Patents by Inventor Takashi Kanda

Takashi Kanda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060063303
    Abstract: A packaging method, a packaging structure and a package is substrate capable of restraining a warp of a thin film substrate, increasing a product yield, and building up a sufficient cooling capacity in the case of mounting an LSI having a high exothermic quantity. A package substrate 1 of the invention is such that an opening 11 is formed in a first substrate 12, a thin film substrate (a second substrate) 13 is laminated on the first substrate 12, the opening 11 is covered with the thin film substrate 13. Next, a capacitor (a first electronic part) 14 is inserted into the opening 11 and bonded to the thin film substrate, a resin 15 fills an interior of the opening 11 to a fixed or larger thickness and is hardened, the thin film substrate 13 and the capacitor 14 are thereby sustained by the resin 15, an LSI 16 (a second electronic part) that should be connected to the capacitor 14 is bonded to a surface, on an exposed side, of the thin film substrate 13, and the capacitor 14 is connected to the LSI 16.
    Type: Application
    Filed: November 3, 2005
    Publication date: March 23, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Masateru Koide, Misao Umematsu, Takashi Kanda, Yasuhiro Usui, Kenji Fukuzono
  • Publication number: 20060043548
    Abstract: A semiconductor device includes a substrate, a semiconductor element mounted on the substrate and a stiffener attached via an adhesive to a surface of the substrate opposite to a surface thereof on which the semiconductor element is mounted. The adhesive has a coefficient of thermal expansion smaller than that of the substrate and that of the stiffener, and the modulus of longitudinal elasticity of the adhesive is equal to or larger than 10 GPa. Otherwise, the adhesive has coefficient of thermal expansion larger than that of the substrate and that of the stiffener, and the modulus of longitudinal elasticity of the adhesive is equal to or smaller than 10 GPa. The height of the stiffener is less than that of the external terminals.
    Type: Application
    Filed: November 22, 2004
    Publication date: March 2, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Takashi Kanda, Kenji Fukuzono
  • Patent number: 6988486
    Abstract: An air-fuel ratio control apparatus for a multiple cylinder engine, having catalytic converters and air-fuel ratio sensors in an exhaust manifold, comprises exhaust air-fuel ratio variation determining means which determines a variation in exhaust air-fuel ratio between one cylinder and other cylinders in one cylinder group when an exhaust air-fuel ratio on one of the rich side and the lean side with respect to a predetermined value is detected as to the one cylinder twice in succession, an exhaust air-fuel ratio on the other one of the rich side and the lean side from the exhaust air-fuel ratio of the one cylinder, and combustion air-fuel ratio control means which feedback-compensates the quantity of fuel injected into the one cylinder, and feedback-compensated the quantity of fuel injected into the other cylinder in a direction opposite to the direction in which the quantity of fuel injected into the one cylinder is compensated.
    Type: Grant
    Filed: June 25, 2004
    Date of Patent: January 24, 2006
    Assignee: Mitsubishi Jidosha Kogyo Kabushiki Kaisha
    Inventors: Katsunori Ueda, Hideyuki Handa, Takashi Kanda
  • Publication number: 20050266213
    Abstract: A layered board includes a core layer that serves as a printed board, a buildup layer that is electrically connected to the core layer, the buildup layer including an insulation part and a wiring part, and a junction layer that electrically connects and bonds the core layer with the buildup layer, wherein the junction layer includes an adhesive and metallic particles contained in the adhesive, wherein each of the metallic particles has a first melting point, serves as a filler, and is plated with solder having a second melting point lower than the first melting point.
    Type: Application
    Filed: November 29, 2004
    Publication date: December 1, 2005
    Applicant: FUJITSU LIMITED
    Inventors: Takashi Kanda, Kenji Fukuzono, Manabu Watanabe
  • Publication number: 20050266212
    Abstract: A manufacturing method of a layered board that includes a core layer that serves as a printed board, and a buildup layer that is electrically connected to said core layer, said buildup layer including an insulation part and a wiring part includes the step of setting a coefficient of thermal expansion, a thickness and a modulus of longitudinal elasticity of each layer so that the layered board has a predetermined value of the coefficient of thermal expansion.
