Abstract: The present invention relates to a laser marking label for forming patterns by a process including the step of selectively destroying a recording layer with a laser beam and exposing lower layers, wherein the laser marking label contains at least a recording layer, a backing layer, a ground layer, a shielding layer, and an adhesive layer, in this order, wherein each of the layers is directly or indirectly laminated. According to the laser marking label of the present invention, patterns of a workpiece or an opening part can be covered for the designing property and prevention of erroneous operation of an optical sensor, and the label can also serve as a display, in other words, excellent shielding ability in both line image portions and non-line image portions can be provided. Also at the same time, a display of white line images on a black background, sufficient durability and sufficient resolution can be realized.

Abstract: A semiconductor device is disclosed, which comprises a semiconductor element in which a laminated film composed of a plurality of layers including an insulating film is formed on a surface of a semiconductor substrate, and a portion of the laminated film is removed from the surface of the semiconductor substrate so that the semiconductor substrate is exposed at the portion, a mounting substrate on which the semiconductor element is mounted, and a resin layer which seals at least a surface side of the semiconductor element with resin.

Abstract: A mechanism for executing an optimum cancelling method from among a plurality of cancelling methods for many various print environments in a user's environment. The mechanism obtains limitation information of the cancellation and determines a the optimum cancelling method among the plurality of cancelling methods. The mechanism then executes the determined optimum cancelling method.

Abstract: A semiconductor device is disclosed, which comprises a semiconductor element in which a laminated film composed of a plurality of layers including an insulating film is formed on a surface of a semiconductor substrate, and a portion of the laminated film is removed from the surface of the semiconductor substrate so that the semiconductor substrate is exposed at the portion, a mounting substrate on which the semiconductor element is mounted, and a resin layer which seals at least a surface side of the semiconductor element with resin.

Abstract: A printing apparatus includes a plate cylinder having a relief plate mounted on at least a part of an outer periphery of the plate cylinder and being operable to be rotationally driven about a shaft center, and an impression cylinder having a rigid outer periphery and being operable to be rotationally driven about a shaft center parallel to the shaft center of the plate cylinder. The impression cylinder is adapted to be brought into pressure contact with the relief plate via a sheet-like print object fed between the plate cylinder and the impression cylinder. A cushioning sheet is attachable to and detachable from the outer periphery of the impression cylinder. The cushioning sheet is elastically deformable when being brought into pressure contact with the relief plate on the plate cylinder via the print object. The cushioning sheet is restorable when being separated from the relief plate on the plate cylinder.

Abstract: There is disclosed a semiconductor device comprising at least one semiconductor element, one chip mounting base being provided at least one first interconnection on one major surface thereof and at least one second interconnection on the other major surface thereof, and the semiconductor element being electrically connected to at least the one first interconnection and mounted on the one major surface, a sealing member being provided on the one major surface of the chip mounting base and covering the semiconductor element and the first interconnection, at least one third interconnection being provided on a surface of the sealing member, and at least one fourth interconnection being provided in the sealing member and the chip mounting base, and electrically connected to the first interconnection, the second interconnection, and the third interconnection.

Abstract: There is disclosed a semiconductor device comprising at least one semiconductor element, one chip mounting base being provided at least one first interconnection on one major surface thereof and at least one second interconnection on the other major surface thereof, and the semiconductor element being electrically connected to at least the one first interconnection and mounted on the one major surface, a sealing member being provided on the one major surface of the chip mounting base and covering the semiconductor element and the first interconnection, at least one third interconnection being provided on a surface of the sealing member, and at least one fourth interconnection being provided in the sealing member and the chip mounting base, and electrically connected to the first interconnection, the second interconnection, and the third interconnection.

Abstract: When the condition information of a printing apparatus contains a plurality of error/warning information, the printing apparatus determines the priority orders of the error/warning information and whether the plurality of error/warning information are to be notified, based on the print setting information of input print data. Based on the determination result, the printing apparatus generates status information which contains the plurality of error/warning information, their priority order and notification necessary/unnecessary information representing whether the plurality of error/warning information are to be notified. The printing apparatus displays display information corresponding to the error/warning information on the display unit, based on the plurality of error/warning information, their priority orders and the notification necessary/unnecessary information in the generated status information.

Abstract: A semiconductor device includes a substrate having first and second surfaces, the substrate having an opening; a first adhesive layer provided on the first surface; a second adhesive layer provided under the second surface; a third adhesive layer provided around the opening; a semiconductor chip arranging a plurality of chip bonding pads in a central portion of the semiconductor chip and adhered on the third adhesive layer; substrate bonding pads adhered under the second adhesive layer; bonding wires connecting the chip bonding pads to the substrate bonding pads; and an encapsulating resin provided around the semiconductor chip.

Abstract: A semiconductor device is disclosed, which comprises a semiconductor element in which a laminated film composed of a plurality of layers including an insulating film is formed on a surface of a semiconductor substrate, and a portion of the laminated film is removed from the surface of the semiconductor substrate so that the semiconductor substrate is exposed at the portion, a mounting substrate on which the semiconductor element is mounted, and a resin layer which seals at least a surface side of the semiconductor element with resin.

