Abstract: In a coating apparatus for supplying a mixed solution of a resist solution and a thinner onto a wafer from a nozzle, the nozzle is connected to a mixed solution supply pipe, and the resist solution and the thinner are supplied to the mixed solution supply pipe from a resist solution supply pipe and a thinner supply pipe respectively through a junction pipe. The diameter of the junction pipe is set smaller than those of other supply pipes, whereby the resist solution and the thinner can be mixed efficiently in the junction pipe, and as a result the wafer is coated with the mixed solution so that a uniform film thickness can be obtained within the surface of the wafer.

Abstract: The present invention is a system for performing coating and developing treatment for a substrate, which comprises a treatment section having a coating treatment unit for forming a coating film on the substrate, a developing treatment unit for developing the substrate, a thermal treatment unit for performing thermal treatment for the substrate, and a first carrier unit for carrying the substrate into/out of these coating treatment unit, developing treatment unit, and thermal treatment unit. The system of the present invention further comprises an interface section having a second carrier unit for carrying the substrate through a route at least between the treatment section and an exposure processing unit provided outside the system for performing exposure processing for the substrate.

Abstract: The present invention is a film forming method for forming a film of a coating solution on a substrate, comprising the steps of spreading the coating solution supplied to a center of the substrate by rotating the substrate, and supplying solvent vapor of the coating solution to the coating solution spread over the substrate while rotating the substrate to thin the film of the coating solution formed on the substrate. Accordingly, it becomes possible that the film of the coating solution which is formed by spreading the coating solution over the substrate is maintained at a low viscosity, and that the film can be further thinned. The necessary quantity of the coating solution can be also reduced. Moreover, since solvent vapor is supplied onto the coating film, by controlling the supply quantity or the supply position of the solvent vapor, the uniformity of the coating solution film can be obtained, and the thickness of the coating solution film can be controlled.

Abstract: A controller controls the temperature of a hot plate and the degree of vacuum in a tightly closed space to a temperature and a pressure at levels at which a thinner contained in a resist applied to a wafer volatilizes and an acid generator, a quencher, and a polymer chain protecting group practically remain in the resist, for example, during heat processing. More specifically, the controller controls the temperature of the hot plate and the degree of vacuum in the tightly closed space to bring the temperature of the hot plate to about 40° C., and the degree of vacuum in the tightly closed space to approximately 5 Torr. Thereby, the heat processing can be performed for the wafer so that the acid generator is uniformly dispersed in the resist, or the quencher is uniformly formed on the front face of the resist without breakage of the polymer chain protecting group.

Abstract: On top of respective areas divided by partition plates, that is, a cassette station, a processing station, and an interface section in a coating and developing processing system, gas supply sections for supplying an inert gas into the respective areas are provided. Exhaust pipes for exhausting atmospheres in the respective areas are provided at the bottom of the respective areas. The atmospheres in the respective areas are maintained in a clean condition by supplying the inert gas not containing impurities such as oxygen and fine particles from the respective gas supply sections into the respective areas and exhausting the atmospheres in the respective areas from the exhaust pipes.

Abstract: An apparatus includes a holding portion for holding a substrate, a nozzle, provided to face the substrate held by the holding portion, for discharging a solution to the substrate, a driver for moving the nozzle along a surface of the substrate relatively with respect to the substrate while the solution is being discharged to the surface of the substrate from the nozzle, a mask unit covering a portion other than a film formation area of the substrate and including a mask member for catching the solution from the nozzle, and a cleaner provided in the mask unit. The coating solution can be supplied to the surface of the substrate in a way similar to a picture drawn with a single stroke of a brush. A cleaning unit for cleaning the mask member does not need to be provided separately, leading to the facilitation of cleaning and a reduction in space.

Abstract: A coating film forming apparatus for forming a film by applying a coating solution to a substrate, which is provided with a cassette section, coating unit, developing unit, pre-treatment/post-treatment units and a main arm for transferring the substrate between the respective units. In the coating unit, provided is a coating section in which a resist is applied on the substrate in a manner of single stroke by intermittently moving the substrate in a Y-direction and by moving a nozzle in an X-direction, and provided is a reduced-pressure drying section for drying under reduced pressure the substrate after being applied, and further provided is equipment for removing the coating film adhered to a periphery of the substrate. Additionally, when the reduced-pressure drying section is arranged outside the coating unit, the main arm is covered with a cover so that the inside thereof is under a solvent atmosphere.