    Type: Application
    Filed: November 29, 2004
    Publication date: December 1, 2005
    Applicant: FUJITSU LIMITED
    Inventors: Takashi Kanda, Kenji Fukuzono, Manabu Watanabe
  • Patent number: 6959125
    Abstract: It is an object of the present invention to enhance laser beam transmitting efficiency by accurately controlling an interval between a light emitting (light receiving) element (20) and an optical wave-guide substrate (1) without causing any fluctuation in the interval in a mounting structure of the light transmitting element in which the light emitting (light receiving) element (20) is mounted on the optical wave-guide substrate (1). When the light emitting (light receiving) element is joined to the sub-mount chip (4) and when the sub-mount chip (4) is joined to the optical wave-guide while the element is being directed to the substrate side, the sub-mount chip and the optical wave-guide substrate are joined to each other by the solder bump (6). A post (5) is arranged for regulating an interval between the light emitting (light receiving) element and the optical wave-guide substrate.
    Type: Grant
    Filed: January 14, 2003
    Date of Patent: October 25, 2005
    Assignee: Fujitsu Limited
    Inventors: Takashi Kanda, Kiyotaka Seyama, Kaoru Sugimoto, Souichi Obata, Yasutomo Maehara
  • Patent number: 6954038
    Abstract: An electronic ballast for a discharge lamps has a dimming control for varying an input DC voltage and an input driving frequency in combination to achieve a lamp dimming in accordance with a dimmer demand. The ballast includes a dimming processor with a memory for storing a table that gives a predetermined relation between the dimming demand and a voltage command designating the input DC voltage as well as a frequency command designating the input driving frequency. A command processing unit is included in the processor to derive the voltage and frequency commands that matches with the dimmer demand so as to vary the light output of the lamp in accordance with the voltage command and the frequency command, respectively derived from the table.
    Type: Grant
    Filed: May 23, 2003
    Date of Patent: October 11, 2005
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Shigeru Ido, Naoki Onishi, Takashi Kanda
  • Publication number: 20050183706
    Abstract: An air-fuel ratio control apparatus for a multiple cylinder engine, having catalytic converters and air-fuel ratio sensors in an exhaust manifold, comprises exhaust air-fuel ratio variation determining means which determines a variation in exhaust air-fuel ratio between one cylinder and other cylinders in one cylinder group when an exhaust air-fuel ratio on one of the rich side and the lean side with respect to a predetermined value is detected as to the one cylinder twice in succession, an exhaust air-fuel ratio on the other one of the rich side and the lean side from the exhaust air-fuel ratio of the one cylinder, and combustion air-fuel ratio control means which feedback-compensates the quantity of fuel injected into the one cylinder, and feedback-compensated the quantity of fuel injected into the other cylinder in a direction opposite to the direction in which the quantity of fuel injected into the one cylinder is compensated.
    Type: Application
    Filed: June 25, 2004
    Publication date: August 25, 2005
    Inventors: Katsunori Ueda, Hideyuki Handa, Takashi Kanda
  • Publication number: 20050161816
    Abstract: A semiconductor device comprising a substrate, a semiconductor element mounted on the substrate, an inner annular stiffener provided on the substrate in an outer side of the semiconductor element, and an outer annular stiffener provided on the substrate in an outer side of the inner annular stiffener. The inner annular stiffener and the outer annular stiffener are made of different materials. Particularly, the thermal expansion coefficient of the inner annular stiffener is selected to be smaller than that of the substrate, and the thermal expansion coefficient of the outer annular stiffener is selected to be larger than that of the substrate. The amount of deformation of the substrate is thus decreased.
    Type: Application
    Filed: March 25, 2005
    Publication date: July 28, 2005
    Applicant: FUJITSU LIMITED
    Inventor: Takashi Kanda
  • Publication number: 20050130082
    Abstract: A novel developing solution for photoresists which is suitable for use as a developing solution for a photoresist formed on an aluminum-containing base formed on a wafer. It comprises an alkali builder, a calcium compound, and a chelating agent, the chelating agent being selected from the group consisting of 1-hydroxyethylidene-1,1-diphosphonic acid, aminotrimethylenephosphonic acid, 2-phosphonobutane-1,2,4-tricarboxylic acid, ethylenediaminetetramethylenphosphonic acid, diethylencetriaminepentamethylenephosphonic acid, hexamethylenediaminetetraethylenephosphonic acid, and diethylenetriaminepenta(methylenephosphonic acid).
    Type: Application
    Filed: December 13, 2002
    Publication date: June 16, 2005
    Inventors: Takashi Kanda, Masaki Kondo
  • Publication number: 20050112503
    Abstract: A novel developing solution for photoresists which contains an alkali builder, a fluorine-free surfactant which is a phosphonic acid or phosphate, and a fluorinated surfactant.
