Abstract: A broadcast wave retransmission system is provided at a low cost, in an extended radio base station system having a master base station for mobile communications and an extended radio base station that is connected to the master base station via a communication line and that has a radio transmitting/receiving function for the mobile communications, by receiving a broadcast wave, superposing a broadcast signal obtained from the received broadcast wave onto a mobile communication signal sent from the master base station to the extended radio base station, transmitting the resultant signal to the extended radio base station, and separating the broadcast signal from the superposed and transmitted signal and retransmitting the resultant signal as a broadcast wave in the extended radio base station.

Abstract: A compound represented by the following general formula (I): (wherein R1 represents phenyl, etc. which can have substituents selected from the group consisting of C1-8 alkyl, C1-8 alkyl having halogen, halogen, hydroxyl, etc.; R2 represents C1-8 alkyl, etc.; A represents oxygen, sulfur, etc.; X represents C1-8 alkylene chain, etc.; Y represents C(?O), CH?CH, etc.; R3, R4, and R5 each represents hydrogen, C1-8 alkyl, etc.; B represents CH or nitrogen; Z represents oxygen or sulfur; R6 and R7 each represents hydrogen, C1-8 alkyl, etc.; and R8 represents hydrogen or C1-8 alkyl; provided that at least one of R3, R4, and R5 is not hydrogen) or a salt of the compound; and a PPAR-? activator which contains the compound or salt as the active ingredient.

Abstract: A compound represented by the following general formula (I): (wherein R1 represents phenyl, etc. which can have substituents selected from the group consisting of C1-8 alkyl, C1-8 alkyl having halogen, halogen, hydroxyl, etc.; R2 represents C1-8 alkyl, etc.; A represents oxygen, sulfur, etc.; X represents C1-8 alkylene chain, etc.; Y represents C(?O), CH?CH, etc.; R3, R4, and R5 each represents hydrogen, C1-8 alkyl, etc.; B represents CH or nitrogen; Z represents oxygen or sulfur; R6 and R7 each represents hydrogen, C1-8 alkyl, etc.; and R8 represents hydrogen or C1-8 alkyl; provided that at least one of R3, R4, and R5 is not hydrogen) or a salt of the compound; and a PPAR-? activator which contains the compound or salt as the active ingredient.

Abstract: A process for producing a multilayer board includes the steps of applying a bonding ink to the terminal of the first substrate, the bonding ink including a thermosetting resin containing a filler and a curing agent, the filler being formed of metal particles plated with solder, the metal particles each having a first melting point, and the solder having a second melting point lower than the first melting point; bonding the second substrate to a bonding sheet composed of a thermosetting resin and having a through hole disposed in a portion corresponding to the terminal of the second substrate; and heating and pressurizing the first and second substrates with the bonding sheet in such a manner that the terminals are opposite each other to effect curing of the bonding sheet and the bonding ink and to form an integral structure.

Abstract: A packaging method, a packaging structure and a package is substrate capable of restraining a warp of a thin film substrate, increasing a product yield, and building up a sufficient cooling capacity in the case of mounting an LSI having a high exothermic quantity. A package substrate 1 of the invention is such that an opening 11 is formed in a first substrate 12, a thin film substrate (a second substrate) 13 is laminated on the first substrate 12, the opening 11 is covered with the thin film substrate 13. Next, a capacitor (a first electronic part) 14 is inserted into the opening 11 and bonded to the thin film substrate, a resin 15 fills an interior of the opening 11 to a fixed or larger thickness and is hardened, the thin film substrate 13 and the capacitor 14 are thereby sustained by the resin 15, an LSI 16 (a second electronic part) that should be connected to the capacitor 14 is bonded to a surface, on an exposed side, of the thin film substrate 13, and the capacitor 14 is connected to the LSI 16.

Abstract: A plurality of base transceiver stations and at least one extension device are connected, via an IP network that uses internet protocol. The extension device shares resources of the base transceiver stations by arbitrary changing a connection relationship between the base transceiver stations and the extension devices. When a mobile terminal communicates with a core network, the extension device uses the resources of at least one base transceiver stations according to fluctuation in the amount of traffic.

