Abstract: A radiation-sensitive resin composition excelling in basic properties as a resist such as sensitivity, resolution, and the like, having a wide depth of focus (DOF) to both a line-and-space pattern and an isolated space pattern, and exhibiting a minimal line width change due to fluctuation of a bake temperature, and having a small line width limit in which the line pattern destroying phenomenon does not occur, and a lactone-containing copolymer useful as a resin component of the composition are provided. The lactone-containing copolymer is represented by a copolymer of the following compounds (1-1), (2-1), and (3-1). The radiation-sensitive resin composition comprises (a) the lactone-containing copolymer and (b) a photoacid generator.

Abstract: A resin composition for forming a top coat which can be formed on a photoresist film without causing intermixing with the photoresist film, can maintain a stable film coating which is not eluted into a medium during immersion lithography, does not impair pattern profiles during dry exposure (which is not immersion lithography), and can be easily dissolved in an alkaline developer. The resin is a copolymer which includes at least one recurring unit (I) selected from the group consisting of a recurring unit having a group shown by the following formula (1), a recurring unit having a group shown by the following formula (2), and a recurring unit having a carboxyl group, and a recurring unit (II) having a sulfo group, the copolymer having a weight average molecular weight determined by gel permeation chromatography of 2,000 to 100,000.

Abstract: Provided is a lithium ion capacitor that can maintain a high capacity retention rate and suppress an increase in internal resistance even after high-load charging-discharging is repeated many times and that has long service life because the occurrence of a short circuit due to precipitation of lithium on the negative electrode is prevented. The lithium ion capacitor comprises a positive electrode, a negative electrode, and an electrolyte solution, the negative electrode including a current collector and electrode layers that contain a negative electrode active material and are formed on front and back surfaces of the current collector, wherein, in the negative electrode, ratios of deviations of respective thicknesses of the electrode layers formed on the front and back surfaces of the current collector from an average of the thicknesses of the electrode layers to the average is ?10 to 10%.

Abstract: An immersion upper layer film composition includes a resin and a solvent. The resin forms a water-stable film during irradiation and is dissolved in a subsequent developer. The solvent contains a monovalent alcohol having 6 or less carbon atoms. The composition is to be applied to form a coat on a photoresist film in an immersion exposure process in which the photoresist film is irradiated through water provided between a lens and the photoresist film.

Abstract: A method is used for removing a metal contaminant deposited on a quartz member selected from the group consisting of a reaction tube, wafer boat, and heat-insulating cylinder of a vertical heat processing apparatus for a semiconductor process. The method includes obtaining the quartz member unattached to the vertical heat processing apparatus; then, performing diluted hydrofluoric acid cleaning of cleaning the quartz member by use of diluted hydrofluoric acid; then, performing first purified water cleaning of cleaning the quartz member by use of purified water; then, performing hydrochloric acid cleaning of cleaning the quartz member by use of hydrochloric acid; and then, performing second purified water cleaning of cleaning the quartz member by use of purified water.

Abstract: An immersion upper layer film composition is provided which exhibits sufficient transparency for the exposure wavelength 248 nm(KrF) and 193 nm(ArF), can form a protective film on the photoresist film without being intermixed with the photoresist film, is not eluted into water used during immersion exposure to maintain a stable film, and can be easily dissolved in an alkaline developer. The composition applied to coat on the photoresist film when using an immersion exposure device which is irradiated through water provided between a lens and the photoresist film, the composition comprises a resin forming a water-stable film during irradiation and being dissolved in a subsequent developer, and a solvent containing a monovalent alcohol having 6 or less carbon atoms, and the resin contains a resin component having an alcoholic hydroxyl group on the side chain containing a fluoroalkyl group on at least the carbon atom of ?-position.

Abstract: Polyurethane elastomer foams can be prepared by mixing an isocyanate-terminated prepolymer obtained by reaction of a polyol with 3,3?-dimethylbiphenyl-4,4?-diisocyanate, with a foaming agent comprising a mixture of water, a low-molecular weight glycol having a molecular weight of 48-200, and a high-molecular weight glycol having a number average molecular weight Mn of 1000-3000 under stirring to conduct foaming reaction. The polyurethane elastomer foams so produced can have a high durability, particularly under a high load, even though a low-cost, easy-to-handle diisocyanate compound is used.

