Abstract: To provide a laser machine capable of reliably drilling a small hole when drilling of the workpiece is performed. A laser machine 1 includes: a laser oscillator; a light guide path; a processing head; and a nozzle. The nozzle includes: a nozzle tip body that irradiates the workpiece with the laser beam; a charge port formed in the nozzle tip body; and an exhaust port formed in the nozzle tip body so as to oppose to the charge port. The nozzle supplies gas to the inside of the nozzle tip body along a gas flow path extending from the charge port to the exhaust port in a form of crossing across the laser beam in the nozzle tip body, to generate a negative pressure in the vicinity of an opening part of a tip end of the nozzle tip body.

Abstract: A laser machining device includes a contamination determining part that determines contamination of an external optical system before laser machining; the contamination determining part includes a lens contamination determining section that determines contamination of a lens in the external optical system on the basis of a comparison between a first measurement value, which is measured by an energy amount measuring part in a state where the external optical system is not heated, and a second measurement value, which is measured by the energy amount measuring part in a state where the external optical system is heated.

Abstract: A laser processing head able to prevent leakage of a coolant out of a flow path or a coolant supply pipe. The laser processing head includes a closed-circulation path that circulates the coolant for removing the heat generated in the laser processing head due to a laser beam propagating in the laser processing head, and a coolant circulation device that allows the coolant to flow in the circulation path and circulates the coolant in the circulation path.

Abstract: A laser machining method includes the steps of: outputting a laser beam to the workpiece at a laser power low enough not to melt or oxidize the workpiece to measure reflected light of the laser beam; selecting a laser power suitable for melting or oxidizing the workpiece based on a measured value of the reflected light; determining whether or not the workpiece can be melted or oxidized based on the selected laser power; when the workpiece can be melted or oxidized, outputting a laser beam to the workpiece at a laser power high enough to melt or oxidize the workpiece; outputting again a laser beam to the workpiece at the low laser power to measure reflected light of the laser beam; and checking the degree of the melting or oxidization of the workpiece based on a measured value of the reflected light to determine whether or not to start laser machining.

Abstract: Disclosed is a machine learning device of a cutting condition adjustment apparatus including: a state observation section that observes, as state variables indicating a current state of an environment, cutting condition data indicating a laser cutting condition for a laser cutting and oblique rearward temperature rise data indicating a temperature rise value at an oblique rearward part of a cutting front of a workpiece, a determination data acquisition unit that acquires temperature rise value determination data for determining propriety of the temperature rise value during cutting based on the laser cutting condition for the laser cutting as determination data indicating a propriety determination result of the cutting of the workpiece, and a learning unit that learns the temperature rise value and adjustment of the laser cutting condition for the laser cutting in association with each other using the state variables and the determination data.

Abstract: A semiconductor manufacturing apparatus according to the present embodiment has a mount unit capable of mounting a substrate. A first supplier supplies a chemical solution onto the substrate. A first protection plate is provided along an outer circumference of the substrate, to receive the chemical solution splashing from the substrate. A second supplier is provided above the first protection plate, to supply a cleaning solution to an inner surface of the first protection plate.

Abstract: A laser processing system herein includes a laser oscillator, a laser optical path that guides laser beam from a laser beam emission port of the laser oscillator to a workpiece, an impure gas absorbent for absorbing impure gases that influence the propagation of the laser beam, and a shutter that exposes the impure gas absorbent in the laser optical path.

Abstract: A laser processing device has a preprocessing controller which issues a command to perform preprocessing of a workpiece under high output conditions, which are previously found by an experiment or calculation in accordance with at least some of processing conditions and which include the irradiation intensity and irradiation time, at which a workpiece is melted, changed in shape, or denatured; a command to irradiate the workpiece with a laser beam under low output conditions, which are previously found by an experiment or calculation in accordance with at least some of the processing conditions and which include the irradiation intensity and irradiation time, at which a workpiece is not melted, changed in shape, or denatured; and a command of whether to start the laser processing, based on a first light quantity of light reflected or emitted from a processing point irradiated with a laser beam under the low output conditions.

Abstract: A machine learning device of a machining condition adjustment apparatus observes, as state variables expressing a current state of an environment, laser machining condition data in laser machining, and gas target deviation data indicating a target deviation of a pressure loss or a flow rate of assist gas. Then the machine learning device acquires determination data for determining quality of a workpiece machined on the basis of the laser machining condition, and learns the target deviation of the pressure loss or the flow rate of the assist gas and adjustment of the laser machining condition in the laser machining in association with each other using the determination data and the observed state variables.

Abstract: A laser machining head has a function of rectifying an assist gas and includes a protection window, a nozzle configured to blow the assist gas over a workpiece, a chamber defining a space between the protection window and the nozzle, an inflow port disposed in a chamber and configured to allow the assist gas to flow in, and a flow dividing projection disposed at a position opposing to the inflow port and configured to divide the assist gas from the inflow port into a first flow and a second flow flowing along a circumferential direction around an optical axis of a laser beam.

