Abstract: After the name of a signal line is entered, cells are arranged and, a channel to be wired therein is generated. After the completion of global wiring and minute wiring, a compaction process is performed. Here, the transistor density TD of an integrated circuit device to which the compaction process has been executed is compared with a standard value TDst. The compaction process is repeated unless TD>TDst, and terminated when TD >TDst. The time to terminate the compaction process can be judged from objective standards regardless of the level of a designer's skill, so as to keep the layout design of an integrated circuit device above a certain level.

Abstract: A plurality of pixels, each including a photodiode that can make a transition from a first potential state (reset state) into a second potential state variable with the quantity of incident light or vice versa, are provided. A unit compensator includes first and second storage devices implementable as respective MOS capacitors. The first storage device stores thereon charge in a quantity proportional to a difference between a signal potential &phgr;s corresponding to the second potential state of each pixel and a reference potential &phgr;0. The second storage device stores thereon charge in a quantity proportional to a difference between a fixed potential &phgr;d and the reference potential &phgr;0. When a reset potential &phgr;r is supplied from an associated pixel, these storage devices are short-circuited with each other, thereby transferring charge in a quantity proportional to a potential difference (&phgr;s−&phgr;r) between these storage devices.

Abstract: In a semiconductor device, a plurality of bump electrodes are formed for a source pad or a drain pad. The bump electrodes and the source or drain pad are connected with each other through wiring patterns. Thus, the following effect is produced unlike cases where one bump electrode is connected with one source pad or one drain pad through a wiring pattern: An amount of current that passes through each of the bump electrodes can be reduced, so that a breakdown of the bump electrodes is lessened.

Abstract: An information processor of a high reliability and a high recording density, and a blue color, blue-violet color and violet color based semiconductor light emitting device operable at a low threshold current density, used for the same, are provided. An optical information processor of a high reliability and a high recording density enables a moving picture, such as a high-definition television picture, to be recorded and reproduced satisfactorily. A barrier layer in a quantum-well active layer of a semiconductor light emitting device is doped with n-type impurities at a high density. Alternatively, the face orientation of a quantum-well active layer of a semiconductor light emitting device is a plane inclined from the (0001) plane, whereby the threshold current value of the semiconductor light emitting device can be decreased. The semiconductor light emitting device is typified by a gallium nitride based compound semiconductor laser device.

Abstract: In a solid state imaging apparatus, a normal function to read a pixel signal and an electronic shutter function are both realized by using a single shift register. The shift register successively transmits a driving signal supplied from a control unit. A selecting circuit is disposed correspondingly to each row of an imaging unit, and when the driving signal is output from a register corresponding to the row, the selecting circuit selectively executes a read operation or a reset operation in pixels belonging to the corresponding row in accordance with outputs of preceding and following registers. The driving signal is set to be differently supplied between the normal mode and the electronic shutter mode, so that outputs of preceding and following registers can be different between these modes. As a result, a read operation and a reset operation can be selectively conducted in the normal mode and the electronic shutter mode, respectively in the imaging unit.

Abstract: A physical quantity distribution sensor is disclosed. The sensor comprises: a plurality of sensor/storage sections each having a sensor element for sensing a received physical quantity and a storage element for storing the information of physical quantity sensed by the sensor element; a selector for selecting at least one of the sensor/storage sections; and a plurality of buffers each capable of detecting and supplying the information stored in at least one selected sensor/storage section. This sensor further comprises at least one selection signal transfer line for transferring an output of the selector. Power supply input portions of the buffers are connected to the selection signal transfer line, and the buffers are operated using, as a power voltage, an output of the selector entered into the buffers through the selection signal transfer line.

Abstract: A physical quantity distribution sensor is disclosed. The sensor comprises: a plurality of sensor/storage sections each having a sensor element for sensing a received physical quantity and a storage element for storing the information of physical quantity sensed by the sensor element; a selector for selecting at least one of the sensor/storage sections; and a plurality of buffers each capable of detecting and supplying the information stored in at least one selected sensor/storage section. This sensor further comprises at least one selection signal transfer line for transferring an output of the selector. Power supply input portions of the buffers are connected to the selection signal transfer line, and the buffers are operated using, as a power voltage, an output of the selector entered into the buffers through the selection signal transfer line.