    Type: Application
    Filed: December 13, 2002
    Publication date: May 26, 2005
    Inventors: Takashi Kanda, Masaki Kondo
  • Publication number: 20050096363
    Abstract: A compound represented by the formula (I) or a salt of the compound, and a PPAR-? activator which contains the compound or salt as the active ingredient: (wherein A represents O or S; B1 represents N, etc.; B2 represents O, etc.; each of X1 and X2 represents O, S, a bond, etc.; Y represents C1-8 alkylene chain; Z represents O or S; R1 represents aryl, etc. which can have substituents; R2 represents C1-8 alkyl, etc.; R3 represents C1-8 alkyl, C2-8 alkenyl, etc.; each of R4 and R5 represents hydrogen, C1-8 alkyl, etc.; and R6 represents hydrogen, etc.; provided that each of Z and R3 is attached to the benzene ring, and X2 is not attached to the benzene ring).
    Type: Application
    Filed: October 9, 2002
    Publication date: May 5, 2005
    Inventors: Shogo Sakuma, Tomio Yamakawa, Takashi Kanda, Seiichiro Masui
  • Publication number: 20050054674
    Abstract: A compound represented by the following general formula (I): (wherein R1 represents phenyl, etc. which can have substituents selected from the group consisting of C1-8 alkyl, C1-8 alkyl having halogen, halogen, hydroxyl, etc.; R2 represents C1-8 alkyl, etc.; A represents oxygen, sulfur, etc.; X represents C1-8 alkylene chain, etc.; Y represents C(?O), CH?CH, etc.; R3, R4, and R5 each represents hydrogen, C1-8 alkyl, etc.; B represents CH or nitrogen; Z represents oxygen or sulfur; R6 and R7 each represents hydrogen, C1-8 alkyl, etc.; and R8 represents hydrogen or C1-8 alkyl; provided that at least one of R3, R4, and R5 is not hydrogen) or a salt of the compound; and a PPAR-? activator which contains the compound or salt as the active ingredient.
    Type: Application
    Filed: August 2, 2002
    Publication date: March 10, 2005
    Inventors: Shogo Sakuma, Tomio Yamakawa, Takashi Kanda, Seiichiro Masui
  • Publication number: 20040239262
    Abstract: An electronic ballast for a discharge lamps has a dimming control for varying an input DC voltage and an input driving frequency in combination to achieve a lamp dimming in accordance with a dimmer demand. The ballast includes a dimming processor with a memory for storing a table that gives a predetermined relation between the dimming demand and a voltage command designating the input DC voltage as well as a frequency command designating the input driving frequency. A command processing unit is included in the processor to derive the voltage and frequency commands that matches with the dimmer demand so as to vary the light output of the lamp in accordance with the voltage command and the frequency command, respectively derived from the table.
    Type: Application
    Filed: March 12, 2004
    Publication date: December 2, 2004
    Inventors: Shigeru Ido, Naoki Noishi, Takashi Kanda
  • Publication number: 20040229170
    Abstract: The developer of the present invention is used in a method where a water-soluble resin coating layer is applied on a resist pattern formed by the conventional method, and the coating layer is crosslinked by an acid supplied from the resist, and the uncrosslinked area in the coating layer is dissolved and removed with a developer to thicken the resist pattern. This developer comprises an aqueous solution containing at least one surfactant selected from an N-acylsarcosinate, an N-acyl-N-methylalaninate, an N-acyltaurinate, an N-acyl-N-methyltaurinate, a fatty acid alkylol amide, and a fatty acid alkylol amide polyoxyethylene adduct.
    Type: Application
    Filed: June 21, 2004
    Publication date: November 18, 2004
    Inventor: Takashi Kanda
  • Publication number: 20040224252
    Abstract: A photosensitive resin composition and a method for the formation of a resin pattern using the photosensitive resin composition are provided. The photosensitive resin composition contains, as a catalyst precursor, a catalytic metal element with a metal-deposition catalytic activity suitable for electroless metal plating. The method for the formation of a resin pattern uses a photosensitive resin composition, which contains, as a catalyst precursor, a catalytic metal element with a metal-deposition catalytic activity suitable for electroless metal plating. By using the method of this invention, it is possible to form a conductive film selectively on a resin pattern formed through exposure and development of the photosensitive resin composition of this invention.