Abstract: A resin composition for forming a top coat which can be formed on a photoresist film without causing intermixing with the photoresist film, can maintain a stable film coating which is not eluted into a medium during immersion lithography, does not impair pattern profiles during dry exposure (which is not immersion lithography), and can be easily dissolved in an alkaline developer. The resin is a copolymer which includes at least one recurring unit (I) selected from the group consisting of a recurring unit having a group shown by the following formula (1), a recurring unit having a group shown by the following formula (2), and a recurring unit having a carboxyl group, and a recurring unit (II) having a sulfo group, the copolymer having a weight average molecular weight determined by gel permeation chromatography of 2,000 to 100,000.

Abstract: A resin composition for forming a top coat which can be formed on a photoresist film without causing intermixing with the photoresist film, can maintain a stable film coating which is not eluted into a medium during immersion lithography, does not impair pattern profiles during dry exposure (which is not immersion lithography), and can be easily dissolved in an alkaline developer. The resin is a copolymer which has a recurring unit (I) having a carboxyl group, a recurring unit (II) having a sulfo group and a recurring unit obtained by copolymerizing fluoroalkyl(meth)acrylates having 1 to 20 carbon atoms in a fluoroalkyl group thereof other than a recurring unit having a side chain that includes an alcoholic hydroxyl group having a fluoroalkyl group at least in an ?-position thereof, the copolymer having a weight average molecular weight determined by gel permeation chromatography of 2,000 to 100,000.

Abstract: Polyurethane elastomer foams can be prepared by mixing an isocyanate-terminated prepolymer obtained by reaction of a polyol with 3,3?-dimethylbiphenyl-4,4?-diisocyanate, with a foaming agent comprising a mixture of water, a low-molecular weight glycol having a molecular weight of 48-200, and a high-molecular weight glycol having a number average molecular weight Mn of 1000-3000 under stirring to conduct foaming reaction. The polyurethane elastomer foams so produced can have a high durability, particularly under a high load, even though a low-cost, easy-to-handle diisocyanate compound is used.

Abstract: A resin composition for forming a top coat which can be formed on a photoresist film without causing intermixing with the photoresist film, can maintain a stable film coating which is not eluted into a medium during immersion lithography, does not impair pattern profiles during dry exposure (which is not immersion lithography), and can be easily dissolved in an alkaline developer. The resin is a copolymer which comprises at least one recurring unit (I) selected from the group consisting of a recurring unit having a group shown by the following formula (1), a recurring unit having a group shown by the following formula (2), and a recurring unit having a carboxyl group, and a recurring unit (II) having a sulfo group, the copolymer having a weight average molecular weight determined by gel permeation chromatography of 2,000 to 100,000, wherein at least one of R1 and R2 is a fluoroalkyl group having 1 to 4 carbon atoms and R3 in the formula (2) represents a fluoroalkyl group having 1 to 20 carbon atoms.

Abstract: A method is used for removing a metal contaminant deposited on a quartz member selected from the group consisting of a reaction tube, wafer boat, and heat-insulating cylinder of a vertical heat processing apparatus for a semiconductor process. The method includes obtaining the quartz member unattached to the vertical heat processing apparatus; then, performing diluted hydrofluoric acid cleaning of cleaning the quartz member by use of diluted hydrofluoric acid; then, performing first purified water cleaning of cleaning the quartz member by use of purified water; then, performing hydrochloric acid cleaning of cleaning the quartz member by use of hydrochloric acid; and then, performing second purified water cleaning of cleaning the quartz member by use of purified water.

Abstract: A silicon dioxide film removing method is capable of removing a silicon dioxide film, such as a natural oxide film or a chemical oxide film, at a temperature considerably higher than a room temperature. The silicon dioxide film removing method of removing a silicon dioxide film formed on a workpiece in a processing vessel 18 that can be evacuated uses a mixed gas containing HF gas and NH3 gas for removing the silicon dioxide film. The silicon dioxide film can be efficiently removed from the surface of the workpiece by using the mixed gas containing HF gas and NH3 gas.

Abstract: Disclosed is a photosensitive resin composition comprising (A) a polyimide resin, (B) a photo-acid generator, and (C) a crosslinking agent having an alkoxyalkylated amino group.

