Abstract: A laser machining method includes, before laser machining: calculating the amount of focus movement on the basis of a first measurement value measured with the external optical system warmed up and being the amount of energy of a laser beam passing through a small-diameter hole and a first reference value (database D1) predetermined depending on the type of contamination of the external optical system in relation to the first measurement value; and compensating the focus position in laser machining on the basis of the calculated amount of focus movement.

Abstract: According to one embodiment, a semiconductor device includes: a wiring layer including a first metallic film provided on an oxide film, a second metallic film provided on the first metallic film, and a polysilicon film provided on the second metallic film; and an element layer provided on the wiring layer and including semiconductor elements electrically connected to the first metallic film. Standard Gibbs energy of formation of a first metal included in the first metallic film is lower than that of a second metal included in the second metallic film.

Abstract: A control device controls an internal combustion engine including: an elastic wave sensor arranged and configured to output a signal responsive to the strength of an acoustic emission wave produced at a sliding portion; and a variable oil pump. The control device is configured to execute an oil pressure control such that the oil pressure approaches a target oil pressure according to an engine operating condition. This oil pressure control includes a first pressure-increase processing executed where an AE correlation value correlated with the strength or occurrence frequency of the acoustic emission wave detected by the elastic wave sensor is greater than a first threshold value. The first pressure-increase processing increases the target oil pressure associated with a first engine operating condition present when the AE correlation value becomes greater than the first threshold value, as compared to when the AE correlation value is not greater than that.

Abstract: A laser machining head has a function of rectifying an assist gas and includes a protection window, a nozzle configured to blow the assist gas over a workpiece, a chamber defining a space between the protection window and the nozzle, an inflow port disposed in a chamber and configured to allow the assist gas to flow in, and a flow dividing projection disposed at a position opposing to the inflow port and configured to divide the assist gas from the inflow port into a first flow and a second flow flowing along a circumferential direction around an optical axis of a laser beam.

Abstract: To provide a nozzle for laser processing head capable of reliably drilling a small hole when drilling of the workpiece is performed by using a laser machine. A nozzle includes: a nozzle tip body that irradiates a workpiece with a laser beam; a charge port formed in the nozzle tip body; an exhaust port formed in the nozzle tip body so as to oppose to the charge port; and an elastic member that is provided in a tip end of the nozzle tip body and contacts with the workpiece while elastically extending and contracting in the axial center direction of the nozzle tip body. The nozzle supplies gas to the inside of the nozzle tip body along a gas flow path extending from the charge port to the exhaust port in a form of crossing across the laser beam in the nozzle tip body, to generate a negative pressure in the vicinity of an opening part of a tip end of the nozzle tip body. The elastic member contacts with the workpiece and improves the degree of enclosure of the nozzle tip body by the workpiece.

Abstract: A laser machining head includes a protection window disposed inclined with respect to an optical axis of a laser beam, an inflow port disposed downstream of the protection window and configured to allow a gas to flow in, and a flow dividing projection configured to divide the gas into a first laminar flow flowing along parallel to a surface of the protection window and a second laminar flow flowing toward a workpiece. The flow dividing projection is disposed in a position opposing to the inflow port with the optical axis of the laser beam as the center.

Abstract: A laser machining device includes a storage unit configured to store a reference value based on an energy amount of returning light when laser light is emitted, in a state where external optical system is not contaminated, toward a reflection plate with a predetermined output low enough not to melt or deform the reflection plate such that a focus position of the laser light aligns with a predetermined position, and a processing condition correction unit configured to correct, prior to laser machining, a processing condition in accordance with the contamination level of the external optical system, wherein the processing condition correction unit includes a laser power correction section configured to correct a laser power of the processing condition based on the measurement value measured by a returning light measurement unit and the reference value.

Abstract: A laser machine able to effectively satisfy cutting quality required on one side of a cutting spot of a workpiece. The laser machine comprising a machining head configured to emit a laser beam and an assist gas coaxially and non-coaxially; and a data table in which data of a machining condition for cutting a workpiece using the machining head, and a shift amount, by which a center axis of the assist gas is to be shifted from an optical axis of the laser beam in order to make cutting quality on both sides of a cutting line to be different during cutting the workpiece, are stored in associated with each other.

Abstract: A machine learning apparatus able to obtaining an optimal shift amount of an assist gas. The machine learning apparatus comprises a state-observation section configured to observe machining condition data included in a machining program given to the laser machine, and measurement data of a dimension of dross generated at a cutting spot of the workpiece when the machining program is executed, as a state variable representing a current state of an environment in which the workpiece is cut; and a learning section configured to learn the shift amount in association with cutting quality of the workpiece, using the state variable.

Abstract: A laser processing device includes a beam splitter disposed between a focusing lens and a protective window, a return light measurement unit configured to measure intensity distribution of a return light reflected from a workpiece and returning to an external optical system via the beam splitter, a storage unit configured to store at least one of normal pattern data representing the intensity distribution of the return light when the protective window is in normal condition and abnormal pattern data representing the intensity distribution of the return light when the protective window is contaminated, a processing unit configured to perform a process of detecting contamination of the protective window during laser processing based on measurement data about the return light and at least one of the normal pattern data and the abnormal pattern data, and a warning unit configured to warn of contamination of the protective window in accordance with the process.