    Type: Application
    Filed: January 30, 2004
    Publication date: November 11, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Masaki Kondo, Takashi Kanda
  • Publication number: 20040183193
    Abstract: A packaging method, a packaging structure and a package is substrate capable of restraining a warp of a thin film substrate, increasing a product yield, and building up a sufficient cooling capacity in the case of mounting an LSI having a high exothermic quantity. A package substrate 1 of the invention is such that an opening 11 is formed in a first substrate 12, a thin film substrate (a second substrate) 13 is laminated on the first substrate 12, the opening 11 is covered with the thin film substrate 13. Next, a capacitor (a first electronic part) 14 is inserted into the opening 11 and bonded to the thin film substrate, a resin 15 fills an interior of the opening 11 to a fixed or larger thickness and is hardened, the thin film substrate 13 and the capacitor 14 are thereby sustained by the resin 15, an LSI 16 (a second electronic part) that should be connected to the capacitor 14 is bonded to a surface, on an exposed side, of the thin film substrate 13, and the capacitor 14 is connected to the LSI 16.
    Type: Application
    Filed: March 19, 2004
    Publication date: September 23, 2004
    Applicant: FUJITSU LIMITED
    Inventors: Masateru Koide, Misao Umematsu, Takashi Kanda, Yasuhiro Usui, Kenji Fukuzono
  • Patent number: 6787552
    Abstract: Compounds of the general formula (I) or salts thereof and activators of PPAR&dgr; (peroxisome proliferator activated receptor &dgr;) containing the compounds or the salts as the active ingredient: wherein R1 and R2 each are hydrogen, C1-8 alkyl, an aryl or heterocyclic group which may be substituted, or the like; A is oxygen, sulfur, or the like; X1 and X2 are each a free valency, oxygen, S(O)p (wherein p is an integer of 0 to 2), C(═O), C(═O)NH, NHC(═O), CH═CH, or the like; Y is optionally substituted C1-8 alkylene; Z is oxygen or sulfur; R3 and R4 are each optionally substituted C1-8 alkyl; and R8 is hydrogen or C1-8 alkyl, with the proviso that when X1 is a free valency, X2 is not O or S(O)p, while when X1 is C(═O)NH, X2 is not a free valency.
    Type: Grant
    Filed: February 11, 2003
    Date of Patent: September 7, 2004
    Assignee: Nippon Chemiphar Co., Ltd.
    Inventors: Shogo Sakuma, Tsuyoshi Endo, Atsushi Tendo, Toshihiro Takahashi, Shinichi Yoshida, Kunio Kobayashi, Nobutaka Mochizuki, Tomio Yamakawa, Takashi Kanda, Seiichiro Masui
  • Publication number: 20040152744
    Abstract: A phenylacetic acid derivative represented by the general formula (II) (wherein R11 and R12 each represents hydrogen, C1-8 alkyl, C1-8 alkoxy, C1-8 alkyl substituted by one to three halogen atoms, an optionally substituted phenyl, naphthyl, pyridyl, thienyl, or furyl group, etc.; X1 and Z1 each represents —C(═O)—, —C(═O)NH, —NHC(═O)—, —CH═CH—, a bond, etc.; and Y1 represents a C1-8 alkylene chain) or a salt of the derivative; and a PPAR&dgr; activator which contains the derivative or salt as the active ingredient.
    Type: Application
    Filed: September 23, 2003
    Publication date: August 5, 2004
    Inventors: Shogo Sakuma, Tsuyoshi Endo, Takashi Kanda, Seiichiro Masui
  • Publication number: 20040097739
    Abstract: Compounds of the general formula (I) or salts thereof and activators of PPAR&dgr; (peroxisome proliferator activated receptor &dgr;) containing the compounds or the salts as the active ingredient: wherein R1 and R2 each are hydrogen, C1-8 alkyl, an aryl or heterocyclic group which may be substituted, or the like; A is oxygen, sulfur, or the like; X1 and X2 are each a free valency, oxygen, S(O)p (wherein p is an integer of 0 to 2), C(═O), C(═O)NH, NHC(═O), CH═CH, or the like; Y is optionally substituted C1-8 alkylene; Z is oxygen or sulfur; R3 and R4 are each optionally substituted C1-8 alkyl; and R8 is hydrogen or C1-8 alkyl, with the proviso that when X1 is a free valency, X2 is not O or S(O)p, while when X1 is C(═O)NH, X2 is not a free valency.
    Type: Application
    Filed: February 11, 2003
    Publication date: May 20, 2004
    Inventors: Shogo Sakuma, Tsuyoshi Endo, Atsushi Tendo, Toshihiro Takahashi, Shinichi Yoshida, Kunio Kobayashi, Nobutaka Mochizuka, Tomio Yamakawa, Takashi Kanda, Seiichiro Masui