, 2018
    Inventors: Tadatomo SUGA, Akira YAMAUCHI
  • Patent number: 9870922
    Abstract: A substrate bonding apparatus (100) includes a vacuum chamber (200), a surface activation part (610) for activating respective bonding surfaces of a first substrate (301) and a second substrate (302), and stage moving mechanisms (403, 404) for bringing the two bonding surfaces into contact with each other, to thereby bond the substrates (301, 302). In order to activate the bonding surfaces in the vacuum chamber (200), the bonding surfaces are irradiated with a particle beam for activating the bonding surfaces, and concurrently the bonding surfaces are also irradiated with silicon particles. It is thereby possible to increase the bonding strength of the substrates (301, 302).
    Type: Grant
    Filed: April 24, 2015
    Date of Patent: January 16, 2018
    Assignees: BONDTECH CO., LTD.
    Inventors: Tadatomo Suga, Akira Yamauchi
  • Publication number: 20170200891
    Abstract: [Problem] To provide a technology that allows a film or glass to be bonded to a transport substrate and to be easily separated during the manufacture of a substrate. [Solution] Provided is a method for manufacturing a substrate having an electronic device formed on a surface, the method comprising a formation step for forming an inorganic material layer on at least one of a bonding surface by which the substrate having an electronic device formed on a surface is to be bonded to a transport substrate, and a bonding surface on the transport substrate for transporting the substrate; a bonding step for pressing the substrate and the transport substrate against each other and bonding the substrate and the transport substrate by the inorganic material layer; and a separation step for separating the substrate and the transport substrate.
    Type: Application
    Filed: July 16, 2015
    Publication date: July 13, 2017
    Applicant: LAN TECHNICAL SERVICE CO., LTD.
    Inventors: Tadatomo SUGA, Yoshiie MATSUMOTO
  • Patent number: 9601350
    Abstract: [Problem] To provide a substrate bonding technique having a wide range of application. [Solution] A silicon thin film is formed on a bonding surface, and the interface with the substrate is surface-treated using energetic particles/metal particles.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: March 21, 2017
    Assignees: BONDTECH CO., LTD., TAIYO YUDEN CO., LTD., LAN TECHNICAL SERVICE CO., LTD.
    Inventors: Tadatomo Suga, Akira Yamauchi, Ryuichi Kondou, Yoshiie Matsumoto
  • Publication number: 20170047225
    Abstract: A substrate bonding apparatus (100) includes a vacuum chamber (200), a surface activation part (610) for activating respective bonding surfaces of a first substrate (301) and a second substrate (302), and stage moving mechanisms (403, 404) for bringing the two bonding surfaces into contact with each other, to thereby bond the substrates (301, 302). In order to activate the bonding surfaces in the vacuum chamber (200), the bonding surfaces are irradiated with a particle beam for activating the bonding surfaces, and concurrently the bonding surfaces are also irradiated with silicon particles. It is thereby possible to increase the bonding strength of the substrates (301, 302).
    Type: Application
    Filed: April 24, 2015
    Publication date: February 16, 2017
    Inventors: Tadatomo SUGA, Akira YAMAUCHI
  • Patent number: 9331305
    Abstract: [Problem] The aim of the invention is to provide a method of sealing an electronic element such as an organic EL element using a normal temperature bonding method that enables bonding at low temperature and in which permeation of external gases such as hydrogen or oxygen through the sealed section (dam) formed by the organic material, or the junction interface of the sealed section and a cover substrate is suppressed.
    Type: Grant
    Filed: June 14, 2013
    Date of Patent: May 3, 2016
    Assignee: Lan Technical Service Co., Ltd.
    Inventors: Tadatomo Suga, Yoshiie Matsumoto
  • Patent number: 9142532
    Abstract: [Problem] Provided is a technique for bonding chips efficiently onto a wafer to establish an electrical connection and raise mechanical strength between the chips and the wafer or between the chips that are chips laminated onto each other in the state that resin and other undesired residues do not remain on a bond interface therebetween.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: September 22, 2015
    Assignee: BONDTECH CO., LTD.
    Inventors: Tadatomo Suga, Akira Yamauchi
  • Publication number: 20150171365
    Abstract: [Problem] The aim of the invention is to provide a method of sealing an electronic element such as an organic EL element using a normal temperature bonding method that enables bonding at low temperature and in which permeation of external gases such as hydrogen or oxygen through the sealed section (dam) formed by the organic material, or the junction interface of the sealed section and a cover substrate is suppressed.