Abstract: Provided are highly reliable information processing equipment enabling a high recording density, and a blue color, blue-violet color and violet color based semiconductor light emitting device operable at a low threshold current density, which device is suitable for the information processing equipment. According to the present invention, there can be realized highly reliable optical information processing equipment enabling high recording density, which is capable of sufficiently recording or reproducing a dynamic image in or from a high-definition TV. An n-type impurity is doped in a barrier layer of a quantum-well active layer of a semiconductor light emitting device at a high density. Alternatively, the oriented plane of a quantum-well active layer of a semiconductor light emitting device is inclined from the (0001) plane, whereby the threshold current value of the semiconductor light emitting device can be reduced.

Abstract: A physical quantity distribution sensor is disclosed. The sensor comprises: a plurality of sensor/storage sections each having a sensor element for sensing a received physical quantity and a storage element for storing the information of physical quantity sensed by the sensor element; a selector for selecting at least one of the sensor/storage sections; and a plurality of buffers each capable of detecting and supplying the information stored in at least one selected sensor/storage section. This sensor further comprises at least one selection signal transfer line for transferring an output of the selector. Power supply input portions of the buffers are connected to the selection signal transfer line, and the buffers are operated using, as a power voltage, an output of the selector entered into the buffers through the selection signal transfer line.

Abstract: A physical quantity distribution sensor including a plurality of unit cells. Each unit cell includes an information storage region responsive to a physical stimulus and capable of a transition from a first electrical potential state to a second electrical potential state according to the physical stimulus, a driving element for providing at an output portion thereof an electrical potential according to the electrical potential state of the information storage region, and a switching element for selecting the unit cell. The physical quantity distribution sensor further includes an output adjustment section capable of adjusting the first electrical potential state of the information storage region in order that the output of the selected driving element may substantially equal a reference electrical potential at the time when the switching element is in the conductive state.

Abstract: An information processor of a high reliability and a high recording density, and a blue color, blue-violet color and violet color based semiconductor light emitting device operable at a low threshold current density, used for the same, are provided. An optical information processor of a high reliability and a high recording density enables a moving picture, such as a high-definition television picture, to be recorded and reproduced satisfactorily. A barrier layer in a quantum-well active layer of a semiconductor light emitting device is doped with n-type impurities at a high density. Alternatively, the face orientation of a quantum-well active layer of a semiconductor light emitting device is a plane inclined from the (0001) plane, whereby the threshold current value of the semiconductor light emitting device can be decreased. The semiconductor light emitting device is typified by a gallium nitride based compound semiconductor laser device.

Abstract: The necessary information such as chip area A, number of elements, and defect density D is inputted to calculate element density TD and mean element density TDM. The inverse operation chip area A′ is calculated from the estimation equation: Y=f(A) such as Stapper's equation showing the dependence of the yield on the defect density D and chip area A. Next, for various kinds of integrated circuit devices in a diffusion process, the functional relation g (TD/TDM) which is considered to be most correct is determined from the data of the relationship between the ratio (A′/A) and the ratio (TD/TDM), and from the relational expression g (TD/TDM), the correction factor K is calculated. Finally, the values of the correction factor K and the chip area A are substituted into Y=f(A×K) to calculate the expected yield Y.

Abstract: A solid state imaging device has: a first polysilicon layer 901; a second polysilicon layer 902; a photoelectric converting portion or PD 903; a read gate 904; a read channel 905 (in this case, an N-layer) which is formed in a semiconductor below the read gate; a P-layer 906 which prevents a signal charge from erroneously entering a VCCD of a unit pixel adjacent in a horizontal direction; a P-layer 907 which defines the transfer channel region of a VCCD; and a VCCD 908 which transfers a signal charge in the direction of the arrows. A unit pixel 900 is indicated by a one-dot chain line. The two-dimensionally arrayed solid state imaging device is driven by driving pulses of eight phases in total, namely, a driving pulse &phgr;V1 911, a driving pulse &phgr;V2 912, a driving pulse &phgr;V3 913, a driving pulse &phgr;V4 914, a driving pulse &phgr;V5 915, a driving pulse &phgr;V6 916, a driving pulse &phgr;V7 917, and a driving pulse &phgr;V8 918.