Abstract: A semiconductor device includes a multi-layer substrate and a semiconductor element mounted on the multi-layer substrate. The multi-layer substrate contains a plurality of circuit-formation layers joined by a first resin material. The semiconductor element is mounted on the multi-layer substrate by being joined to the multi-layer substrate by a second resin material. The first resin material and the second resin material are curable in the same heating condition.

Abstract: A packaging method, a packaging structure and a package is substrate capable of restraining a warp of a thin film substrate, increasing a product yield, and building up a sufficient cooling capacity in the case of mounting an LSI having a high exothermic quantity. A package substrate 1 of the invention is such that an opening 11 is formed in a first substrate 12, a thin film substrate (a second substrate) 13 is laminated on the first substrate 12, the opening 11 is covered with the thin film substrate 13. Next, a capacitor (a first electronic part) 14 is inserted into the opening 11 and bonded to the thin film substrate, a resin 15 fills an interior of the opening 11 to a fixed or larger thickness and is hardened, the thin film substrate 13 and the capacitor 14 are thereby sustained by the resin 15, an LSI 16 (a second electronic part) that should be connected to the capacitor 14 is bonded to a surface, on an exposed side, of the thin film substrate 13, and the capacitor 14 is connected to the LSI 16.

Abstract: A compound represented by the following general formula (I): (wherein R1 represents phenyl, etc. which can have substituents selected from the group consisting of C1-8 alkyl, C1-8 alkyl having halogen, halogen, hydroxyl, etc.; R2 represents C1-8 alkyl, etc.; A represents oxygen, sulfur, etc.; X represents C1-8 alkylene chain, etc.; Y represents C(?O), CH?CH, etc.; R3, R4, and R5 each represents hydrogen, C1-8 alkyl, etc.; B represents CH or nitrogen; Z represents oxygen or sulfur; R6 and R7 each represents hydrogen, C1-8 alkyl, etc.; and R8 represents hydrogen or C1-8 alkyl; provided that at least one of R3, R4, and R5 is not hydrogen) or a salt of the compound; and a PPAR-? activator which contains the compound or salt as the active ingredient.

Abstract: The developer of the present invention is used in a method where a water-soluble resin coating layer is applied on a resist pattern formed by the conventional method, and the coating layer is crosslinked by an acid supplied from the resist, and the uncrosslinked area in the coating layer is dissolved and removed with a developer to thicken the resist pattern. This developer comprises an aqueous solution containing at least one surfactant selected from an N-acylsarcosinate, an N-acyl-N-methylalaninate, an N-acyltaurinate, an N-acyl-N-methyltaurinate, a fatty acid alkylol amide, and a fatty acid alkylol amide polyoxyethylene adduct.

Abstract: A compound represented by the formula (I) or a salt of the compound, and a PPAR-? activator which contains the compound or salt as the active ingredient: (wherein A represents O or S; B1 represents N, etc.; B2 represents O, etc.; each of X1 and X2 represents O, S, a bond, etc.; Y represents C1-8 alkylene chain; z represents O or S; R1 represents aryl, etc. which can have substituents; R2 represents C1-8 alkyl, etc.; R3 represents C1-8 alkyl, C2-8 alkenyl, etc.; each of R4 and R5 represents hydrogen, C1-8 alkyl, etc.; and R6 represents hydrogen, etc.; provided that each of Z and R3 is attached to the benzene ring, and X2 is not attached to the benzene ring).

Abstract: A layered board is disclosed which can avoid the occurrence of cracks in a core layer due to shearing stress caused by a difference in coefficient of thermal expansion between the core layer and a buildup layer. The layered board includes a core layer which serves as a printed board, a buildup layer which includes an insulation part and a wiring part, is overlaid on the core layer, and is electrically connected to the core layer, and an edge layer formed at least at an edge on the periphery of the core layer, the edge layer being different from the core layer. Alternatively, the core layer projects outward from an edge on the periphery of the buildup layer.

Abstract: A compound represented by the formula (I) or a salt of the compound, and a PPAR-? activator which contains the compound or salt as the active ingredient: (wherein A represents O or S; B1 represents N, etc.; B2 represents O, etc.; each of X1 and X2 represents O, S, a bond, etc.; Y represents C1-8 alkylene chain; Z represents O or S; R1 represents aryl, etc. which can have substituents; R2 represents C1-8 alkyl, etc.; R3 represents C1-8 alkyl, C2-8 alkenyl, etc.; each of R4 and R5 represents hydrogen, C1-8 alkyl, etc.; and R6 represents hydrogen, etc.; provided that each of Z and R3 is attached to the benzene ring, and X2 is not attached to the benzene ring).

