Abstract: A copolymerized polysilazane comprising at least repeating units represented by general formula (I): —Si(R1)(R2)—NR3— and repeating units represented by general formula (II): —Si(R1)(R2)—NH— (in the formulas, R1 and R2 each independently represent a hydrogen atom, hydrocarbon group, hydrocarbon group-containing silyl group, hydrocarbon group-containing amino group, or hydrocarbon oxy group, and R3 represents an alkyl group, alkenyl group, alkoxy group, cycloalkyl group, aryl group or alkyl silyl group), and the NR3/SiH1,2 ratio (SiH1,2 represents the total amount of SiH1 and SiH2) is 0.005-0.3. Said copolymerized polysilazane can be manufactured by reacting Si(R1)(R2)X2 (in the formula, X represents a halogen atom) with a primary amine compound: R3NH2 and then reacting with ammonia, and is able to form a siliceous film that has withstand voltage characteristics and solvent resistance by curing at a low temperature.

Abstract: [Problem] To provide a perhydropolysilazane making it possible to form a siliceous film with minimal defects, and a curing composition comprising the perhydropolysilazane. [Means for Solution] The present invention provides a perhydropolysilazane having a weight-average molecular weight of 5,000 to 17,000, characterized in that when 1H-NMR of a 17% by weight solution of said perhydropolysilazane dissolved in xylol is measured, the ratio of the amount of SiH1,2 based on the aromatic ring hydrogen content of the xylol is 0.235 or less and the ratio of the amount of NH based on the aromatic ring hydrogen content of the xylol is 0.055 or less, and a curing composition comprising the perhydropolysilazane. The present invention also provides a method for forming a siliceous film, comprising coating the curing composition on a substrate and heating.

Abstract: A multilayer substrate includes a first substrate a second substrate that is stacked on and electrically connected to the first substrate, the second substrate having a different characteristic from a characteristic of the first substrate, a third substrate that is provided on a side of the first substrate, the second substrate being provided on the side of the first substrate, and the third substrate is electrically connected to the second substrate, and a connection member that electrically connects the first substrate and the third substrate to each other while the second substrate is bypassed.

Abstract: There is provided a manufacturing method of a layered circuit board in which a first board and a second board are layered, the manufacturing. The method includes arranging an adhesive resin sheet on the first board so that one face faces the first board, the adhesive resin sheet including a plurality of variant via holes, an opening area on the one face of each of the plurality of variant via holes being larger than an opening area on the other face, filling the variant via holes with conductive paste, arranging the second board on the other face of the adhesive resin sheet after the filling with the conductive paste, and performing heat press treatment to apply pressure to the adhesive resin sheet in a layering direction of the first board and the second board under heat.

Abstract: A package mounting structure includes: a first substrate having wiring; a second substrate having wiring; at least one cooling unit having a first face and a second face different from the first face; at least one power supply unit that is mounted on the first substrate and is joined to the first face of the cooling unit; and at least one electronic component that is mounted on the second substrate and is joined to the second face of the cooling unit, wherein the power supply unit supplies power to the electronic component through the wiring of the first substrate, the cooling unit, and the wiring of the second substrate.

Abstract: An object of the present invention is to provide an aqueous coating composition comprising acrylic urethane composite resin particles that is excellent in storage stability and compatibility with other resin components and that achieves excellent performance of the obtained coating film, such as in finished appearance and water resistance. Provided as a means for achieving the above object is an aqueous coating composition comprising acrylic urethane composite resin particles (A), a reactive group-containing resin (B), and optionally a crosslinking agent (C), the acrylic urethane composite resin particles (A) comprising an acrylic urethane resin (I) and a graft acrylic resin (II), and being acrylic urethane composite resin particles prepared by synthesizing the acrylic urethane resin (I) in the presence of the graft acrylic resin (II), the graft acrylic resin (II) being a hydrophobic-chain- and hydrophilic-chain-containing resin having a weight average molecular weight of 5,000 or more.

Abstract: Provided is an acrylic urethane composite resin particles comprising an acrylic urethane graft resin (I) and a graft acrylic resin (II), the acrylic urethane graft resin (I) being synthesized in the presence of the graft acrylic resin (II), the graft acrylic resin (II) being a hydrophobic-chain- and hydrophilic-chain-containing resin having a weight average molecular weight of 5000 or more, the acrylic urethane graft resin (I) comprising an acrylic resin component and a urethane resin component, the acrylic resin portion of the acrylic urethane graft resin (I) being synthesized using, as constituent monomer components, 0.1 to 30 mass % of a polymerizable unsaturated monomer (1) containing a group having active hydrogen atom(s) reactive with an isocyanate group and 70 to 99.9 mass % of other polymerizable unsaturated monomer(s) (2).

Abstract: There is provided a manufacturing method of a layered circuit board in which a first board and a second board are layered. The method includes arranging an adhesive resin sheet on the first board so that one face faces the first board, the adhesive resin sheet including a plurality of variant via holes, an opening area on the one face of each of the plurality of variant via holes being larger than an opening area on the other face, filling the variant via holes with conductive paste, arranging the second board on the other face of the adhesive resin sheet after the filling with the conductive paste, and performing heat press treatment to apply pressure to the adhesive resin sheet in a layering direction of the first board and the second board under heat.

Abstract: A semiconductor package includes: a first substrate, disposed so as to be opposed to a second substrate, on which a semiconductor chip is mounted; and a solder ball formed on the first substrate, wherein the solder ball is joined to a pin that penetrates through the second substrate.