    Type: Application
    Filed: June 14, 2013
    Publication date: June 18, 2015
    Applicant: LAN TECHNICAL SERVICE CO., LTD.
    Inventors: Tadatomo Suga, Yoshiie Matsumoto
  • Publication number: 20150104656
    Abstract: The present invention provides a method for firmly and inexpensively bonding at low temperature a polymer film to another polymer film or to a glass substrate without the use of an organic adhesive. A method for bonding a polymer film includes a step (S1) for forming a first inorganic material layer on part or all of a first polymer film; a step (S3) for forming a second inorganic material layer on part or all of a second polymer film; a step (S2) for surface-activating the surface of the first inorganic material layer by bombarding with particles having a predetermined kinetic energy; a step (S4) for surface-activating the surface of the second inorganic material layer by bombarding with particles having a predetermined kinetic energy; and a step (S5) for abutting the surface-activated surface of the first inorganic material layer against the surface-activated surface of the second inorganic material layer and bonding the first polymer film and second polymer film together.
    Type: Application
    Filed: April 9, 2013
    Publication date: April 16, 2015
    Applicant: LAN TECHNICAL SERVICE CO., LTD.
    Inventors: Tadatomo Suga, Yoshiie Matsumoto
  • Publication number: 20150048523
    Abstract: [Problem] Provided is a technique for bonding chips efficiently onto a wafer to establish an electrical connection and raise mechanical strength between the chips and the wafer or between the chips that are chips laminated onto each other in the state that resin and other undesired residues do not remain on a bond interface therebetween.
    Type: Application
    Filed: April 24, 2013
    Publication date: February 19, 2015
    Applicant: BONDTECH CO., LTD.
    Inventors: Tadatomo Suga, Akira Yamauchi
  • Patent number: 8915418
    Abstract: The present invention ensures a good bonding state between the electrode terminals of electronic components and the electrodes of a substrate, and achieves an increase in productivity and a downsizing of the substrate. The present invention includes: an applying step of applying a metal fine powder paste on each of multiple electrodes that are provided on a substrate; a component placing step of placing multiple electronic components with different heights, on the multiple electrodes, respectively; an organic film placing step of placing an organic film on the multiple electronic components; an organic film compressing step of applying a first pressure to the electronic component side with a pressing member and equalizing the height of the organic film; and a bonding step of applying a second pressure to the electronic component side with a compressing member on heating for a predetermined time and sintering the metal fine powder paste.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: December 23, 2014
    Assignees: Tadatomo Suga, Masataka Mizukoshi, Alpha Design Co., Ltd.
    Inventors: Toshiyuki Shiratori, Toru Kawasaki, Tadatomo Suga, Masataka Mizukoshi
  • Patent number: 8875977
    Abstract: An element pressing apparatus includes: a base casing having first and second bases couplable to or separable from each other to form an arrangement space where a board and a plurality of electronic components having different heights are arranged while the first and second bases are coupled to each other; oil encapsulated in the arrangement space; an oil seal member deformed depending on a pressure of the oil; and a hydraulic pressure change portion that changes the pressure of the oil, wherein the pressure of the oil changes by the hydraulic pressure change portion to press the oil seal member to a plurality of electronic components and press the electrode terminals against the electrodes when the board and a plurality of electronic components are arranged in the arrangement space by positioning and placing each of the electrode terminals on each of the electrodes.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: November 4, 2014
    Assignee: Alpha Design Co., Ltd.
    Inventors: Toshiyuki Shiratori, Toru Kawasaki, Tadatomo Suga, Masataka Mizukoshi
  • Publication number: 20140263575
    Abstract: An element pressing apparatus includes: a base casing having first and second bases couplable to or separable from each other to form an arrangement space where a board and a plurality of electronic components having different heights are arranged while the first and second bases are coupled to each other; oil encapsulated in the arrangement space; an oil seal member deformed depending on a pressure of the oil; and a hydraulic pressure change portion that changes the pressure of the oil, wherein the pressure of the oil changes by the hydraulic pressure change portion to press the oil seal member to a plurality of electronic components and press the electrode terminals against the electrodes when the board and a plurality of electronic components are arranged in the arrangement space by positioning and placing each of the electrode terminals on each of the electrodes.
    Type: Application
    Filed: March 13, 2014
    Publication date: September 18, 2014
    Applicant: ALPHA DESIGN CO., LTD.
    Inventors: Toshiyuki SHIRATORI, Toru KAWASAKI, Tadatomo SUGA, Masataka MIZUKOSHI