Abstract: A semiconductor manufacturing apparatus according to an embodiment comprises a container contains a mixed solution that includes a processing solution for plating processing of a substrate and an additive and being capable of draining a part of the mixed solution when a first condition is satisfied. A first supplier supplies the processing solution to the container. A second supplier supplies the additive to the container when the first condition is satisfied and drainage of a part of the mixed solution is finished.

Abstract: A laser processing device having a function for reducing intensity of a reflected laser beam, without stopping laser oscillation, in order to avoid a malfunction due to the reflected beam. A controller for controlling a laser oscillator has: a laser processing commanding part configured to output a laser processing command; a memory configured to store monitored intensity of the reflected beam and a laser output condition; a pre-processing commanding part configured to command a pre-processing prior to the laser processing command; a comparing part configured to compare the stored intensity of the reflected beam to a first judgment value and/or a second judgment value lower than the first judgment value; an output condition changing part configured to set or change the laser output command of the pre-processing command based on a comparison result; and a pre-processing terminating part configured to terminate the pre-processing based on a predetermined condition.

Abstract: A laser processing system that can effectively blow out a material of a workpiece melted by a laser beam by effectively utilizing an assist gas emitted from a nozzle. The laser processing system comprises a nozzle including an emission opening configured to emit a jet of an assist gas along an optical axis of a laser beam, the nozzle being configured to forming a maximum point of velocity of the jet at a position away from the emission opening; a measuring instrument configured to measure the velocity of the jet; and a position acquisition section configured to acquire information representing a position of the maximum point based on output data of the measuring instrument.

Abstract: A laser processing system that can effectively blow out a material of a workpiece that is melted by a laser beam by effectively utilizing an assist gas emitted from a nozzle. The laser processing system includes a nozzle having an emission opening that emits a jet of the assist gas along an optical axis of the laser beam, the nozzle forming a maximum point of velocity of the jet at a position away from the emission opening and is configured such that during processing of the workpiece by the laser beam, a nozzle is disposed with respect to a process portion of the workpiece W, at a target position determined based on a position of the maximum point.

Abstract: A laser processing system that can effectively blow out a material of a workpiece melted by a laser beam by effectively utilizing an assist gas emitted from a nozzle. The laser processing system comprises a nozzle including an emission opening configured to emit a jet of an assist gas along an optical axis of a laser beam, the nozzle being configured to form a maximum point of velocity of the jet at a position away from the emission opening; and a tubular enclosure disposed between the nozzle and a workpiece and enclosing the jet, wherein the enclosure has a changeable radial inner dimension, and is configured to adjust the position of the maximum point by changing the inner dimension.

Abstract: A machining condition adjustment device adjusts laser beam machining conditions for a laser beam machining device to carry out laser beam machining of a workpiece, produces each of state variables including machining condition data, workpiece data, and plasma generation amount data and determination data including plasma generation amount determination data, and learns adjustment action for the laser beam machining conditions with respect to an amount of plasma generated in the laser beam machining of the workpiece under prescribed laser beam machining conditions, with use of the produced state variables and the produced determination data.

Abstract: A machining condition adjustment device adjusts settings of an ionizer so as to neutralize a charge carried by plasma generated during laser beam machining of a workpiece by a laser beam machining device, calculates an amount of charge per unit time that is to be radiated from the ionizer, based on the amount of charge carried by the plasma generated during the laser beam machining, and sets the ionizer to radiate the calculated amount of charge per unit time.

Abstract: A laser processing system capable of reliably determining an abnormality in a jet during laser process. The laser processing system comprises a nozzle including an emission opening configured to emit a jet of an assist gas along an optical axis of a laser beam, the nozzle being configured to form a maximum point of velocity of the jet at a position away from the emission opening; a measuring instrument configured to measure any of the velocity of the jet and a sound generated by the jet impinging on a workpiece; and an abnormality determination section configured to determine whether or not output data of the measuring instrument is different from reference data.

Abstract: A laser processing system that can effectively blow out a material of a workpiece melted by a laser beam by effectively utilizing an assist gas emitted from a nozzle. The laser processing system comprising a nozzle including an emission opening configured to emit a jet of an assist gas along an optical axis of a laser beam, the nozzle being configured to form a maximum point of velocity of the jet at a position away from the emission opening; a measuring instrument configured to measure a sound generated by the jet impinging on an object; and a position acquisition section configured to acquire information representing the position of the maximum point based on output data of the measuring instrument.

Abstract: A laser processing system that can effectively blow out a material of a workpiece that is melted by a laser beam by effectively utilizing an assist gas emitted from a nozzle. The laser processing system includes a nozzle including an emission opening configured to emit a jet of an assist gas along an optical axis of a laser beam, the nozzle being configured to form a maximum point of velocity of the jet at a position away from the emission opening; a measuring instrument configured to measure a supply flow rate of the assist gas to the nozzle; and a position acquisition section configured to acquire the position of the maximum point from a measurement value of the measuring instrument by predetermined calculation.