Abstract: Inside a first case outer frame portion as an outer frame of the first case, a plurality of first core pieces and a partition to separate a pair of adjacent first core pieces among the plurality of first core pieces are disposed. The first case has a shape capable of accommodating at least a part of the second core piece. The first case outer frame portion includes a first case accommodating portion as a portion of the first case outer frame portion that is capable of accommodating the plurality of first core pieces, and a first case cover portion to cover a space inside the first case accommodating portion.

Abstract: A laminate coil is formed by laminating a plurality of multilayer insulating members such that a first coil, a second coil, and a third coil each formed of a flat conductor are sandwiched between the plurality of multilayer insulating members. In the laminate coil, a through-hole is provided inside the coil in planar view. The plurality of multilayer insulating members adjacent to each other in a multilayer direction are bonded to each other at an inner end of the laminate coil positioned on the through-hole side, and an inside end of each of the first coil, the second coil, and the third coil is sealed by the multilayer insulating member.

Abstract: A transformer includes a core group and a winding group. Each of a plurality of winding layers penetrates through a plurality of closed magnetic circuits formed by a plurality of cores. When viewed from the top, the cores are disposed with spacing along conductor wires through which current of the winding layers flows, and the winding layers are disposed side by side from the inside to the outside with spacing along a direction intersecting the direction of current. With this configuration, a coil device with good heat dissipation performance, compact size, high efficiency, and low costs can be provided.

Abstract: A power source device includes a capacitive load; and an AC power source, as a voltage source, which applies AC voltage to the capacitive load. A series circuit composed of an inductor and a capacitor is connected to the AC power source. A series circuit composed of a load inductor and the capacitive load is connected in parallel to one of the inductor or the capacitor. If an inductance of the inductor is defined as Lp, a capacitance of the capacitor is defined as Cp, an inductance of the load inductor is defined as Ls, an equivalent capacitance of the capacitive load is defined as Cs, and a frequency of the AC power source is defined as fv, the following expressions are satisfied, 0.8/((2?·fv){circumflex over (?)}2)<Lp·Cp<1.2/((2?·fv){circumflex over (?)}2) 0.8/((2?·fv){circumflex over (?)}2)<Ls·Cs<1.2/((2?·fv){circumflex over (?)}2).

Abstract: A first leg portion is arranged between a second leg portion and a third leg portion. A first conductive member includes a first winding wound around the first leg portion and a second winding connected in series to the first winding and wound around the second leg portion. A second conductive member includes a third winding wound around the first leg portion and a fourth winding connected in series to the third winding and wound around the third leg portion. The first leg portion includes a first core member provided with a plurality of gaps and constituted of core pieces and a plurality of first gap members each made of a non-magnetic body and arranged in respective ones of the plurality of gaps in the first core member. Thus, influence by induction heating of the winding can be lessened and a coil can be reduced in size.

Abstract: The present invention relates to a polyamide resin composition that is excellent in mechanical characteristics, bonding properties and calcium chloride resistance and is suitably bonded to an acid-modified polyolefin, wherein the polyamide resin composition includes 70 to 99 mass % of an aliphatic polyamide resin (A) having an amino group concentration of 46 to 110 ?mol/g, 0 to 18 mass % of an aromatic polyamide resin (B), 0.01 to 0.50 mass % of a polyalkylene glycol alkyl ether (C), 0.01 to 0.50 mass % of a polyolefin wax (D) and 0 to 22.98 mass % of a component (E) other than (A) to (D), and the total of (A) to (E) is 100 mass %, and wherein the acid-modified polyolefin having an amount of acid modification of 8 to 100 ?mol/g.

Abstract: The present invention relates to a semiconductor device including a printed circuit board, an electronic component, and a heat diffusion part. The printed circuit board includes an insulation layer, first and second conductor layers disposed respectively on first and second main faces of the insulation layer, a plurality of heat radiation vias penetrating from the first conductor layer to the second conductor layer on the insulation layer, and a conductor film covering inner side walls of the heat radiation vias. The heat radiation vias are provided at positions overlapping the electronic component and the heat radiation part in plan view viewed from the first main face of the printed circuit board. The heat diffusion part is disposed overlapping at least some of the heat radiation vias in plan view viewed from the second main face of the printed circuit board.

Abstract: The present invention relates to a polyamide resin composition that is excellent in mechanical characteristics, bonding properties, calcium chloride resistance and fuel resistance and is suitably bonded to an acid-modified polyolefin, wherein the polyamide resin composition includes 40 to 93 mass % of an aliphatic polyamide resin (A) having an amino group concentration of 46 to 110 ?mol/g, 2 to 10 mass % of an aromatic polyamide resin (B), 5 to 50 mass % of reinforcing fibers (C), and 0 to 53 mass % of a component (D) other than (A) to (C), and the total amount of (A) to (D) is 100 mass %, and wherein the amount of acid modification of the acid-modified polyolefin is 5 to 100 ?mol/g.

