Abstract: A laser processing system herein includes a laser oscillator, a laser optical path that guides laser beam from the laser oscillator to a workpiece, a purge gas supply line for supplying a purge gas into the laser optical path, oxygen sensor and an impure gas sensor which detects an impure gas influencing the propagation of the laser beam that are installed in the laser optical path, and an impure gas sensor output value correction unit. The impure gas sensor output value correction unit corrects an output value of the impure gas sensor based on an output value of the oxygen sensor.

Abstract: A semiconductor manufacturing apparatus according to the present embodiment has a mount unit capable of mounting a substrate. A first supplier supplies a chemical solution onto the substrate. A first protection plate is provided along an outer circumference of the substrate, to receive the chemical solution splashing from the substrate. A second supplier is provided above the first protection plate, to supply a cleaning solution to an inner surface of the first protection plate.

Abstract: To provide a nozzle for laser processing head capable of reliably drilling a small hole when drilling of the workpiece is performed by using a laser machine. A nozzle includes: a nozzle tip body that irradiates a workpiece with a laser beam; a charge port formed in the nozzle tip body; an exhaust port formed in the nozzle tip body so as to oppose to the charge port; and an elastic member that is provided in a tip end of the nozzle tip body and contacts with the workpiece while elastically extending and contracting in the axial center direction of the nozzle tip body. The nozzle supplies gas to the inside of the nozzle tip body along a gas flow path extending from the charge port to the exhaust port in a form of crossing across the laser beam in the nozzle tip body, to generate a negative pressure in the vicinity of an opening part of a tip end of the nozzle tip body. The elastic member contacts with the workpiece and improves the degree of enclosure of the nozzle tip body by the workpiece.

Abstract: To provide a laser processing method capable of performing laser processing quickly and inexpensively without causing cracks, damages, and deformations of a ceramic workpiece. When a workpiece is irradiated with the laser beam, the product of an irradiation time, a power, by an absorption rate of the laser beam is set to be equal to or more than an energy required for melting a volume of a melting target portion of the workpiece. A melted material of the workpiece generated according to the irradiation of a laser beam is removed from a laser received area of the workpiece.

Abstract: To provide a laser machine capable of reliably drilling a small hole when drilling of the workpiece is performed. A laser machine 1 includes: a laser oscillator; a light guide path; a processing head; and a nozzle. The nozzle includes: a nozzle tip body that irradiates the workpiece with the laser beam; a charge port formed in the nozzle tip body; and an exhaust port formed in the nozzle tip body so as to oppose to the charge port. The nozzle supplies gas to the inside of the nozzle tip body along a gas flow path extending from the charge port to the exhaust port in a form of crossing across the laser beam in the nozzle tip body, to generate a negative pressure in the vicinity of an opening part of a tip end of the nozzle tip body.

Abstract: A laser machining method includes the steps of: outputting a laser beam to the workpiece at a laser power low enough not to melt or oxidize the workpiece to measure reflected light of the laser beam; selecting a laser power suitable for melting or oxidizing the workpiece based on a measured value of the reflected light; determining whether or not the workpiece can be melted or oxidized based on the selected laser power; when the workpiece can be melted or oxidized, outputting a laser beam to the workpiece at a laser power high enough to melt or oxidize the workpiece; outputting again a laser beam to the workpiece at the low laser power to measure reflected light of the laser beam; and checking the degree of the melting or oxidization of the workpiece based on a measured value of the reflected light to determine whether or not to start laser machining.

Abstract: A laser processing method is performed in a laser processing apparatus which outputs a laser beam from a processing head to a workpiece, to perform laser processing while controlling reflected light of the output laser beam to a prescribed value or less. The laser processing method includes the step of, before performing laser processing for the workpiece, increasing laser power stepwise from laser power lower than laser power included in a processing condition of the laser processing, to emit a laser beam from a laser oscillator, and measuring reflected light by a reflected light sensor, and the step of deciding an output condition for decreasing reflected light based on a measured value of the reflected light and the prescribed value, and the step of decreasing reflected light before performing the laser processing by irradiating the workpiece with a laser beam for a predetermined period of time on the decided output condition.

Abstract: A laser processing device having a function for reducing intensity of a reflected laser beam, without stopping laser oscillation, in order to avoid a malfunction due to the reflected beam. A controller for controlling a laser oscillator has: a laser processing commanding part configured to output a laser processing command; a memory configured to store monitored intensity of the reflected beam and a laser output condition; a pre-processing commanding part configured to command a pre-processing prior to the laser processing command; a comparing part configured to compare the stored intensity of the reflected beam to a first judgment value and/or a second judgment value lower than the first judgment value; an output condition changing part configured to set or change the laser output command of the pre-processing command based on a comparison result; and a pre-processing terminating part configured to terminate the pre-processing based on a predetermined condition.

Abstract: A laser processing device has a preprocessing controller which issues a command to perform preprocessing of a workpiece under high output conditions, which are previously found by an experiment or calculation in accordance with at least some of processing conditions and which include the irradiation intensity and irradiation time, at which a workpiece is melted, changed in shape, or denatured; a command to irradiate the workpiece with a laser beam under low output conditions, which are previously found by an experiment or calculation in accordance with at least some of the processing conditions and which include the irradiation intensity and irradiation time, at which a workpiece is not melted, changed in shape, or denatured; and a command of whether to start the laser processing, based on a first light quantity of light reflected or emitted from a processing point irradiated with a laser beam under the low output conditions.

