Patents by Inventor Takashi Kanda
Takashi Kanda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8116816Abstract: A radio communication system for conducting the radio communication with a terminal device includes a first radio communication apparatus for processing a first signal; a second radio communication apparatus for processing a second signal, and to combine the first signal and the second signal; a common amplifier for amplifying the first and second signals from the second radio communication apparatus, transmitting the amplified signals to the terminal device, amplifying first and second signals received from the terminal device, and outputting the amplified signals to the second radio communication apparatus, the second radio communication apparatus separating the amplified first and second signals; and a switching apparatus coupled to the first radio communication apparatus, the second radio communication apparatuses and the common amplifier to disconnect the first or second radio communication apparatus when a fault occurs in the first or second radio communication apparatus, respectively.Type: GrantFiled: November 16, 2009Date of Patent: February 14, 2012Assignee: Fujitsu LimitedInventors: Takashi Kanda, Jun Sugiyama
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Patent number: 8061022Abstract: A method for manufacturing a hybrid printed circuit board having two kinds of wiring boards. The circuit board has method has a first wiring board having a first terminal and, a second wiring board wherein a dent wherein the first wiring board is fitted and equipped with a second terminal is formed, and forming the same plane as the first wiring board. The board also has an insulating adhesive material disposed around the first terminal, and a conductive adhesive joining the first terminal with the second terminal.Type: GrantFiled: March 12, 2008Date of Patent: November 22, 2011Assignee: Fujitsu LimitedInventor: Takashi Kanda
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Publication number: 20110279740Abstract: When a wide color gamut display displays video based on a video signal that complies with a narrower color reproduction range standard, in order to make full use of the feature of the wide color gamut display capable of displaying highly saturated and vivid reds, while eliminating the problem of seeing glaring images in the part of the red color region near the highest brightness and saturation, a video processing circuit (2) reduces and corrects the signal value of the input video signal, which represents the colors within the color range to be corrected, which is within a specified saturation range from the highest saturation to the middle saturation inside a specified hue range centered on the red hue in the color reproduction range (an expanded color reproduction range wider than the sRGB standard color reproduction range) of a liquid crystal panel (4), and which is within a specified brightness range from the highest brightness to the middle brightness inside that range, so that the saturation and brightType: ApplicationFiled: January 12, 2010Publication date: November 17, 2011Applicant: SHARP KABUSHIKI KAISHAInventors: Toshiyuki Fujine, Takashi Kanda, Toshiyuki Gotoh, Naoko Kondoh
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Publication number: 20110199541Abstract: When conducting video display with a wide color gamut display based on a video signal conforming to a standard (sRGB standard and the like) having a color reproduction range narrower than that of the wide color gamut display, the video processing circuit 2 corrects a color in a prescribed correction target color range partly including a red hue reference range as a center part in the color range of an equal hue from achromatic colors having the lowest saturation to red having the highest saturation in an expanded color reproduction range but not including red having the highest saturation in the expanded color reproduction range, so that the hue may change to a hue akin to yellow in the expanded color reproduction range. In so doing, the hue in the red hue reference range changes to red hue in the color reproduction range conforming to the sRBG standard.Type: ApplicationFiled: August 27, 2009Publication date: August 18, 2011Applicant: SHARP KABUSHIKI KAISHAInventors: Toshiyuki Fujine, Takashi Kanda, Toshiyuki Gotoh, Naoko Kondoh
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Patent number: 7943001Abstract: A process for producing a multilayer board includes the steps of applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of metal particles plated with solder, the metal particles each having a first melting point, and the solder having a second melting point lower than the first melting point; bonding the second substrate to a bonding sheet composed of a thermosetting resin and having a through hole disposed in a portion corresponding to the terminal of the second substrate; and heating and pressurizing the first and second substrates with the bonding sheet in such a manner that the terminals are opposite each other to effect curing of the bonding sheet and the bonding ink and to form an integral structure.Type: GrantFiled: January 4, 2007Date of Patent: May 17, 2011Assignee: Fujitsu LimitedInventors: Takashi Nakagawa, Seiichi Sugano, Kenji Iida, Yasutomo Maehara, Hitoshi Suzuki, Kaoru Sugimoto, Kenji Fukuzono, Takashi Kanda, Hiroaki Date, Tomohisa Yagi
