Patents by Inventor Takahiro Murakami

Takahiro Murakami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11960166
    Abstract: A display device includes an organic EL element layer, a liquid crystal element layer disposed on top of the organic EL element layer, and a polarizing plate disposed at a side of the liquid crystal element layer that faces an observer. The liquid crystal element layer includes two transparent substrates and a liquid crystal layer disposed between the two transparent substrates. The liquid crystal element layer is configured to be able to, by applying a voltage to the liquid crystal layer, cause a substantially quarter-wavelength retardation in light passing through the liquid crystal layer.
    Type: Grant
    Filed: January 30, 2023
    Date of Patent: April 16, 2024
    Assignee: Sharp Display Technology Corporation
    Inventors: Naru Usukura, Masahiro Imai, Yuhichiroh Murakami, Takahiro Yamaguchi, Shige Furuta
  • Publication number: 20240101235
    Abstract: Provided with a weight release device capable of being operated in deep sea same as the conventional weight release device without accompanying a mechanical operation at all to avoid troubles of mechanical operation occurred in the conventional weight release device. The weight release device includes a housing fixed to the underwater observation device; a thread made of thermoplastic resin; electric heater portions; a weight support plate; a locking member of the thread made of the thermoplastic resin; and a ring for hanging the weight. The thread made of the thermoplastic resin is arranged from a start point housed in the housing, arranged to pass through the first electric heater portion, locked to the locking member of the thread made of the thermoplastic resin, arranged to pass through the second electric heater portion housed in the housing, and returned to an end point housed in the housing. The ring for hanging the weight is fixed to a lower surface of the weight support plate.
    Type: Application
    Filed: March 3, 2022
    Publication date: March 28, 2024
    Inventors: Tetsuya MIWA, Kazumasa IKEDA, Takahiro KUBOTA, Atsushi ARAI, Yasuyuki MURAKAMI
  • Patent number: 11938728
    Abstract: A liquid ejecting head includes: head chips including a first-head-chip and a second-head-chip; a holder holding the head chips; and a heater along a direction parallel to a nozzle surface. The first-head-chip and the second-head-chip are disposed to be offset from each other in both a first-direction and a second-direction parallel to the nozzle surface and intersecting with each other. When a first-side is one of the four sides of a virtual rectangle circumscribing the aggregate of the head chips and a second-side and a third-side are coupled to both ends of the first-side, the first-head-chip is in contact with the first-side and the third-side and the second-head chip is in contact with the second-side. The heater overlaps the head chips. A first-region surrounded by the first-side, the second-side, the first-head-chip, and the second-head-chip includes a first-outside-part positioned outside the outer edge of the heater.
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: March 26, 2024
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Takahiro Kanegae, Katsuhiro Okubo, Kentaro Murakami, Shingo Tomimatsu, Hiroki Kobayashi, Haruhisa Uezawa
  • Patent number: 11938732
    Abstract: A liquid ejecting head supported by a support body includes: a first head chip; a holder having a holding portion holding the first head chip and a flange portion; and a heater heating the holding portion, in which the holding portion has a heat receiving portion receiving heat from the heater, and a shortest path of heat transferred through the holder from the heat receiving portion to the flange portion is bent or curved at two or more points.
    Type: Grant
    Filed: March 23, 2022
    Date of Patent: March 26, 2024
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Katsuhiro Okubo, Takahiro Kanegae, Kentaro Murakami, Shingo Tomimatsu, Hiroki Kobayashi, Haruhisa Uezawa
  • Publication number: 20240093084
    Abstract: A chemical fluid for underground injection includes an inorganic substance, an antioxidant (e.g. ascorbic acid, gluconic acid, or a salt thereof, or ?-acetyl-?-butyrolactone, or bisulfite, or disulfite), and water. The inorganic substance may be a colloidal particle or a powder. The inorganic substance may be present in the chemical fluid in amounts of 0.001% by mass to 50% by mass based on the total mass of the chemical fluid for underground injection. The antioxidant may be present in the chemical fluid at a ratio of 0.0001 to 2 of the mass of the antioxidant to the mass of the inorganic substance. A surface of the inorganic substance may be coated with a silane compound. The chemical fluid may further include an anionic surfactant, a cationic surfactant, an amphoteric surfactant, a nonionic surfactant, or a mixture thereof.
    Type: Application
    Filed: January 11, 2022
    Publication date: March 21, 2024
    Applicants: NISSAN CHEMICAL CORPORATION, NISSAN CHEMICAL AMERICA CORPORATION
    Inventors: Takahiro OHORI, Hirotake KITAGAWA, Satoru MURAKAMI, Samuel MAGUIRE-BOYLE, John SOUTHWELL
  • Publication number: 20240072710
    Abstract: A power conversion device according to the present disclosure has one end connected to a DC voltage source and another end connected to a load, and includes: an inverter circuit which converts DC voltage from the DC voltage source to AC voltage to be outputted to the load, and includes a leg in which an upper arm and a lower arm each having a switching element, and a resistor, are connected in series, and a smoothing capacitor connected in parallel to the leg; a current detection circuit which detects voltage across the resistor, to detect current of the resistor; and a control circuit which controls the inverter circuit. The control circuit corrects the current value detected by the current detection circuit, using an operation condition of the inverter circuit, and controls the inverter circuit using the corrected current value. Thus, error occurring in the current detection circuit can be corrected.
