Patents by Inventor Takahiro Koyama

Takahiro Koyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12272081
    Abstract: An inspection apparatus includes processing circuitry. The processing circuitry acquires read image data obtained by reading an image printed on both sides of a conveyance medium. The processing circuitry searches for marks printed on both sides of the conveyance medium in the read image data. The processing circuitry outputs information indicating a misalignment amount of both sides of the conveyance medium based on positions where the marks are printed.
    Type: Grant
    Filed: April 13, 2022
    Date of Patent: April 8, 2025
    Assignee: Ricoh Company, Ltd.
    Inventor: Takahiro Koyama
  • Patent number: 12249556
    Abstract: A cooler includes a top plate, one surface of which serves as a heat dissipation surface, a bottom plate disposed so as to face the top plate and having a larger thickness than that of the top plate, a plurality of fins provided between the top plate and the bottom plate, and a circumferential wall part provided so as to surround the plurality of fins along outer circumferential edges of the bottom plate. The plurality of fins and the outer circumferential wall part are provided between the top plate and the bottom plate and bonded to the heat dissipation surface of the top plate. A flow path for a coolant is formed by a space enclosed by the top plate, the bottom plate, the plurality of fins, and the circumferential wall part. The top plate has an electric potential higher than that of the bottom plate.
    Type: Grant
    Filed: October 29, 2021
    Date of Patent: March 11, 2025
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Kensuke Matsuzawa, Takahiro Koyama, Hiromichi Gohara
  • Patent number: 12155929
    Abstract: An imaging device according to an embodiment of the present disclosure includes an imaging unit, an encoding section, and a sending section. The imaging unit acquires captured image data by imaging. The encoding section encodes a plurality of pieces of image data as one piece of image data for transmission. The plurality of pieces of image data is based on one or more pieces of captured image data acquired by the imaging unit. The sending section sends the image data for transmission to an external device. The image data for transmission is generated by the encoding section.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: November 26, 2024
    Assignee: SONY GROUP CORPORATION
    Inventors: Yusuke Suzuki, Takahiro Koyama
  • Patent number: 12127382
    Abstract: A semiconductor module includes a cooling device that includes: a ceiling plate; a side wall; a bottom plate; a plurality of pin fins having a polygonal shape and arranged in a matrix form in which one end of the respective pin fins is connected to a fin region having a rectangular shape; an inlet for a coolant at a first position adjacent to a part of one of long sides of the fin region, and an outlet for the coolant at a second position adjacent to a part of the other long side of the fin region. The matrix directions of the respective pin fins make an angle with a straight line connecting the first position and the second position, and a length of a segment of the straight line passing across the fin region is longer than a length of short sides of the fin region.
    Type: Grant
    Filed: February 24, 2022
    Date of Patent: October 22, 2024
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Yoshihiro Tateishi, Tatsuhiko Asai, Takahiro Koyama, Hiromichi Gohara
  • Patent number: 12074091
    Abstract: A semiconductor device includes an insulating substrate, semiconductor elements mounted on the insulating substrate, and a cooler for cooling the semiconductor elements. The cooler includes a heat dissipating substrate having bonding and heat dissipating surfaces opposite to each other, the bonding surface being bonded to the second surface of the insulating substrate, a plurality of fins on the heat dissipating surface, a reinforcing plate having first and second surfaces opposite to each other and covering the fins, the first surface being bonded to tips of the fins, and a cooling case including a recessed part to house the fins and reinforcing plate. A first gap between two adjacent fins, measured in a direction parallel to the heat dissipating substrate, is larger than a second gap between the reinforcing plate and a bottom of the first recessed part, measured in a thickness direction.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: August 27, 2024
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Takahiro Koyama, Hiromichi Gohara
  • Patent number: 12068441
    Abstract: A light-emitting device according to one embodiment of the present disclosure includes: a reflective structure having a first surface and a second surface and having, on the first surface, an opening whose side surface is provided with a first reflective film; a semiconductor light-emitting element including a first conductivity-type layer, an active layer, and a second conductivity-type layer that are stacked, the opening of the reflective structure and the active layer being disposed to be opposed to each other; and a support member having a light-transmitting property and having a first surface and a second surface, the semiconductor light-emitting element being disposed on the first surface side, the reflective structure being disposed on the second surface side, the second surface being at least partially in contact with the first surface of the reflective structure.