Abstract: An optical semiconductor module comprises an optical transmission channel including a waveguide transmitting a light beam, a holding member whose holding member holds the channel with the end of the channel being exposed from the surface, electric wiring formed on the surface, an optical semiconductor element, mounted above the surface, including an active area to emit or receive a light beam and an electrode pad electrically connected to the electric wiring, the active area optically coupled to the waveguide at the end of the channel, and an electrical insulation film between the optical semiconductor element and the holding member, including openings each corresponding to an electrical connection between the electrode pad and the electric wiring, and an optically coupling portion between the active area and the waveguide, the electrical insulation film being in contact with a portion of the end of the channel.

Abstract: A semiconductor device is disclosed, which comprises a semiconductor element in which a laminated film composed of a plurality of layers including an insulating film is formed on a surface of a semiconductor substrate, and a portion of the laminated film is removed from the surface of the semiconductor substrate so that the semiconductor substrate is exposed at the portion, a mounting substrate on which the semiconductor element is mounted, and a resin layer which seals at least a surface side of the semiconductor element with resin.

Abstract: Information related to ink mounted to a printer that performs printing is acquired, and information for designating a type of ink that has been set to be used in printing by the printer is acquired. Based on the set type of ink and acquired information, it is determined whether or not the printer can print with a type of ink other than the set type of ink to be used. If it is determined that the printing is possible, displaying is executed to have a user confirm the set type of ink.

Abstract: A printing apparatus can quickly cancel a print job without any influence on the other subsequent print jobs when a print cancel instruction is issued. During printing, if a print cancel instruction is inputted from a printer operation unit, a printer function manager notifies a print command interpreter of the cancellation. The print command interpreter searches data processed at that time in a transmission/reception buffer for an end mark command indicating the end of the cancelled job. Then the print command interpreter deletes the data before the end mark command.

Abstract: A surface mount type semiconductor device comprises a support substrate having mutually opposed first and second surfaces, and having a slit at a central part thereof, a semiconductor element including electrode pads at least a central part thereof, the semiconductor element being mounted on the first surface such that the electrode pads are located within the slit, a width of the semiconductor element is less than a longitudinal length of the slit and both ends of the slit are located outside end portions of the semiconductor element, metal fine wires for electrically connecting the electrode pads to the connection terminals on the second surface, a first seal resin member provided to seal the semiconductor element on the first surface, and a second seal resin member provided to seal the slit on the second surface.

Abstract: An optical semiconductor module comprises an optical transmission channel including a waveguide transmitting a light beam, a holding member whose holding member holds the channel with the end of the channel being exposed from the surface, electric wiring formed on the surface, an optical semiconductor element, mounted above the surface, including an active area to emit or receive a light beam and an electrode pad electrically connected to the electric wiring, the active area optically coupled to the waveguide at the end of the channel, and an electrical insulation film between the optical semiconductor element and the holding member, including openings each corresponding to an electrical connection between the electrode pad and the electric wiring, and an optically coupling portion between the active area and the waveguide, the electrical insulation film being in contact with a portion of the end of the channel.

Abstract: An optical semiconductor module comprises an optical transmission channel including a waveguide transmitting a light beam, a holding member whose holding member holds the channel with the end of the channel being exposed from the surface, electric wiring formed on the surface, an optical semiconductor element, mounted above the surface, including an active area to emit or receive a light beam and an electrode pad electrically connected to the electric wiring, the active area optically coupled to the waveguide at the end of the channel, and an electrical insulation film between the optical semiconductor element and the holding member, including openings each corresponding to an electrical connection between the electrode pad and the electric wiring, and an optically coupling portion between the active area and the waveguide, the electrical insulation film being in contact with a portion of the end of the channel.

Abstract: The pressure-sensitive adhesive product has a constitution wherein a pressure-sensitive adhesive layer is formed on at least one surface of a substrate, the substrate being formed from a resin composition containing an acrylonitrile-styrene copolymer and an acrylonitrile-styrene-acrylic rubber copolymer as main components and the weight ratio of the acrylonitrile-styrene copolymer to the acrylonitrile-styrene-acrylic rubber copolymer being 90/10 to 20/80. The above resin composition preferably has a form where the acrylonitrile-styrene-acrylic rubber copolymer is dispersed in the acrylonitrile-styrene copolymer.

Abstract: A pressure-sensitive adhesive product contains a substrate having formed on at least one surface thereof a pressure-sensitive adhesive layer, wherein the substrate is formed from a styrene-based resin composition and the pressure-sensitive adhesive layer is formed from an acrylic pressure-sensitive adhesive containing an acrylic polymer, a liquid paraffin, and a rosin-based tackifying resin. In the acrylic pressure-sensitive adhesive, the ratio of the liquid paraffin is preferably 6 to 50 parts by weight based on 100 parts by weight of the acrylic polymer and the ratio of the rosin-based tackifying resin is preferably 1 to 30 parts by weight based on 100 parts by weight of the acrylic polymer. The liquid paraffin may have a number-average molecular weight of 300 to 500 and may have a dynamic viscosity at 37.8° C. of 6 to 80 mm2/second.

Abstract: A semiconductor device includes a substrate having first and second surfaces, the substrate having an opening; a first adhesive layer provided on the first surface; a second adhesive layer provided under the second surface; a third adhesive layer provided around the opening; a semiconductor chip arranging a plurality of chip bonding pads in a central portion of the semiconductor chip and adhered on the third adhesive layer; substrate bonding pads adhered under the second adhesive layer; bonding wires connecting the chip bonding pads to the substrate bonding pads; and an encapsulating resin provided around the semiconductor chip.