Abstract: A laser machining head includes a protection window disposed inclined with respect to an optical axis of a laser beam, an inflow port disposed downstream of the protection window and configured to allow a gas to flow in, and a flow dividing projection configured to divide the gas into a first laminar flow flowing along parallel to a surface of the protection window and a second laminar flow flowing toward a workpiece. The flow dividing projection is disposed in a position opposing to the inflow port with the optical axis of the laser beam as the center.

Abstract: A laser processing method is performed in a laser processing apparatus which outputs a laser beam from a processing head to a workpiece, to perform laser processing while controlling reflected light of the output laser beam to a prescribed value or less. The laser processing method includes the step of, before performing laser processing for the workpiece, increasing laser power stepwise from laser power lower than laser power included in a processing condition of the laser processing, to emit a laser beam from a laser oscillator, and measuring reflected light by a reflected light sensor, and the step of deciding an output condition for decreasing reflected light based on a measured value of the reflected light and the prescribed value, and the step of decreasing reflected light before performing the laser processing by irradiating the workpiece with a laser beam for a predetermined period of time on the decided output condition.

Abstract: A control device controls an internal combustion engine including: an elastic wave sensor arranged and configured to output a signal responsive to the strength of an acoustic emission wave produced at a sliding portion; and a variable oil pump. The control device is configured to execute an oil pressure control such that the oil pressure approaches a target oil pressure according to an engine operating condition. This oil pressure control includes a first pressure-increase processing executed where an AE correlation value correlated with the strength or occurrence frequency of the acoustic emission wave detected by the elastic wave sensor is greater than a first threshold value. The first pressure-increase processing increases the target oil pressure associated with a first engine operating condition present when the AE correlation value becomes greater than the first threshold value, as compared to when the AE correlation value is not greater than that.

Abstract: A laser processing device includes a beam splitter disposed between a focusing lens and a protective window, a return light measurement unit configured to measure intensity distribution of a return light reflected from a workpiece and returning to an external optical system via the beam splitter, a storage unit configured to store at least one of normal pattern data representing the intensity distribution of the return light when the protective window is in normal condition and abnormal pattern data representing the intensity distribution of the return light when the protective window is contaminated, a processing unit configured to perform a process of detecting contamination of the protective window during laser processing based on measurement data about the return light and at least one of the normal pattern data and the abnormal pattern data, and a warning unit configured to warn of contamination of the protective window in accordance with the process.

Abstract: A laser machining device includes a reflective plate disposed perpendicular to the optical axis of emitting light and having a constant reflectance to the emitting light; a return light measurement unit which measures intensity distribution of return light reflected off the reflective plate and returning to the external optical system via a beam splitter; a storage unit which stores the return light intensity distribution in a normal state as reference data; a preprocessing unit which performs processing of identifying at least one of an optical axis shift, a beam diameter anomaly, a mode anomaly, a ghost, contamination of a protective window, and a focus shift due to thermal lens effect on the basis of comparison between measurement data of the return light intensity distribution and the reference data, before laser machining; and a warning unit which warns of an anomaly in the external optical system in accordance with the preprocessing unit.

Abstract: An optical fiber connection unit able to efficiently remove heat generated in the optical fiber connection unit. The optical fiber connection unit includes a closed circulation path, through which coolant for eliminating heat generated in the optical fiber connection unit by a laser beam propagating through the optical fiber connection unit circulates, and a coolant circulation device for causing the coolant to flow and circulate in the circulation path.

Abstract: A laser machining device includes a first focus movement amount calculation section configured to calculate a focus movement amount based on comparison of a first measurement value obtained by averaging a plurality of measurement values measured by a returning light measurement unit within a first period and a second measurement value obtained by averaging a plurality of measurement values measured by the returning light measurement unit within a second period that is temporally later than the first period; and a focus position correction section configured to correct a focus position during laser machining based on the focus movement amount, and the first period is a period shortly after initiation of laser emission when the external optical system is not warmed up or is a period after correcting the focus position, and the second period is a period after passage of a certain time duration when the external optical system is warmed up.

Abstract: A laser machining device includes a storage unit configured to store a reference value based on an energy amount of returning light when laser light is emitted, in a state where external optical system is not contaminated, toward a reflection plate with a predetermined output low enough not to melt or deform the reflection plate such that a focus position of the laser light aligns with a predetermined position, and a processing condition correction unit configured to correct, prior to laser machining, a processing condition in accordance with the contamination level of the external optical system, wherein the processing condition correction unit includes a laser power correction section configured to correct a laser power of the processing condition based on the measurement value measured by a returning light measurement unit and the reference value.

Abstract: A laser machining device includes a contamination determining part that determines contamination of an external optical system before laser machining; the contamination determining part includes a lens contamination determining section that determines contamination of a lens in the external optical system on the basis of a comparison between a first measurement value, which is measured by an energy amount measuring part in a state where the external optical system is not heated, and a second measurement value, which is measured by the energy amount measuring part in a state where the external optical system is heated.

Abstract: A laser machining method includes, before laser machining: calculating the amount of focus movement on the basis of a first measurement value measured with the external optical system warmed up and being the amount of energy of a laser beam passing through a small-diameter hole and a first reference value (database D1) predetermined depending on the type of contamination of the external optical system in relation to the first measurement value; and compensating the focus position in laser machining on the basis of the calculated amount of focus movement.