    Type: Grant
    Filed: January 15, 2020
    Date of Patent: August 20, 2024
    Assignee: Sony Group Corporation
    Inventors: Mikio Takiguchi, Takahiro Koyama, Toyoharu Oohata
  • Patent number: 12040435
    Abstract: Provided is a light-emitting device that includes a solid-state light source emitting excitation light and a phosphor layer having a first refractive index, provided on a light-emitting surface side of the solid-state light source, and having a first reflection film on its side surface. The light-emitting device further includes a low refractive layer provided on the phosphor layer and having a second refractive index less than the first refractive index, and a sealing member encapsulating the phosphor layer and the low refractive layer and having a third refractive index greater than or equal to the second refractive index.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: July 16, 2024
    Assignee: SONY CORPORATION
    Inventors: Takahiro Koyama, Toyoharu Oohata
  • Publication number: 20240206847
    Abstract: An ultrasonic motor of the invention includes: a transducer including a plurality of piezoelectric elements and an elastic body having an outer wall surface on which the plurality of piezoelectric elements are secured, the transducer being configured to vibrate when an alternating voltage is applied to the plurality of piezoelectric elements; a rotator configured to rotate by receiving the vibration of the transducer by being pressed in contact with a surface of the transducer; a biasing spring configured to press the rotator against the elastic body; and an output shaft configured to output rotation of the rotator. The elastic body includes a hollow portion and houses the rotator and the biasing spring in the hollow portion, and the rotator rotates in a state of being pressed against an inner wall surface of the hollow portion of the elastic body by the biasing spring.
    Type: Application
    Filed: March 6, 2024
    Publication date: June 27, 2024
    Applicant: OLYMPUS MEDICAL SYSTEMS CORP.
    Inventors: Yuichi SHIGA, Tomoyuki KUGO, Takahiro KOYAMA
  • Patent number: 11996350
    Abstract: A cooler includes a top plate having a plurality of fins provided on a surface thereof, and a circumferential wall part provided so as to surround outer circumferences of the plurality of fins along outer circumferential edges of the top plate, and a bottom plate bonded to distal ends of the circumferential wall part and the plurality of fins. A flow path for a coolant is formed by a space enclosed by the top plate, the circumferential wall part and the bottom plate. The bottom plate has inlet and discharge portions for the coolant. The inlet and discharge portions are disposed so as to face each other diagonally with the plurality fins interposed therebetween. An inner surface of the circumferential wall part has a step part that tilts from the inner surface of the circumferential wall part toward the discharge portion at a position neighboring to the discharge portion.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: May 28, 2024
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Yoshihiro Tateishi, Takahiro Koyama, Hiromichi Gohara
  • Publication number: 20240030332
    Abstract: A semiconductor device including: a channel layer; a spacer layer; an intermediate layer; and a barrier layer. The channel layer includes a first nitride semiconductor. The spacer layer includes a second nitride semiconductor having a larger band gap than a band gap of the first nitride semiconductor. The spacer layer is provided on the channel layer. The intermediate layer includes Alx1Iny1Ga(1-x1-y1)N(0<x1<1, 0<y1<1, and 0<x1+y1<1). The intermediate layer is provided on the spacer layer. The barrier layer includes Alx2In(1-x2)N(0<x2<1). The barrier layer is provided on the intermediate layer.
    Type: Application
    Filed: August 5, 2021
    Publication date: January 25, 2024
    Inventors: KUNIHIKO TASAI, TAKAHIRO KOYAMA, NORIYUKI FUTAGAWA, SEI FUKUSHIMA, YUYA KANITANI
  • Patent number: 11776111
    Abstract: An information processing apparatus includes circuitry configured to: acquire, as a first image, a read image of an image formed on a medium; generate a second image based on document data; detect reference points from the second image; compare the first image with the second image to calculate an amount of positional deviation of the medium for each of the reference points; detect, based on the amount of positional deviation, a malfunction of a conveying device that conveys the medium; cause an image forming apparatus to print a correction chart for correction of conveyance of the medium, in response to detection of the malfunction of the conveying device; calculate, from a read image of the correction chart, an amount of fluctuation in conveyance of the medium performed by the conveying device; and calculate a correction value for the calculated amount of fluctuation in conveyance of the medium.
    Type: Grant
    Filed: November 10, 2020
    Date of Patent: October 3, 2023
    Assignee: Ricoh Company, Ltd.
    Inventor: Takahiro Koyama
  • Publication number: 20230245948
    Abstract: A semiconductor device includes a support, a semiconductor module, a heat transfer medium, and a first frame member. The semiconductor module includes a semiconductor chip and a resin member sealing the semiconductor chip, and is mounted on the support via the heat transfer medium. The first frame member is disposed on the semiconductor module. The first frame member has a first frame portion that covers an edge portion of an upper surface of the semiconductor module, and a first opening portion formed in the first frame portion for exposing the semiconductor module. The first frame member is fixed to the support by screws.
    Type: Application
    Filed: December 28, 2022
    Publication date: August 3, 2023
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Takahiro KOYAMA, Hiromichi GOHARA
  • Publication number: 20230223503
    Abstract: A light emitting device according to an embodiment of the present disclosure includes multiple light emitting elements. The light emitting elements each include a semiconductor layer including a first conductive layer, a light emitting layer, and a second conductive layer that are stacked in this order. The first conductive layer has a light emitting surface. The light emitting elements further includes a first electrode in contact with the second conductive layer, and a second electrode in contact with the first conductive layer. The light emitting elements share the first conductive layer and the second electrode with each other. The light emitting elements each include a current path in the first conductive layer from a portion opposed to the first electrode to a portion opposed to the second electrode. The first conductive layer has one or multiple trenches in a region between two current paths adjacent to each other.
