Abstract: The light-emitting element of the present disclosure has a constant light emission intensity over a specific range of emission angle of light emitted from the center of its main light-emitting surface.

Abstract: A cooler for cooling a semiconductor module includes a top plate; a jacket having a side plate and a bottom plate and firmly fixed to the top plate; a refrigerant inflow port through which a refrigerant flows into a space surrounded by the top plate and jacket; a refrigerant outflow port through which the refrigerant flows out from the space; a plurality of fins firmly fixed to the top plate and disposed separately on each of the left and right relative to a main refrigerant path in the jacket to be inclined toward the inflow side of the main refrigerant path; heat transfer pins disposed on the top plate on the refrigerant inflow sides of the fins; and a curved plate-like bimetal valve having one end connected to each respective heat transfer pin and another free end.

Abstract: A cooler with a cooler main body that, in one configuration, includes a first wall portion forming a cooling surface that cools an electronic component, a second wall portion disposed opposing the first wall portion, and a side wall portion that connects a periphery of the first wall portion and a periphery of the second wall portion. In the configuration, cooling fins are attached to an inner wall surface of the first wall portion, a refrigerant introduction pipe and refrigerant introduction flow path for supplying refrigerant to the cooling fins and a refrigerant discharge pipe and refrigerant discharge flow path for ejecting refrigerant from the cooling fins are included, and protruding portions and are provided on the first wall portion side of the refrigerant introduction flow path.

Abstract: A light-emitting element wafer includes a supporting substrate, a luminescent layer that is formed of a semiconductor and has a first surface and a second surface, the first surface including a first electrode, the second surface including a second electrode, the second surface being arranged between the supporting substrate and the first surface, a junction layer that joins luminescent layer to the supporting substrate and is arranged between the supporting substrate and the second surface, a first inorganic film formed on the first surface, a second inorganic film formed between the junction layer and the second surface, an isolation trench portion that isolates elements and is formed to have a depth such that the isolation trench portion extends from the first inorganic film to the supporting substrate, and a third inorganic film that connects the first inorganic film and the second inorganic film.

Abstract: A light-emitting element wafer includes a supporting substrate, a luminescent layer that is formed of a semiconductor and has a first surface and a second surface, the first surface including a first electrode, the second surface including a second electrode, the second surface being arranged between the supporting substrate and the first surface, a junction layer that joins luminescent layer to the supporting substrate and is arranged between the supporting substrate and the second surface, a first inorganic film formed on the first surface, a second inorganic film formed between the junction layer and the second surface, an isolation trench portion that isolates elements and is formed to have a depth such that the isolation trench portion extends from the first inorganic film to the supporting substrate, and a third inorganic film that connects the first inorganic film and the second inorganic film.

Abstract: A light emitting element includes: a laminated body including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer in this order, the second conductive semiconductor layer having a light extraction surface; and a recombination suppression structure provided in vicinity of an end surface of the active layer, the recombination suppression structure having a bandgap larger than a bandgap of the active layer.

Abstract: A cooler for cooling a semiconductor module includes a top plate; a jacket having a side plate and a bottom plate and firmly fixed to the top plate; a refrigerant inflow port through which a refrigerant flows into a space surrounded by the top plate and jacket; a refrigerant outflow port through which the refrigerant flows out from the space; a plurality of fins firmly fixed to the top plate and disposed separately on each of the left and right relative to a main refrigerant path in the jacket to be inclined toward the inflow side of the main refrigerant path; heat transfer pins disposed on the top plate on the refrigerant inflow sides of the fins; and a curved plate-like bimetal valve having one end connected to each respective heat transfer pin and another free end.

Abstract: A semiconductor light emitting device including an active layer, a compound semiconductor layer on the active layer, a contact layer on the compound semiconductor layer, and an electrode on the contact layer, where the contact layer is substantially the same size as the electrode.

Abstract: A hydraulic mechanism is mounted on a forklift. The hydraulic mechanism has a control valve and a pressure compensation circuit for compensating pressure within the hydraulic mechanism. The pressure compensation circuit has a relief pressure valve and an unloading valve for releasing pressure within the pressure compensation circuit to a discharge oil passage. Upon instructed to perform cargo handling operation, the unloading valve is switched to an open state, and the relief pressure valve is thereby actuated, so that rapid increase of pressure within the circuit is avoided. Further, the unloading valve is switched to an open state, and the pressure within the hydraulic mechanism is thereby released to the discharge oil passage, so that the cargo handling operation by the tilt cylinder and the lift cylinder is restricted.

Abstract: A semiconductor device includes at least two semiconductor chips each including a plurality of data input/output pads, a data memory portion structured so as to read/write data through the plurality of data input/output pads, a test result input/output pad, and a test circuit for controlling a first test mode that decides data read from the data memory portion and outputs the decision from the test result input/output pad and a second test mode that decides data read from the data memory portion, inputs test result of another semiconductor chip from the test result input/output pad and outputs a synthesized test result of the test result of the chip itself and the test result of the other semiconductor chip from a specified part of the plurality of data input/output pads, and a plurality of data input/output terminals each connected with different data input/output pads.

