Patents by Inventor Takashi Imoto

Takashi Imoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210320550
    Abstract: A motor includes a support frame, a stator, a bearing member, and a rotor. The support frame includes first and second tubular parts, and a vent hole. The second tubular part is disposed radially outside the first tubular part. The vent hole, extending axially, is provided between the first and second tubular parts. The stator is disposed radially outside the second tubular part, and supported by the second tubular part. The bearing member is disposed inside and supported by the first tubular part. The rotor includes a rotor frame, a shaft, and a permanent magnet. The rotor frame is disposed on a first side with respect to the support frame in the axial direction. The shaft is fixed to the rotor frame. The shaft is attached rotatably to the support frame through the bearing member. The permanent magnet is disposed radially outside the stator, and supported by the rotor frame.
    Type: Application
    Filed: March 15, 2021
    Publication date: October 14, 2021
    Inventors: Yoshifumi SHIMOGAKI, Takashi IMOTO
  • Publication number: 20210238382
    Abstract: Provided is a novel flame retardant coating film excellent in flame retardancy. A flame retardant coating film according to one embodiment of the present invention is formed from a paint composition (A) including a binder resin, a low-melting point inorganic substance, and a high-melting point inorganic substance. A flame retardant coating film according to another embodiment of the present invention is formed from a paint composition (B) including a binder resin that produces a high-melting point inorganic substance when heated, and a low-melting point inorganic substance.
    Type: Application
    Filed: June 18, 2019
    Publication date: August 5, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yusuke SUGINO, Takashi IMOTO, Daisuke KAWANISHI, Mayu KINOSHITA
  • Publication number: 20210230483
    Abstract: Provided is a novel flame retardant material excellent in flame retardancy. A flame retardant material according to one embodiment of the present invention is formed from a resin composition (A) including a binder resin, a low-melting point inorganic substance, and a high-melting point inorganic substance. A flame retardant material according to another embodiment of the present invention is formed from a resin composition (B) including a binder resin that produces a high-melting point inorganic substance when heated, and a low-melting point inorganic substance.
    Type: Application
    Filed: June 18, 2019
    Publication date: July 29, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yusuke SUGINO, Takashi IMOTO, Daisuke KAWANISHI, Mayu KINOSHITA
  • Publication number: 20210115217
    Abstract: Provided is a novel flame retardant material excellent in flame retardancy. A flame retardant material according to one embodiment of the present invention is formed from a resin composition (A) including a binder resin, wherein the flame retardant material shows a weight loss of 48 wt % or less measured by thermogravimetric analysis including scanning the flame retardant material under an air atmosphere at a rate of temperature increase of 50° C./min from room temperature to 1,000° C.
    Type: Application
    Filed: June 18, 2019
    Publication date: April 22, 2021
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yusuke SUGINO, Takashi IMOTO, Daisuke KAWANISHI, Mayu KINOSHITA
  • Patent number: 10799156
    Abstract: An identification sheet (X1) according to the present invention includes a backing sheet (10) and a pressure-sensitive adhesive sheet (20). The backing sheet (10) bears a distinguishing mark (M1). The pressure-sensitive adhesive sheet (20) has a multilayer structure including a substrate layer (21) and a pressure-sensitive adhesive layer (22). The pressure-sensitive adhesive layer (22) is removably attachable to the backing sheet (10). The pressure-sensitive adhesive sheet (20) bears a distinguishing mark (M2). The identification sheet (X1) as above is suitable for keeping on surely providing the admissibility of evidence of a collected target material to be identified.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: October 13, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Takashi Imoto, Akinori Nishio
  • Publication number: 20190244912
    Abstract: According to one embodiment, a semiconductor device includes a wiring board that has a first surface and a second surface opposed to the first surface, a semiconductor chip provided on the first surface, external connection terminals provided on the second surface, a sealing resin layer provided on the first surface, and a conductive shield layer that covers at least a portion of a side surface of the wiring board and the sealing resin layer. The wiring board includes a first ground wire that is electrically connected to the conductive shield layer, and a second ground wire that is electrically connected to the conductive shield layer and is electrically insulated from the first ground wire.
    Type: Application
    Filed: April 17, 2019
    Publication date: August 8, 2019
    Inventors: Yuusuke TAKANO, Yoshiaki GOTO, Takeshi WATANABE, Takashi IMOTO
  • Patent number: 10312197
    Abstract: According to one embodiment, a method of manufacturing a semiconductor device includes forming a sealing resin layer containing an inorganic filler so as to seal a semiconductor chip, removing a portion of the surface of the sealing resin layer by dry etching such that a portion of the inorganic filler is exposed, and forming a shield layer so as to cover at least the sealing resin layer.