Abstract: (A) a polycarbonatediol, (B) a trifunctional alcohol, and (C) a diisocyanate are subjected to reaction in the presence of (D) a (meth)acrylate compound represented by the general formula CH2?CRCO(OCnH2n)pR? or CH2?CRCO(OCmH2m)qOCOCH?CH2, and (E) a di(meth)acrylate compound of alkylene glycol whose alkylene group is substituted as a lower alkyl group, and then (F) a hydroxyl group-containing (meth)acrylate is added to the resulting solution of urethane oligomers in (meth)acrylate to conduct terminal (meth)acrylating reaction of the urethane oligomers, thereby producing a UV-curable liquid polyurethane resin having a viscosity (25° C.) of preferably 150,000-1,000,000 mPa·s, where before or after the terminal (meth)acrylating reaction of the urethane oligomers (G) a photopolymerization initiator and (H) a hindered phenol-based antioxidant having a molecular weight of 500-2,000 are added thereto to form the UV-curable liquid polyurethane resin.

Abstract: A radiation-sensitive resin composition excelling in basic properties as a resist such as sensitivity, resolution, and the like, having a wide depth of focus (DOF) to both a line-and-space pattern and an isolated space pattern, and exhibiting a minimal line width change due to fluctuation of a bake temperature, and having a small line width limit in which the line pattern destroying phenomenon does not occur, and a lactone-containing copolymer useful as a resin component of the composition are provided. The lactone-containing copolymer is represented by a copolymer of the following compounds (1-1), (2-1), and (3-1). The radiation-sensitive resin composition comprises (a) the lactone-containing copolymer and (b) a photoacid generator.

Abstract: A radiation-sensitive resin composition exhibiting only extremely controlled change in the sensitivity after storage when used as a chemically-amplified resist possessing high transparency at a wavelength of 193 nm or less and particularly excellent depth of focus (DOF) is provided. The radiation-sensitive resin composition comprises (A) a siloxane resin having a structural unit (I) shown by the following formula (I) and/or a structural unit (II) shown by the following formula (II), (B) a photoacid generator, and (C) a solvent, the content of nitrogen-containing compounds in the composition being not more than 100 ppm, wherein A and B individually represent a substituted or unsubstituted divalent linear, branched, or cyclic hydrocarbon group, R1 represents a monovalent acid-dissociable group, and R2 represents a hydrogen atom or monovalent acid-dissociable group.

Abstract: A chip type electronic component for test is provided with an element body, and four or more terminal electrodes placed on the exterior of the element body. The element body has a plurality of laminated insulator layers, and a plurality of internal electrodes arranged to be opposed to each other with the insulator layer in between. Each of the internal electrodes is connected to at least one same terminal electrode out of the four or more terminal electrodes and connected to any one terminal electrode except for the at least one same terminal electrode.

Abstract: An elapsed cycle number during the predetermined period of the inputted clock source is counted using the clock reference signal as a yardstick, a frequency of the clock source is computed based on an elapsed cycle number obtained by counting, control timing of various interfaces relating to the CPU is adjusted and an interruption generating interval in which interruption is generated regularly by the CPU so that adjustment of control timing of various interfaces and setting of a timer interruption interval during the OS operation in accordance with a frequency of the clock source without performing OS modification such as rebuilding and the like.

Abstract: A resin composition for forming a top coat which can be formed on a photoresist film without causing intermixing with the photoresist film, can maintain a stable film coating which is not eluted into a medium during immersion lithography, does not impair pattern profiles during dry exposure (which is not immersion lithography), and can be easily dissolved in an alkaline developer. The resin is a copolymer which comprises at least one recurring unit (I) selected from the group consisting of a recurring unit having a group shown by the following formula (1), a recurring unit having a group shown by the following formula (2), and a recurring unit having a carboxyl group, and a recurring unit (II) having a sulfo group, the copolymer having a weight average molecular weight determined by gel permeation chromatography of 2,000 to 100,000, wherein at least one of R1 and R2 is a fluoroalkyl group having 1 to 4 carbon atoms and R3 in the formula (2) represents a fluoroalkyl group having 1 to 20 carbon atoms.