Abstract: A semiconductor device comprising a substrate, a semiconductor element mounted on the substrate, an inner annular stiffener provided on the substrate in an outer side of the semiconductor element, and an outer annular stiffener provided on the substrate in an outer side of the inner annular stiffener. The inner annular stiffener and the outer annular stiffener are made of different materials. Particularly, the thermal expansion coefficient of the inner annular stiffener is selected to be smaller than that of the substrate, and the thermal expansion coefficient of the outer annular stiffener is selected to be larger than that of the substrate. The amount of deformation of the substrate is thus decreased.

Abstract: A layered board includes a core layer that serves as a printed board, a buildup layer that is electrically connected to the core layer, the buildup layer including an insulation part and a wiring part, and a junction layer that electrically connects and bonds the core layer with the buildup layer, wherein the junction layer includes an adhesive and metallic particles contained in the adhesive, wherein each of the metallic particles has a first melting point, serves as a filler, and is plated with solder having a second melting point lower than the first melting point.

Abstract: A phenylacetic acid derivative represented by the general formula (II) (wherein R11 and R12 each represents hydrogen, C1-8 alkyl, C1-8 alkoxy, C1-8 alkyl substituted by one to three halogen atoms, an optionally substituted phenyl, naphthyl, pyridyl, thienyl, or furyl group, etc.; X1 and Z1 each represents —C(?O)—, —C(?O)NH, —NHC(?O)—, —CH?CH—, a bond, etc.

Abstract: A manufacturing method of a layered board that includes a core layer that serves as a printed board, and a buildup layer that is electrically connected to said core layer, said buildup layer including an insulation-part and a wiring part includes the step of setting a coefficient of thermal expansion, a thickness and a modulus of longitudinal elasticity of each layer so that the layered board has a predetermined value of the coefficient of thermal expansion.

Abstract: A semiconductor device including a substrate, a semiconductor element mounted on the substrate and a stiffener attached via an adhesive to a surface of the substrate opposite a surface thereof on which the semiconductor element is mounted. The adhesive has a coefficient of thermal expansion smaller than that of the substrate and that of the stiffener, and the modulus of longitudinal elasticity of the adhesive is equal to or larger than 10 GPa. Otherwise, the adhesive has a coefficient of thermal expansion larger than that of the substrate and that of the stiffener, and the modulus of longitudinal elasticity of the adhesive is equal to or smaller than 10 GPa. The height of the stiffener is less than that of the external terminals.

Abstract: An image reading apparatus for reading indicia on the front and back surfaces of a document using two image sensors includes a document detection sensor to detect the document, a first image sensor for reading an image on one surface of the document, a second image sensor for reading an image on the other surface of the document, and a controller. The controller starts to read the image data from the first and second image sensors when prescribed amounts of time have passed after the document detection sensor detects the leading edge of the document, and stops the reading of the image data from the image sensors. The structure provides a lightweight and compact apparatus while reducing image noise caused by the mutual interferences of the light sources in reading the image data.

Abstract: A packaging method, a packaging structure and a package is substrate capable of restraining a warp of a thin film substrate, increasing a product yield, and building up a sufficient cooling capacity in the case of mounting an LSI having a high exothermic quantity. A package substrate 1 of the invention is such that an opening 11 is formed in a first substrate 12, a thin film substrate (a second substrate) 13 is laminated on the first substrate 12, the opening 11 is covered with the thin film substrate 13. Next, a capacitor (a first electronic part) 14 is inserted into the opening 11 and bonded to the thin film substrate, a resin 15 fills an interior of the opening 11 to a fixed or larger thickness and is hardened, the thin film substrate 13 and the capacitor 14 are thereby sustained by the resin 15, an LSI 16 (a second electronic part) that should be connected to the capacitor 14 is bonded to a surface, on an exposed side, of the thin film substrate 13, and the capacitor 14 is connected to the LSI 16.