    Type: Grant
    Filed: September 2, 2014
    Date of Patent: June 4, 2019
    Assignee: Toshiba Memory Corporation
    Inventors: Yuusuke Takano, Takashi Imoto, Takeshi Watanabe, Soichi Homma, Katsunori Shibuya
  • Publication number: 20190048232
    Abstract: An identification sheet (X1) according to the present invention includes a pressure-sensitive adhesive sheet (20) including a pressure-sensitive adhesive layer (22). The pressure-sensitive adhesive layer (22) contains a polyester polyurethane as a principal component. The polyester polyurethane is typically a polyester-polyether polyurethane. The identification pressure-sensitive sheet (X1) is suitable for resisting thermal deformation in the pressure-sensitive adhesive layer (22).
    Type: Application
    Filed: November 29, 2016
    Publication date: February 14, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Akinori NISHIO, Takashi IMOTO
  • Publication number: 20190046088
    Abstract: An identification sheet (X1) according to the present invention includes a backing sheet (10) and a pressure-sensitive adhesive sheet (20). The backing sheet (10) bears a distinguishing mark (M1). The pressure-sensitive adhesive sheet (20) has a multilayer structure including a substrate layer (21) and a pressure-sensitive adhesive layer (22). The pressure-sensitive adhesive layer (22) is removably attachable to the backing sheet (10). The pressure-sensitive adhesive sheet (20) bears a distinguishing mark (M2). The identification sheet (X1) as above is suitable for keeping on surely providing the admissibility of evidence of a collected target material to be identified.
    Type: Application
    Filed: November 29, 2016
    Publication date: February 14, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Takashi IMOTO, Akinori NISHIO
  • Publication number: 20180219719
    Abstract: An information processing method of the present invention includes: a transmission control step of performing transmission control of data to a server; a storage control step of storing backup data for data to be transmitted to the server; and an acquisition step of acquiring a retention period of data transmitted to the server. In the transmission control step, in a case where the transmission control was stopped and is started again and the acquired retention period continues, the stored backup data is transmitted so as to be continued from data that was transmitted to the server until the transmission control was stopped.
    Type: Application
    Filed: December 22, 2017
    Publication date: August 2, 2018
    Inventors: Jun Hasegawa, Takashi Imoto
  • Patent number: 9824905
    Abstract: A semiconductor manufacturing device has an upper cover configured to be arranged above top surface of unshielded semiconductor device which are mounted on a tray placed on a carrier to go through electromagnetic shielding, and a displacement detector configured to detect an abnormality when the upper cover is raised by at least one of the semiconductor device which is brought into contact with a bottom surface of the upper cover.
    Type: Grant
    Filed: September 10, 2014
    Date of Patent: November 21, 2017
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Katsunori Shibuya, Takashi Imoto, Soichi Homma, Takeshi Watanabe, Yuusuke Takano
  • Patent number: 9458535
    Abstract: A semiconductor manufacturing device has a conveyor configured to convey a tray having an unshielded semiconductor device mounted thereon to go through electromagnetic shielding, and a controller configured to control the conveyor. The controller performs control to take out the tray from a tray supply storage storing trays each having an unshielded semiconductor device mounted thereon to go through the electromagnetic shielding, place the tray on a carrier, and convey this carrier to a sputtering device which coats the unshielded semiconductor device with a sputtering material for the electromagnetic shielding, and the controller performs control to take out, from the sputtering device, the carrier having the tray placed thereon with an electromagnetically shielded semiconductor device being mounted on the tray, convey the tray, pick up the tray having the electromagnetically shielded semiconductor device mounted thereon from the carrier, and store the tray in the tray supply storage.
    Type: Grant
    Filed: September 10, 2014
    Date of Patent: October 4, 2016
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Katsunori Shibuya, Takashi Imoto, Soichi Homma, Takeshi Watanabe, Yuusuke Takano
  • Patent number: 9385090
    Abstract: A semiconductor device includes a conductive shield layer that has a first portion covering a surface of a sealing resin layer and a second portion covering side surfaces of the sealing resin layer and side surfaces of the substrate. Portions of wiring layers, including a grounding wire, on or in the substrate have cut planes which are exposed to the side surfaces of the substrate and spread out in a thickness direction of the substrate. A cut plane of the grounding wire is electrically connected to the shield layer. An area of the cut plane of the grounding wire is larger than an area of a cross section of the grounding wire parallel to, and inward of the substrate from, the cut plane of the grounding wire.
    Type: Grant
    Filed: September 2, 2014
    Date of Patent: July 5, 2016
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Katsunori Shibuya, Takashi Imoto, Soichi Homma, Takeshi Watanabe, Yuusuke Takano
  • Patent number: 9207889
    Abstract: An information processing apparatus and method includes determining whether print data is limited in a number of times of printing, determining whether a setting of storing the print data in the information processing apparatus is valid, and stopping transmission of the print data in a case where it is determined that the print data is limited in the number of times of printing and it is determined that the setting is valid.