Abstract: A solid-state image pick-up device having a structure in which the amount of transferred charges is not reduced in a vertical CCD portion even if a pixel portion is made finer, and a method for manufacturing the solid-state image pick-up device are provided. A first p-type well and a second p-type well are formed on an N (100) silicon substrate. A vertical CCD n.sup.+ layer is formed in the second p-type well 3. Then, impurity ions are implanted into a surface layer of the N (100) silicon substrate including an upper layer portion of the vertical CCD n.sup.+ layer to form a p.sup.- layer. An isolating portion for isolating photodiode portions from the vertical CCD n.sup.+ layer and a read control portion for controlling the read of charges from the photodiode n layer are simultaneously formed on a portion adjacent to the vertical CCD n.sup.+ layer.

Abstract: Disclosed is a semiconductor device comprising an undoped GaAs layer, an intermediate undoped layer and an undoped Ga.sub.1-x Al.sub.x As layer which are successively provided on a substrate made of a semiinsulating GaAs crystal; the intermediate undoped layer being an undoped In.sub.y Ga.sub.1-y As layer, an undoped GaAs.sub.1-z Sb.sub.z layer, a superlattice layer which includes an undoped In.sub.y Ga.sub.1-y As layer and an undoped GaAs.sub.1-z Sb.sub.z layer, a superlattice layer which includes an undoped In.sub.y Ga.sub.1-y As layer and an undoped GaAs layer, or a superlattice layer which includes an undoped GaAs.sub.1-z Sb layer and an undoped GaAs layer. When applied to a high electron mobility transistor, this semiconductor device affords a high current and a high speed and has the merit of a small dispersion in the threshold voltage thereof.

Abstract: Disclosed is a semiconductor device comprising an undoped GaAs layer, an intermediate undoped layer and an undoped Ga.sub.1-x Al.sub.x As layer which are successively provided on a substrate made of a semiinsulating GaAs crystal; the intermediate undoped layer being an undoped In.sub.y Ga.sub.1-y As layer, an undoped GaAs.sub.1-z Sb.sub.z layer, a superlattice layer which includes an undoped In.sub.y Ga.sub.1-y As layer and an undoped GaAs.sub.1-z Sb.sub.z layer, a superlattice layer which includes an undoped In.sub.y Ga.sub.1-y As layer and an undoped GaAs layer, or a superlattice layer which includes an undoped GaAs.sub.1-z Sb layer and an undoped GaAs layer. When applied to a high electron mobility transistor, this semiconductor device affords a high current and a high speed and has the merit of a small dispersion in the threshold voltage thereof.

Abstract: A solid-state image pick-up device having a structure in which the amount of transferred charges is not reduced in a vertical CCD portion even if a pixel portion is made finer, and a method for manufacturing the solid-state image pick-up device are provided. A first p-type well and a second p-type well are formed on an N (100) silicon substrate. A vertical CCD n.sup.+ layer is formed in the second p-type well 3. Then, impurity ions are implanted into a surface layer of the N (100) silicon substrate including an upper layer portion of the vertical CCD n.sup.+ layer to form a p.sup.- layer. An isolating portion for isolating photodiode portions from the vertical CCD n.sup.+ layer and a read control portion for controlling the read of charges from the photodiode n layer are simultaneously formed on a portion adjacent to the vertical CCD n.sup.+ layer.

Abstract: A charge transfer device has trapezoidal shape impurity-implanted regions (1, 51, . . . ) in n-type regions (271, 371) at least in the through-paths between a first HCCD (27) and a second HCCD (28), and its isolation regions (41) under the transfer gate (29) are trapezoidal shaped, and thereby charge transfer loss and hence FPN is minimized and the transfer efficiency is much improved.

Abstract: A charge transfer device is provided, which includes: a semiconductor substrate having transfer regions for transferring a signal charge; an insulating film formed on the semiconductor substrate; an electrode layer formed above the transfer regions with the insulating film sandwiched therebetween, the electrode layer having high-resistant portions and low-resistant portions alternately provided; and voltage application means for applying a voltage for changing a surface potential of the transfer regions to the low-resistant portions of the electrode layer.

Abstract: An ice making machine in which ice making water in a static or flowing condition is gradually frozen on the surface of an ice making plate cooled at an ice making cycle of the machine, wherein the surface of said ice making plate is made of synthetic resin or glass.