    Type: Application
    Filed: February 2, 2021
    Publication date: February 29, 2024
    Applicant: Mitsubishi Electric Corporation
    Inventors: Satoshi MURAKAMI, Takahiro OKANOUE
  • Publication number: 20240072406
    Abstract: Provided is a distribution circuit which has good pass characteristic and isolation characteristic over a wide band. A distribution circuit, in which Wilkinson-type distribution circuits configured with a coil, a capacitor, and a resistor are cascaded in two stages between an input terminal and at least three terminals, and a capacitor is connected in parallel with the resistor inserted between the output terminals in the latter-stage Wilkinson-type distribution circuits.
    Type: Application
    Filed: December 9, 2021
    Publication date: February 29, 2024
    Inventors: TOMOMICHI MURAKAMI, EIICHI SANO, TAKAHIRO ANDO, NORIHIRO MURAYAMA
  • Publication number: 20230326783
    Abstract: A substrate processing apparatus is disclosed. Exemplary substrate processing apparatus includes a plurality of reaction chambers; a plurality of susceptors disposed within the reaction chambers and configured to support a substrate; a substrate transfer robot disposed within the substrate processing apparatus, comprising: a rotation arm comprising a plurality of arms, the arms configured to transfer the substrate between the reaction chambers; and a rotation shaft connected to the plurality of arms; a motor configured to rotate the rotation shaft; a motor controller configured to drive the motor; and a first sensor with a portion disposed on at least one of the plurality of arms.
    Type: Application
    Filed: April 6, 2023
    Publication date: October 12, 2023
    Inventors: Kazuhiro Nishiwaki, Takahiro Murakami
  • Publication number: 20230198066
    Abstract: A battery pack comprises a battery and a flexible printed circuit board (FPC) utilized to detect a voltage and a temperature of the battery. The FPC comprises a substrate having a front surface and a back surface, a thermistor which detects a temperature of the battery, temperature detection lines and voltage detection lines. The temperature detection lines are electrically connected to a thermistor and arranged between the back surface and the battery. The voltage detection lines are arranged on the front surface so as to overlap the temperature detection lines in a case that the FPC is observed in a plane view in a transmissive manner from a back surface to a front surface.
    Type: Application
    Filed: February 21, 2023
    Publication date: June 22, 2023
    Applicant: DENSO CORPORATION
    Inventors: Takahiro MURAKAMI, Hironobu Kawashima, Hiromi Adachi, Takeshi Honda, Ryo Yamakawa, Hidemitsu Watanabe, Masahiro Sakakibara
  • Patent number: 11631590
    Abstract: A substrate processing method includes preparing a substrate including an etching target film and a mask; etching the etching target film through the mask by plasma; and heat-treating the substrate at a preset temperature after the etching of the etching target film.
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: April 18, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Muneyuki Omi, Taku Gohira, Takahiro Murakami
  • Patent number: 11548827
    Abstract: Provided is a member for a plasma processing apparatus consisting of a tungsten carbide phase. The member includes at least one type of atom selected from the group consisting of a Fe atom, a Co atom, and a Ni atom, in which the total content of the atoms is in a range of 30 to 3300 atomic ppm.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: January 10, 2023
    Assignees: NIPPON TUNGSTEN CO., LTD., TOKYO ELECTRON LIMITED
    Inventors: Takashi Ikeda, Hajime Ishii, Kenji Fujimoto, Naoyuki Satoh, Nobuyuki Nagayama, Koichi Murakami, Takahiro Murakami
  • Publication number: 20220389584
    Abstract: A shower head for plasma processing includes a body part having a first surface, a second surface opposite to the first surface, and a plurality of inner side surfaces. The plurality of inner side surfaces is configured to define a plurality of gas holes penetrating through the body part from the first surface to the second surface. The second surface is made of a first corrosion-resistant material.
    Type: Application
    Filed: June 2, 2022
    Publication date: December 8, 2022
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Ryutaro SUDA, Maju Tomura, Susumu Nogami, Hideaki Yakushiji, Takahiro Murakami, Yusuke Wako
  • Patent number: 11434174
    Abstract: A member for a plasma processing apparatus has a tungsten carbide phase, and a sub-phase including at least one selected from the group consisting of phase I to IV, and phase V, in which the phase I is a carbide phase containing, as a constituent element, at least one of the elements of Group IV, V, and VI of the periodic table excluding W, the phase II is a nitride phase containing, as a constituent element, at least one of the elements of Group IV, V, and VI of the periodic table excluding W, the phase III is a carbonitride phase containing, as a constituent element, at least one of the elements of Group IV, Group V, and Group VI of the periodic table excluding W, the phase IV is a carbon phase, the phase V is a composite carbide phase which is represented by a formula WxMyCz.