Abstract: A laminated chip includes: a first chip; a first wiring layer formed on the first chip; a second chip; a second wiring layer formed on the second chip; and a layer disposed between the first wiring layer and the second wiring layer, the layer includes an adhesive agent configured to bond the first wiring layer and the second wiring layer; a plurality of first bumps connected to the first wiring layer; a plurality of second bumps connected to the second wiring layer; and solder connected to the plurality of first bumps and the plurality of second bumps.

Abstract: A laminated substrate includes: a core portion; a first wiring portion configured to be stacked on the core portion and to include a first exposed surface formed by exposing at least part of a surface of the first wiring portion; and a second wiring portion configured to be stacked on the first wiring portion, to include a second exposed surface formed by exposing at least part of a surface of the second wiring portion, and to have higher wiring density of conductor than the first wiring portion has, wherein the first exposed surface and the second exposed surface are provided respectively with a first pad and a second pad which are to be connected to electrodes of one semiconductor chip to be mounted on both the first exposed surface and the second exposed surface.

Abstract: A polyolefin-based fiber-reinforced multilayered sheet of the present invention includes woven fabric layers layered via bonding layers on both surfaces of a core layer, wherein the core layer is made of at least one resin selected from the group consisting of a resin mainly made of polypropylene and a homopolymer polypropylene resin, the woven fabric layers are formed from yarns containing a composite fiber in which a first component is polypropylene and a second component is a polyolefin component having a melting point lower than that of the first component, the bonding layers are thermoadhesive polyolefin-based films, and a cover layer is layered on a surface of one of the woven fabric layers.

Abstract: A display device includes: a display monitor; a control board which drives the display monitor; a chassis which is provided between the display monitor and the control board. The chassis includes a conductive material, and has a surface on a side of the display monitor. The display device further includes: a wiring line which is provided along the surface of the chassis; and a clamper which fixes the wiring line to the chassis. The clamper includes a clamp section pressing the wiring line, and leg portions fixed to the chassis. The chassis includes a recessed section at a position where the clamper is fixed. The recessed section is indented towards a side of the control board and accommodating the wiring line.

Abstract: An embodiment of a stacked structure includes: a first substrate that includes a first electrode; a second substrate that includes a second electrode; and an adhesive resin material that is provided between the first substrate and the second substrate and includes a plurality of conductive vias, the plurality of conductive vias electrically connecting the first electrode and the second electrode.

Abstract: The objective of the present invention is to provide a display device which, when transforming three primary colors of input to four primary colors of output and displaying the same, is capable of performing accurate color reproduction using a simple method. A display device is provided with a color transformation portion (12) which transforms 3 RGB primary colors of an input video image signal into a tri-stimulus value of an XYZ color system, and transforms the transformed tri-stimulus value to 4 primary colors of an output video image signal.

Abstract: To optimize combinations of values of four primary colors in a display device supporting four-primary-color display, with consideration given to display performances such as the power consumption in a light-emitting display device and the viewing angle characteristics in the non-light-emitting display device. The display device of the present invention displays video indicated by an input video signal using pixels composed of four primary colors and each having at least one sub-pixel for one primary color. When representing pixel colors of pixel signals in the input video signal, at least one pixel color which has a lightness less than a predetermined lightness determined depending on a color gamut representable by the display device and which is in areas except on a boundary of the color gamut is represented using only three primary colors among the four primary colors.

Abstract: The present invention provides an aqueous coating composition for use as an aqueous first colored coating composition in a multilayer coating-forming method, the coating composition containing an aqueous film-forming resin (A), a crosslinking agent (B), and acrylic urethane resin composite particles (C). The acrylic resin of the acrylic urethane resin composite particles (C) is obtained by using, as constituent monomers, 30 to 80 mass % of a polymerizable unsaturated monomer (c-1-1) having one polymerizable unsaturated group per molecule and having a C4-22 alkyl group, 1 to 20 mass % of a polymerizable unsaturated monomer (c-2) having two or more polymerizable unsaturated groups per molecule, and 0 to 69 mass % of a polymerizable unsaturated monomer (c-1-2) having one polymerizable unsaturated group per molecule and being other than the polymerizable unsaturated monomer (c-1-1).

Abstract: A multilayer substrate includes a first substrate a second substrate that is stacked on and electrically connected to the first substrate, the second substrate having a different characteristic from a characteristic of the first substrate, a third substrate that is provided on a side of the first substrate, the second substrate being provided on the side of the first substrate, and the third substrate is electrically connected to the second substrate, and a connection member that electrically connects the first substrate and the third substrate to each other while the second substrate is bypassed.

Abstract: An inorganic polysilazane resin of the present invention has a Si/N ratio (i.e. a ratio of contained silicon atoms to contained nitrogen atoms) of 1.30 or more. The inorganic polysilazane resin having such a high Si content can be produced by, for example, a method in which an inorganic polysilazane compound containing both Si—NH and Si—Cl is heated to react NH with Cl, a method in which a silazane oligomer (polymer) that leaves no Si—Cl bond is synthesized and a dihalosilane is added to the synthesized silazane oligomer (polymer) to perform a thermal reaction, and the like. A siliceous film can be formed by, for example, applying a coating composition containing the inorganic polysilazane resin onto a base plate and then dried and the dried product is then oxidized by bringing the dried product into contact with water vapor or hydrogen peroxide vapor and water vapor under heated conditions.

Abstract: A package mounting structure includes: a first substrate having wiring; a second substrate having wiring; at least one cooling unit having a first face and a second face different from the first face; at least one power supply unit that is mounted on the first substrate and is joined to the first face of the cooling unit; and at least one electronic component that is mounted on the second substrate and is joined to the second face of the cooling unit, wherein the power supply unit supplies power to the electronic component through the wiring of the first substrate, the cooling unit, and the wiring of the second substrate.