    Type: Grant
    Filed: April 2, 2012
    Date of Patent: December 8, 2015
    Assignee: Canon Kabushiki Kaisha
    Inventor: Takashi Imoto
  • Patent number: 9209053
    Abstract: In a manufacturing method of a semiconductor device according to an embodiment, a plurality of semiconductor packages each including a semiconductor chip mounted on a wiring board and a sealing resin layer as objects to be processed, and a tray including a plurality of housing parts are prepared. A depressed portion having a non-penetrating shape or a penetrating shape is formed in the housing part. The semiconductor packages are disposed in the plural housing parts respectively. By sputtering a metal material on the semiconductor package housed in the tray, a conductive shield layer is formed.
    Type: Grant
    Filed: September 10, 2014
    Date of Patent: December 8, 2015
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Yoshiaki Goto, Takashi Imoto, Takeshi Watanabe, Yuusuke Takano, Yusuke Akada, Yuji Karakane, Yoshinori Okayama, Akihiko Yanagida
  • Publication number: 20150167157
    Abstract: A semiconductor manufacturing device has an upper cover configured to be arranged above top surface of unshielded semiconductor device which are mounted on a tray placed on a carrier to go through electromagnetic shielding, and a displacement detector configured to detect an abnormality when the upper cover is raised by at least one of the semiconductor device which is brought into contact with a bottom surface of the upper cover.
    Type: Application
    Filed: September 10, 2014
    Publication date: June 18, 2015
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Katsunori Shibuya, Takashi Imoto, Soichi Homma, Takeshi Watanabe, Yuusuke Takano
  • Publication number: 20150167156
    Abstract: A semiconductor manufacturing device has a conveyor configured to convey a tray having an unshielded semiconductor device mounted thereon to go through electromagnetic shielding, and a controller configured to control the conveyor. The controller performs control to take out the tray from a tray supply storage storing trays each having an unshielded semiconductor device mounted thereon to go through the electromagnetic shielding, place the tray on a carrier, and convey this carrier to a sputtering device which coats the unshielded semiconductor device with a sputtering material for the electromagnetic shielding, and the controller performs control to take out, from the sputtering device, the carrier having the tray placed thereon with an electromagnetically shielded semiconductor device being mounted on the tray, convey the tray, pick up the tray having the electromagnetically shielded semiconductor device mounted thereon from the carrier, and store the tray in the tray supply storage.
    Type: Application
    Filed: September 10, 2014
    Publication date: June 18, 2015
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Katsunori SHIBUYA, Takashi IMOTO, Soichi HOMMA, Takeshi WATANABE, Yuusuke TAKANO
  • Publication number: 20150170988
    Abstract: According to one embodiment, a plurality of semiconductor devices is mounted on a wiring substrate. A surface, on which a semiconductor devices of the wiring substrate are mounted, and the plurality of semiconductor devices are sealed by using a sealing resin. The wiring substrate which is sealed is cut and thus separated into semiconductor apparatuses. The semiconductor apparatuses after the separation are heated. A shield layer is formed by metal sputtering over wiring exposed at the edge of the cut wiring substrate and the sealing resin of the semiconductor apparatus, after the heating.
    Type: Application
    Filed: September 2, 2014
    Publication date: June 18, 2015
    Inventors: Takeshi WATANABE, Takashi IMOTO, Yuusuke TAKANO, Soichi HOMMA, Katsunori SHIBUYA
  • Publication number: 20150171021
    Abstract: According to one embodiment, a method of manufacturing a semiconductor device includes forming a sealing resin layer containing an inorganic filler so as to seal a semiconductor chip, removing a portion of the surface of the sealing resin layer by dry etching such that a portion of the inorganic filler is exposed, and forming a shield layer so as to cover at least the sealing resin layer.
    Type: Application
    Filed: September 2, 2014
    Publication date: June 18, 2015
    Inventors: Yuusuke TAKANO, Takashi IMOTO, Takeshi WATANABE, Soichi HOMMA, Katsunori SHIBUYA
  • Publication number: 20150171060
    Abstract: In a manufacturing method of a semiconductor device according to an embodiment, a plurality of semiconductor packages each including a semiconductor chip mounted on a wiring board and a sealing resin layer as objects to be processed, and a tray including a plurality of housing parts are prepared. A depressed portion having a non-penetrating shape or a penetrating shape is formed in the housing part. The semiconductor packages are disposed in the plural housing parts respectively. By sputtering a metal material on the semiconductor package housed in the tray, a conductive shield layer is formed.
    Type: Application
    Filed: September 10, 2014
    Publication date: June 18, 2015
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Yoshiaki GOTO, Takashi IMOTO, Takeshi WATANABE, Yuusuke TAKANO, Yusuke AKADA, Yuji KARAKANE, Yoshinori OKAYAMA, Akihiko YANAGIDA