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Publication number: 20110100690Abstract: An electrically conductive body includes: a first electrically conductive material; a second electrically conductive material; and a bonding material bonding the first electrically conductive material to the second electrically conductive material at least for electric conduction. The bonding material is made of a metallic structure containing copper-tin based intermetallic compound phases and tin-bismuth phases, the copper-tin based intermetallic compound phases being continuous between the first electrically conductive material and the second electrically conductive material, the tin-bismuth phases being surrounded by the copper-tin based intermetallic compound phases.Type: ApplicationFiled: October 29, 2010Publication date: May 5, 2011Applicants: FUJITSU LIMITED, SANYO SPECIAL STEEL CO., LTD.Inventors: Hideaki Yoshimura, Kenji Fukuzono, Takashi Kanda, Tomohisa Yagi, Hiroki Ikeda, Katsu Yanagimoto
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Publication number: 20100182350Abstract: In general, when a user views an image displayed on a display apparatus, visual environments, such as ambient brightness, a distance from the user to the display apparatus and so on, may disadvantageously cause the image displayed on the display apparatus to become difficult to view. Moreover, it is complicated and troublesome for the user to enter information of ambient light amount and others when setting a picture quality. An image display apparatus holds both question constituent information related to visual environments and choice information serving as answers to questions constituted by the question constituent information, and further holds a plurality of picture quality control rules suitable for visual environments assumed in accordance with the choice information serving as the answers.Type: ApplicationFiled: March 11, 2008Publication date: July 22, 2010Applicant: SHARP KABUSHIKI KAISHAInventors: Toshiyuki Fujine, Michiyuki Sugino, Takashi Kanda, Eishi Oda, Masahiro Okui
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Patent number: 7756469Abstract: A broadcast wave retransmission system is provided at a low cost, in an extended radio base station system having a master base station for mobile communications and an extended radio base station that is connected to the master base station via a communication line and that has a radio transmitting/receiving function for the mobile communications, by receiving a broadcast wave, superposing a broadcast signal obtained from the received broadcast wave onto a mobile communication signal sent from the master base station to the extended radio base station, transmitting the resultant signal to the extended radio base station, and separating the broadcast signal from the superposed and transmitted signal and retransmitting the resultant signal as a broadcast wave in the extended radio base station.Type: GrantFiled: July 31, 2007Date of Patent: July 13, 2010Assignee: Fujitsu LimitedInventor: Takashi Kanda
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Publication number: 20100157949Abstract: For processing an uplink signal from a mobile station without desiring a high AFC capability in any state, in a wireless base station including a plurality of antennas, reception signals from a mobile station are taken in to perform a signal transmission and reception with the mobile station by a first antenna providing a higher reception signal level, in which a switchover from a signal transmission to the mobile station by the first antenna to that by a second antenna is performed when a frequency variation characteristic measured for an allocated frequency of the reception signal from the first antenna indicates that the mobile station is moving away from the first antenna.Type: ApplicationFiled: March 5, 2010Publication date: June 24, 2010Applicant: FUJITSU LIMITEDInventor: Takashi KANDA
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Publication number: 20100151632Abstract: A semiconductor device includes a multi-layer substrate and a semiconductor element mounted on the multi-layer substrate. The multi-layer substrate contains a plurality of circuit-formation layers joined by a first resin material. The semiconductor element is mounted on the multi-layer substrate by being joined to the multi-layer substrate by a second resin material. The first resin material and the second resin material are curable in the same heating condition.Type: ApplicationFiled: February 25, 2010Publication date: June 17, 2010Applicant: FUJITSU LIMITEDInventors: Takashi KANDA, Kenji Fukuzono