Abstract: A discharge nozzle in a film forming apparatus of the present invention includes a substantially cylindrical support member and a thin plate or a thin plate portion supported on a face on a substrate side of the support member and closing the face on the substrate side, and a discharge port for discharging a coating solution is provided in the thin plate or the thin plate portion. It is possible to form a smaller discharge port in the thin plate or the thin plate portion by laser processing, punching, or the like than that obtainable by conventional injection molding processing. An amount of discharge and a discharge area on the substrate of the coating solution can be controlled more precisely.

Abstract: The present invention is a film forming unit for forming a film on a substrate by supplying a coating solution on the substrate from a discharge nozzle, including moving means for moving the discharge nozzle, wherein the moving means comprises a supporting member for supporting the discharge nozzle, a moving member for moving the supporting member, a guide shaft passing through bearing portion which is formed in the supporting member, and an air supply mechanism for supplying air to a space between the bearing portion and the guide shaft.

Abstract: Disclosed is a coating apparatus, comprising: a first stream-combining valve communicating with each of a first solvent tank and a resist solution tank, a first pump for supplying an initial resist solution from the resist solution tank toward said first stream-combining valve, a second pump for supplying a solvent from said first solvent supply toward said first stream-combining valve, a first mixer for mixing under stirring the initial resist solution flowing out of said first stream-combining valve with a solvent, a second stream-combining valve arranged downstream of said first mixer and communicating with each of the first mixer and said second solvent supply, a third pump for supplying the solvent from said second solvent supply toward the second stream-combining valve, a second mixer for mixing under stirring said primary mixed liquid material coming out of said second stream-combining valve with a solvent so as to prepare a final mixed liquid material, a nozzle equipped with a liquid spurting port for

Abstract: A coating apparatus according to the invention comprises a spin chuck for holding a substrate, resist solution tanks which contain a primary resist solution, a thinner tank which contains thinner, a confluence valve communicating with the thinner tank and the resist solution tanks, first pumps each for supplying the confluence valve with the primary resist solution from a corresponding one of the resist solution tanks, a second pump for supplying thinner from the thinner tank to the confluence valve, a mixer for mixing the primary treatment solution and thinner supplied from the confluence valve, a nozzle for applying a solution from the mixer, to the substrate held by the spin chuck, and a controller for controlling the first and second pumps to adjust the mixture ratio of the primary resist solution to be supplied from each of the resist solution tanks to the confluence valve, to thinner to be supplied from the thinner tank to the confluence valve.

Abstract: Disclosed is a coating apparatus, comprising: a first stream-combining valve communicating with each of a first solvent tank and a resist solution tank, a first pump for supplying an initial resist solution from the resist solution tank toward said first stream-combining valve, a second pump for supplying a solvent from said first solvent supply toward said first stream-combining valve, a first mixer for mixing under stirring the initial resist solution flowing out of said first stream-combining valve with a solvent, a second stream-combining valve arranged downstream of said first mixer and communicating with each of the first mixer and said second solvent supply, a third pump for supplying the solvent from said second solvent supply toward the second stream-combining valve, a second mixer for mixing under stirring said primary mixed liquid material coming out of said second stream-combining valve with a solvent so as to prepare a final mixed liquid material, a nozzle equipped with a liquid spurting port for

Abstract: A thermoplastic polyurethane elastomer containing a very small amount of small grains, and having a high molecular weight and a narrow molecular-weight distribution. Such high-quality thermoplastic polyurethane is excellent in melt moldability and allows to prevent yarn breakage in producing fibers by melt spinning, for example. Such polyurethane elastomer can be produced by melt-polymerizing a prepolymer and a low-molecular diol at a relatively high temperature in a short period of time. This invention also provides an apparatus for producing the polyurethane elastomer, and fibers formed of said elastomer.