Abstract: A light-emitting element wafer includes a supporting substrate, a luminescent layer that is formed of a semiconductor and has a first surface and a second surface, the first surface including a first electrode, the second surface including a second electrode, the second surface being arranged between the supporting substrate and the first surface, a junction layer that joins luminescent layer to the supporting substrate and is arranged between the supporting substrate and the second surface, a first inorganic film formed on the first surface, a second inorganic film formed between the junction layer and the second surface, an isolation trench portion that isolates elements and is formed to have a depth such that the isolation trench portion extends from the first inorganic film to the supporting substrate, and a third inorganic film that connects the first inorganic film and the second inorganic film.

Abstract: A semiconductor device includes at least two semiconductor chips each including a plurality of data input/output pads, a data memory portion structured so as to read/write data through the plurality of data input/output pads, a test result input/output pad, and a test circuit for controlling a first test mode that decides data read from the data memory portion and outputs the decision from the test result input/output pad and a second test mode that decides data read from the data memory portion, inputs test result of another semiconductor chip from the test result input/output pad and outputs a synthesized test result of the test result of the chip itself and the test result of the other semiconductor chip from a specified part of the plurality of data input/output pads, and a plurality of data input/output terminals each connected with different data input/output pads.

Abstract: A spout member including a base portion which is fixed to a bag body, a cylindrical portion which protrudes upward from the base portion, and a sealing portion which seals a front end of the cylindrical portion through a breakable thin portion is disposed between two sheets of film forming the bag body. A sealing chamber accommodating the cylindrical portion and the sealing portion is opened by tearing the two sheets of film along an opening assisting line. An opening assisting plate protruding to at least one of a left side and a right side of the sealing portion is disposed above the opening assisting line. A sandwiching reinforcement seal portion for reinforcing the two sheets of film by sealing inner surfaces thereof is provided between the opening assisting plate and the opening assisting line.

Abstract: A semiconductor device includes a plurality of first data input/output terminals, a plurality of second data input/output terminals, a first semiconductor chip, and a second semiconductor chip. The first semiconductor chip includes a plurality of first data input/output pads connected with the first data input/output terminals, a first test circuit, and a first memory portion. The first test circuit generates a first test result in response to a data output from the first memory portion at a test operation. The second semiconductor chip includes a plurality of second data input/output pads connected with the second data input/output terminals, a second and a third test circuits, and a second memory portion.

Abstract: A semiconductor light emitting device including an active layer, a compound semiconductor layer on the active layer, a contact layer on the compound semiconductor layer, and an electrode on the contact layer, where the contact layer is substantially the same size as the electrode.

Abstract: An image capturing apparatus including: an image sensor generating an image signal; a photographing control section performing a photographing operation in which an exposure of the image sensor is divided into a plurality of exposures in accordance with a predetermined exposure time; an addition section adding sequentially the image signals obtained at each exposure; an amplification ratio calculation section calculating an amplification ratio of the added image signal on the basis of the predetermined exposure time; an amplification section amplifying the added image signal by using the amplification ratio to compensate for insufficient exposure for the predetermined exposure time; and a display control section displaying information related to the amplified image signal; wherein the photographing control section ends the photographing operation when instructed by a user, and determines that the amplified image signal is a captured image obtained by performing the photographing operation with the predetermin

Abstract: An imaging apparatus includes: an imaging device generating an image signal on a subject image; a shooting control mechanism dividing an exposure to be made to the imaging device in an exposure period into a plurality of times of exposures; an adding mechanism adding individual image signals obtained by the plurality of divided exposures in sequence to generate a sum image signal; an amplification control mechanism amplifying the sum image signal using a predetermined amplification factor in a first period in the exposure period to generate an amplified image signal; and a display control mechanism displaying, on a display section, the amplified image based on the amplified image signal in the first period, and displaying, on a display section, an image based on the sum image signal in a period other than the first period in the exposure period.

Abstract: Imaging signal obtained through exposure for divided exposure times is A/D converted to digital imaging signal. Dark current component is subtracted from the digital imaging signal. The result of subtraction is accumulated and stored in a first memory. Next, exposure for divided exposure times is performed with the imaging device shielded from light. The obtained imaging signal is A/D converted to digital imaging signal. Dark current component is subtracted from the digital imaging signal. The result of subtraction is accumulated and stored sequentially in a second memory. The digital imaging signal stored in the second memory is subtracted from the digital imaging signal stored in the first memory. Then the result of subtraction is output. The word length allocated to one pixel in the first and second memories is longer than the word length of one A/D converted pixel.

Abstract: It is aimed to provide a spout member and a packaging bag using the spout member which have excellent handling property and hygiene management performance at the time of supplying water or the like from the outside before and during use such as administration of water and medicine, in which a closure means for freely opening and closing an aperture formed by cutting off parts of peripheral portions of sealed film pieces is protected from a contained content at the time of storage or transportation and which have excellent protecting property even when an inner pressure acts in the packaging bag, excellent contamination preventing property until a spout is opened and excellent contamination preventing property and handling property after opening.