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Publication number: 20100130147Abstract: A radio communication system for conducting the radio communication with a terminal device includes a first radio communication apparatus for processing a first signal; a second radio communication apparatus for processing a second signal, and to combine the first signal and the second signal; a common amplifier for amplifying the first and second signals from the second radio communication apparatus, transmitting the amplified signals to the terminal device, amplifying first and second signals received from the terminal device, and outputting the amplified signals to the second radio communication apparatus, the second radio communication apparatus separating the amplified first and second signals; and a switching apparatus coupled to the first radio communication apparatus, the second radio communication apparatuses and the common amplifier to disconnect the first or second radio communication apparatus when a fault occurs in the first or second radio communication apparatus, respectively.Type: ApplicationFiled: November 16, 2009Publication date: May 27, 2010Applicant: FUJITSU LIMITEDInventors: Takashi KANDA, Jun SUGIYAMA
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Patent number: 7652045Abstract: A compound represented by the following general formula (I): (wherein R1 represents phenyl, etc. which can have substituents selected from the group consisting of C1-8 alkyl, C1-8 alkyl having halogen, halogen, hydroxyl, etc.; R2 represents C1-8 alkyl, etc.; A represents oxygen, sulfur, etc.; X represents C1-8 alkylene chain, etc.; Y represents C(?O), CH?CH, etc.; R3, R4, and R5 each represents hydrogen, C1-8 alkyl, etc.; B represents CH or nitrogen; Z represents oxygen or sulfur; R6 and R7 each represents hydrogen, C1-8 alkyl, etc.; and R8 represents hydrogen or C1-8 alkyl; provided that at least one of R3, R4, and R5 is not hydrogen) or a salt of the compound; and a PPAR-? activator which contains the compound or salt as the active ingredient.Type: GrantFiled: July 31, 2007Date of Patent: January 26, 2010Assignee: Nippon Chemiphar, Co., Ltd.Inventors: Shogo Sakuma, Tomio Yamakawa, Takashi Kanda, Seiichiro Masui
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Patent number: 7648999Abstract: A compound represented by the following general formula (I): (wherein R1 represents phenyl, etc. which can have substituents selected from the group consisting of C1-8 alkyl, C1-8 alkyl having halogen, halogen, hydroxyl, etc.; R2 represents C1-8 alkyl, etc.; A represents oxygen, sulfur, etc.; X represents C1-8 alkylene chain, etc.; Y represents C(?O), CH?CH, etc.; R3, R4, and R5 each represents hydrogen, C1-8 alkyl, etc.; B represents CH or nitrogen; Z represents oxygen or sulfur; R6 and R7 each represents hydrogen, C1-8 alkyl, etc.; and R8 represents hydrogen or C1-8 alkyl; provided that at least one of R3, R4, and R5 is not hydrogen) or a salt of the compound; and a PPAR-? activator which contains the compound or salt as the active ingredient.Type: GrantFiled: July 31, 2007Date of Patent: January 19, 2010Assignee: Nippon Chemiphar Co., Ltd.Inventors: Shogo Sakuma, Tomio Yamakawa, Takashi Kanda, Seiichiro Masui
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Publication number: 20090294056Abstract: The first support body is pressed against the second support body in response to the softening of the adhesive sheet. The fillers are allowed to reliably contact with one another between the first electrically-conductive land and the second electrically-conductive land. The fillers melt after the adhesive sheet has been softened. The intermetallic compounds are formed between the fillers and the electrically-conductive lands and between the fillers. Electrical connection is in this manner established between the first electrically-conductive land and the second electrically-conductive land. The matrix material and the adhesive sheet are then cured. The first support body and the second support body are firmly bonded to each other.Type: ApplicationFiled: February 4, 2009Publication date: December 3, 2009Applicant: FUJITSU LIMITEDInventors: Hideaki YOSHIMURA, Takashi NAKAGAWA, Kenji FUKUZONO, Takashi KANDA, Tomohisa YAGI