    Type: Application
    Filed: April 20, 2021
    Publication date: July 13, 2023
    Inventors: TOYOHARU OOHATA, TAKAHIRO KOYAMA
  • Publication number: 20230215780
    Abstract: A cooling device including a rectangular top plate in a plan view having a front surface on which a semiconductor module is disposed and a rear surface having a sidewall connection region, a flow pass region, and an outer edge region. The flow pass region includes a cooling region and first and second communicating regions that sandwich the cooling region therebetween from a short-side direction of the top plate. The sidewall connection region surrounds an outer periphery of the flow pass region. The outer edge region is outside of the sidewall connection region and closer to an edge of the top plate than is the flow pass region. The cooling region has a first thickness, and the outer edge region has a second thickness that is greater than the first thickness.
    Type: Application
    Filed: March 15, 2023
    Publication date: July 6, 2023
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Takahiro KOYAMA, Daiki YOSHIDA, Yuichiro HINATA, Takafumi YAMADA, Yoshihiro TATEISHI
  • Patent number: 11664296
    Abstract: Provided is a semiconductor module including semiconductor devices and a cooling apparatus, wherein the semiconductor device has semiconductor chips and a circuit board with the semiconductor chips implemented thereon; the cooling apparatus has a top plate, a side wall, a bottom plate, a coolant flow portion, an inlet, an outlet and a plurality of fins; the top plate and the bottom plate have three through holes that are through holes for inserting fastening members that fasten the semiconductor module to an external apparatus, penetrating the top plate and the bottom plate in one direction respectively; and a geometric center of gravity of a aperture of at least one of the inlet and the outlet may also be positioned inside a virtual triangle with the three through holes being vertexes in planar view.
    Type: Grant
    Filed: February 24, 2021
    Date of Patent: May 30, 2023
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Kensuke Matsuzawa, Takahiro Koyama, Hiromichi Gohara
  • Patent number: 11606467
    Abstract: An information processing apparatus includes circuitry. The circuitry is configured to acquire read image data of an image formed on a recording medium. The circuitry is configured to acquire output target image data according to which the image is formed. The circuitry is configured to generate, based on the output target image data, inspection image data for inspection of the read image data. The circuitry is configured to compare the read image data corrected based on an amount of deviation caused by conveyance of the recording medium with the inspection image data generated, to detect an image abnormality. The circuitry is configured to highlight and output a position of a portion of the image abnormality in the read image data before correction, based on the amount of deviation caused by conveyance of the recording medium, in response to the image abnormality being detected.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: March 14, 2023
    Assignee: RICOH COMPANY, LTD.
    Inventors: Yohta Mashiko, Tadashi Kitai, Akira Masuda, Takahiro Koyama, Kengo Yamamoto
  • Patent number: 11594855
    Abstract: A semiconductor laser drive circuit includes: an anode electrode divided into at least one gain region and at least one light absorption region; a cathode electrode shared between the gain region and the light absorption region; and a resistance connected to the anode electrode of the light absorption region.
    Type: Grant
    Filed: August 16, 2018
    Date of Patent: February 28, 2023
    Assignee: SONY CORPORATION
    Inventors: Takahiro Koyama, Tomoki Ono
  • Publication number: 20230009479
    Abstract: To provide a technology that makes it possible to recognize a target object quickly and accurately. An information processing apparatus according to the present technology includes a controller. The controller recognizes a target object on the basis of event information that is detected by an event-based sensor, and transmits a result of the recognition to a sensor apparatus that includes a sensor section that is capable of acquiring information regarding the target object.
    Type: Application
    Filed: November 19, 2020
    Publication date: January 12, 2023
    Inventors: YUSUKE SUZUKI, TAKAHIRO KOYAMA
  • Publication number: 20220393196
    Abstract: A fuel cell ship includes a storage battery compartment installed with a storage battery that supplies, to a propulsion device, electric power different from electric power by a fuel cell. The storage battery compartment is provided between a deck and a ship bottom portion of a hull.
    Type: Application
    Filed: June 1, 2022
    Publication date: December 8, 2022
    Applicant: Yanmar Holdings Co., Ltd.
    Inventors: Yukihiko KIMURA, Takehiro MARUYAMA, Yasuyoshi YAMAGUCHI, Takuya HIRAIWA, Manabu SHINAGAWA, Shoto MORISHITA, Takahiro KOYAMA
  • Patent number: D1037163
    Type: Grant
    Filed: December 8, 2021
    Date of Patent: July 30, 2024
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Tsubasa Nakamura, Daiki Yoshida, Takahiro Koyama