Abstract: When a driving module is performing processing of vibrating a piezoelectric vibration module based on a sound signal in an electronic apparatus, a determination module determines whether or not an ear putting position specified by an ear putting position specifying module is close to a reference position. When the processing is being performed, a notification module notifies the user at least one of that the ear putting position is appropriate and that the ear putting position is inappropriate, based on a determination result of the determination module.

Abstract: An optical fiber connection unit able to efficiently remove heat generated in the optical fiber connection unit. The optical fiber connection unit includes a closed circulation path, through which coolant for eliminating heat generated in the optical fiber connection unit by a laser beam propagating through the optical fiber connection unit circulates, and a coolant circulation device for causing the coolant to flow and circulate in the circulation path.

Abstract: A laser processing head able to prevent leakage of a coolant out of a flow path or a coolant supply pipe. The laser processing head includes a closed-circulation path that circulates the coolant for removing the heat generated in the laser processing head due to a laser beam propagating in the laser processing head, and a coolant circulation device that allows the coolant to flow in the circulation path and circulates the coolant in the circulation path.

Abstract: A laser processing system herein includes a laser oscillator, a laser optical path that guides laser beam from a laser beam emission port of the laser oscillator to a workpiece, an impure gas adsorbent for adsorbing impure gases that influence the propagation of the laser beam, and a shutter that exposes the impure gas adsorbent in the laser optical path.

Abstract: A laser processing system herein includes a laser oscillator, a laser optical path that guides laser beam from the laser oscillator to a workpiece, a purge gas supply line for supplying a purge gas into the laser optical path, oxygen sensor and an impure gas sensor which detects an impure gas influencing the propagation of the laser beam that are installed in the laser optical path, and an impure gas sensor output value correction unit. The impure gas sensor output value correction unit corrects an output value of the impure gas sensor based on an output value of the oxygen sensor.

Abstract: A semiconductor manufacturing apparatus according to an embodiment comprises a container contains a mixed solution that includes a processing solution for plating processing of a substrate and an additive and being capable of draining a part of the mixed solution when a first condition is satisfied. A first supplier supplies the processing solution to the container. A second supplier supplies the additive to the container when the first condition is satisfied and drainage of a part of the mixed solution is finished.

Abstract: A portable terminal includes a touchpad that detects contact made thereto and output a value indicating a degree of the contact, and stores a first threshold and a second threshold less than the first threshold. The portable terminal calculates, based on the output value, an area contact value indicating a degree of the contact for each of contacted areas of the touchpad. The portable terminal judges whether the contacted areas include two areas that are not directly adjacent to each other and each have a calculated area contact value equal to or greater than the second threshold. When judging negatively, the portable terminal determines, as a target area to which processing to be performed is allocated, one of the contacted areas having an area contact value equal to or greater than the first threshold, and when judging affirmatively, the portable terminal does not to determine the target area.

Abstract: A portable terminal including a touch-sensitive first input device and a touch-sensitive second input device that receive input when contact is made thereto, the portable terminal comprising: a first execution unit configured to execute processing that is in accordance with input received by the first input device; a second execution unit configured to execute processing that is in accordance with input received by the second input device; and a control unit that controls whether or not to inhibit the execution of the second processing by the second execution unit according to which position on the first input device is contacted.

Abstract: A portable terminal includes a touchpad that detects contact made thereto and output a value indicating a degree of the contact, and stores a first threshold and a second threshold less than the first threshold. The portable terminal calculates, based on the output value, an area contact value indicating a degree of the contact for each of contacted areas of the touchpad. The portable terminal judges whether the contacted areas include two areas that are not directly adjacent to each other and each have a calculated area contact value equal to or greater than the second threshold. When judging negatively, the portable terminal determines, as a target area to which processing to be performed is allocated, one of the contacted areas having an area contact value equal to or greater than the first threshold, and when judging affirmatively, the portable terminal does not to determine the target area.

Abstract: A beam profiler which can determine whether or not a laser beam can be suitably output at a lower cost. The beam profiler is provided with a partial reflecting mirror, light receiving parts, and laser intensity sensors which are individually attached to the light receiving parts. The light receiving parts include a first light receiving part which receives a first region which includes an optical axis of the laser beam in a laser irradiation region of the laser beam and a second light receiving part which is insulated heat-wise from the first light receiving part and which receives a second region of a laser irradiation region which is different from the first region.

Abstract: A beam profiler which can determine whether or not a laser beam can be suitably output at a lower cost. The beam profiler is provided with a partial reflecting mirror, light receiving parts, and laser intensity sensors which are individually attached to the light receiving parts. The light receiving parts include a first light receiving part which receives a first region which includes an optical axis of the laser beam in a laser irradiation region of the laser beam and a second light receiving part which is insulated heat-wise from the first light receiving part and which receives a second region of a laser irradiation region which is different from the first region.