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Publication number: 20090294160Abstract: A thermosetting resin sheet is sandwiched between first and second support bodies so that a first electrically-conductive land on the first support body is opposed to a second electrically-conductive land on the second support body in an opening formed in the sheet. The opening is filled with an electrically-conductive binder. The electrically-conductive binder includes matrix material containing a thermosetting resin and fillers including copper particles dispersed in the matrix material. The copper particles have the surface coated with a tin-bismuth alloy. When heat is applied to the electrically-conductive binder, the tin-bismuth alloy melts. The tin forms an intermetallic compound on the surface of the individual copper particle. The copper-tin alloy layers serve to unit the copper particles together. Electrical connection is established. The bismuth embeds the copper particles. The bismuth is hardened or cured. The matrix material is then hardened or cured.Type: ApplicationFiled: February 20, 2009Publication date: December 3, 2009Applicant: FUJITSU LIMITEDInventors: Hideaki YOSHIMURA, Tomohisa YAGI, Kenji FUKUZONO, Takashi KANDA
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Publication number: 20090202314Abstract: One object of the present invention is to increase stability for fixing a cutting tool with a holder formed of a sleeve, and to improve machining accuracy of a boring tool using the holder and prevent chipping of a cutting edge. In a holder for a boring tool holding a bar-shaped cutting tool by receiving it in a center hole in a sleeve and clamping it with clamp means, the sleeve is provided with a slit cutting a region from the center hole in the sleeve to an outer periphery surface thereof lengthwise from a front end to a longitudinal partway portion of the sleeve, and is further provided with a fastener tightening a slit-formed portion of the sleeve to change an inner diameter of the center hole.Type: ApplicationFiled: April 11, 2007Publication date: August 13, 2009Applicant: SUMITOMO ELECTRIC HARDMETAL CORP.Inventors: Yasuhiko Okita, Takashi Kanda, Naoki Sakata, Shinya Uesaka, Tomohiro Fukaya, Koichi Sakikawa
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Publication number: 20090084590Abstract: A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature environment. The circuit board is constructed by laminating a core layer and at least one wiring layer, where the at least one wiring layer has slightly smaller external dimensions in a planar direction than the core layer.Type: ApplicationFiled: August 8, 2008Publication date: April 2, 2009Applicant: FUJITSU LIMITEDInventors: Hideaki YOSHIMURA, Kenji Fukuzono, Kenji Iida, Tomoyuki Abe, Yasutomo Maehara, Takashi Nakagawa, Shin Hirano, Takashi Kanda
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Patent number: 7504191Abstract: A photosensitive resin composition and a method for the formation of a resin pattern using the photosensitive resin composition are provided. The photosensitive resin composition contains, as a catalyst precursor, a catalytic metal element with a metal-deposition catalytic activity suitable for electroless metal plating. The method for the formation of a resin pattern uses a photosensitive resin composition, which contains, as a catalyst precursor, a catalytic metal element with a metal-deposition catalytic activity suitable for electroless metal plating. By using the method of this invention, it is possible to form a conductive film selectively on a resin pattern formed through exposure and development of the photosensitive resin composition of this invention.Type: GrantFiled: January 30, 2004Date of Patent: March 17, 2009Assignee: Rohm and Haas Electronic Materials LLCInventors: Masaki Kondo, Takashi Kanda
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Publication number: 20080222885Abstract: A method for manufacturing a hybrid printed circuit board having two kinds of wiring boards. The circuit board has method has a first wiring board having a first terminal and, a second wiring board wherein a dent wherein the first wiring board is fitted and equipped with a second terminal is formed, and forming the same plane as the first wiring board. The board also has an insulating adhesive material disposed around the first terminal, and a conductive adhesive joining the first terminal with the second terminal.Type: ApplicationFiled: March 12, 2008Publication date: September 18, 2008Applicant: FUJITSU LIMITEDInventor: Takashi KANDA
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Patent number: 7402597Abstract: A compound represented by the formula (I) or a salt of the compound, and a PPAR-? activator which contains the compound or salt as the active ingredient: (wherein A represents O or S; B1 represents N, etc.; B2 represents O, etc.; each of X1 and X2 represents O, S, a bond, etc.; Y represents C1-8 alkylene chain; z represents O or S; R1 represents aryl, etc. which can have substituents; R2 represents C1-8 alkyl, etc.; R3 represents C1-8 alkyl, C2-8 alkenyl, etc.; each of R4 and R5 represents hydrogen, C1-8 alkyl, etc.; and R6 represents hydrogen, etc.; provided that each of Z and R3 is attached to the benzene ring, and X2 is not attached to the benzene ring).Type: GrantFiled: October 6, 2006Date of Patent: July 22, 2008Assignee: Nippon Chemiphar Co., LtdInventors: Shogo Sakuma, Tomio Yamakawa, Takashi Kanda, Seiichiro Masui