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: September 6, 2022
    Assignees: NIPPON TUNGSTEN CO., LTD., TOKYO ELECTRON LIMITED
    Inventors: Takashi Ikeda, Hajime Ishii, Kenji Fujimoto, Naoyuki Satoh, Nobuyuki Nagayama, Koichi Murakami, Takahiro Murakami
  • Publication number: 20210035814
    Abstract: A substrate processing method includes preparing a substrate including an etching target film and a mask; etching the etching target film through the mask by plasma; and heat-treating the substrate at a preset temperature after the etching of the etching target film.
    Type: Application
    Filed: July 31, 2020
    Publication date: February 4, 2021
    Inventors: Muneyuki Omi, Taku Gohira, Takahiro Murakami
  • Patent number: 10867777
    Abstract: A plasma processing method includes: plasma-processing a substrate placed on a surface of a placement table while causing a coolant of 0° C. or lower to flow through a coolant flow path formed inside the table; placing a dummy substrate on the surface of the placement table in place of the substrate; and removing a reaction product generated due to the plasma processing of the substrate by the plasma of the processing gas from a peripheral edge portion of the surface of the placement table while heating the surface of placement table by the plasma of the processing gas via the dummy substrate in a state where the dummy substrate is placed on the surface of the placement table.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: December 15, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Wataru Takayama, Muneyuki Omi, Rei Ibuka, Dai Igarashi, Takayuki Suzuki, Takahiro Murakami
  • Publication number: 20200317583
    Abstract: Provided is a member for a plasma processing apparatus consisting of a tungsten carbide phase. The member includes at least one type of atom selected from the group consisting of a Fe atom, a Co atom, and a Ni atom, in which the total content of the atoms is in a range of 30 to 3300 atomic ppm.
    Type: Application
    Filed: March 25, 2020
    Publication date: October 8, 2020
    Inventors: Takashi IKEDA, Hajime ISHII, Kenji FUJIMOTO, Naoyuki SATOH, Nobuyuki NAGAYAMA, Koichi MURAKAMI, Takahiro MURAKAMI
  • Publication number: 20200317582
    Abstract: A member for a plasma processing apparatus has a tungsten carbide phase, and a sub-phase including at least one selected from the group consisting of phase I to IV, and phase V, in which the phase I is a carbide phase containing, as a constituent element, at least one of the elements of Group IV, V, and VI of the periodic table excluding W, the phase II is a nitride phase containing, as a constituent element, at least one of the elements of Group IV, V, and VI of the periodic table excluding W, the phase III is a carbonitride phase containing, as a constituent element, at least one of the elements of Group IV, Group V, and Group VI of the periodic table excluding W, the phase IV is a carbon phase, the phase V is a composite carbide phase which is represented by a formula WxMyCz.
    Type: Application
    Filed: March 25, 2020
    Publication date: October 8, 2020
    Inventors: Takashi IKEDA, Hajime ISHII, Kenji FUJIMOTO, Naoyuki SATOH, Nobuyuki NAGAYAMA, Koichi MURAKAMI, Takahiro MURAKAMI
  • Patent number: 10784088
    Abstract: A plasma processing method capable of reducing an amount of deposit adhering to an upper electrode or removing the deposit from the upper electrode is provided. In the plasma processing method, the upper electrode of a capacitively coupled plasma processing apparatus is cooled. A supporting table including a lower electrode is provided within a chamber of the plasma processing apparatus. The upper electrode is provided above the supporting table. During the cooling of the upper electrode, a film of a substrate is etched by plasma generated within the chamber. The substrate is placed on the supporting table during the etching of the film. A negative bias voltage is applied to the upper electrode while the etching is being performed.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: September 22, 2020
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Dai Igarashi, Muneyuki Omi, Rei Ibuka, Takahiro Murakami
  • Publication number: 20190326103
    Abstract: A plasma processing method capable of reducing an amount of deposit adhering to an upper electrode or removing the deposit from the upper electrode is provided. In the plasma processing method, the upper electrode of a capacitively coupled plasma processing apparatus is cooled. A supporting table including a lower electrode is provided within a chamber of the plasma processing apparatus. The upper electrode is provided above the supporting table. During the cooling of the upper electrode, a film of a substrate is etched by plasma generated within the chamber. The substrate is placed on the supporting table during the etching of the film. A negative bias voltage is applied to the upper electrode while the etching is being performed.
    Type: Application
    Filed: April 22, 2019
    Publication date: October 24, 2019
    Inventors: Dai Igarashi, Muneyuki Omi, Rei Ibuka, Takahiro Murakami
  • Patent number: D1023074
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: April 16, 2024
    Assignee: KUBOTA CORPORATION
    Inventors: Taiki Furuki, Ryo Masuda, Yuya Kusaka, Ryohei Sumiyoshi, Junichi Murakami, Takahiro Kubo