Abstract: A substrate processing system installed on a floor face is provided. The substrate processing system includes a substrate transfer module, a supporting table including a top plate disposed separately from the floor face, a plurality of substrate processing modules disposed on the top plate and coupled to the substrate transfer module along a lateral side of the substrate transfer module, and a plurality of power units disposed below the top plate. Further, the plurality of power units correspond to the plurality of substrate processing modules, respectively, and each of the power units is configured to supply electric power to the corresponding processing module.

Abstract: A substrate processing system includes a first chamber, a second chamber, and a cooling passage. The first chamber has therein a space for processing a substrate transferred from a first transfer chamber maintained in a vacuum atmosphere. The second chamber is disposed below the first chamber to be vertically aligned with the first chamber and configured to communicate with the first transfer chamber and a second transfer chamber maintained in an atmospheric atmosphere. The second chamber has substantially the same footprint as a footprint of the first chamber. Further, a cooling passage is disposed between the first chamber and the second chamber and configured to allow a coolant to flow therethrough.

Abstract: A substrate processing system installed on a floor face is provided. The substrate processing system includes a substrate transfer module, a supporting table including a top plate disposed separately from the floor face, a plurality of substrate processing modules disposed on the top plate and coupled to the substrate transfer module along a lateral side of the substrate transfer module, and a plurality of power units disposed below the top plate. Further, the plurality of power units correspond to the plurality of substrate processing modules, respectively, and each of the power units is configured to supply electric power to the corresponding processing module.

Abstract: A core cooling structure includes a core and a housing. The core includes an upper core and a lower core. The core is attached to the housing. The upper core includes a heat dissipation fin that extends along a magnetic path and is disposed at an interval in a direction intersecting the magnetic path. The lower core is attached so as to be fitted into the housing.

Abstract: A laminated coil includes planar coils and a first insulating member. The planar coils are arranged in a first direction intersecting a first surface. The first insulating member is in a film form and arranged between a pair of planar coils adjacent to each other in the first direction. At least one of the planar coils is wound to have a plurality of turns spaced apart from each other in a second direction along the first surface. A second insulating member is arranged between the turns adjacent to each other in the second direction of at least one of the planar coils.

Abstract: A circuit device capable of significantly improving heat dissipation performance of a printed circuit board without increasing the size includes a printed circuit board, a mounted component, a non-solid metal spacer, a cooler, and a resin layer. The mounted component is at least partially disposed on at least one main surface of printed circuit board. The non-solid metal spacer is disposed at least on one main surface of the printed circuit board. The cooler is disposed at the non-solid metal spacer on the opposite side to the printed circuit board. The resin layer is disposed between the non-solid metal spacer and the cooler. The non-solid metal spacer has a shape that allows at least one hollow portion to be formed between the printed circuit board and the cooler.

Abstract: A coil device includes: a core having a first surface and a second surface located opposite to the first surface; a coil member including a first portion and a second portion that are spaced apart from each other in a first direction along the first surface; and a support portion in contact with the first surface and the second surface to support the core. The core includes a middle leg sandwiched between the first portion and the second portion in the first direction. The core is provided with a first slit as a first recessed portion recessed relative to the first surface and reaching the middle leg. The support portion includes a first protruding portion disposed inside the first slit and in contact with the middle leg.

Abstract: In a coil device of a power conversion device, a laminated coil includes planar coils laminated on a surface of a support. A plurality of cores are spaced apart from each other and aligned in a longitudinal direction of the planar coils, and each core includes a portion around which the laminated coil is wound on the surface of the support. A first protruding member (is arranged between a pair of cores adjacent to each other with respect to a longitudinal direction and is fixed to the support. A first fixing member is arranged above the first protruding member. The laminated coil is sandwiched and fixed between the first fixing member and the first protruding member such that a first surface is in contact with the first protruding member and a second surface is in contact with the first fixing member.

Abstract: A coil apparatus includes a coil unit including a coil, a base core that is a first core component, and a core module that is a second core component. The first core component includes a center leg that is a leg around which the coil is wound. The second core component includes a plurality of core segments arranged in a row with gaps between them. The second core component is connected to the leg to form a magnetic path together with the first core component.

Abstract: Provided is a highly reliable power circuit device. The power circuit device includes a printed substrate, a power circuit, and a housing. The power circuit is formed on the printed substrate. The housing is connected with the printed substrate. The power circuit includes secondary-side switching elements, at least one smoothing choke coil, and smoothing capacitors. Portions of a smoothing choke coil core serving as a core of the smoothing choke coil are inserted in opening portions formed in the printed substrate. A winding of the smoothing choke coil is formed on the printed substrate. The smoothing choke coil is located between a region C in which the smoothing capacitors are arranged and regions A and B serving as a second region in which primary-side switching elements and the secondary-side switching elements serving as electric elements are arranged.

Abstract: Inside a first case outer frame portion as an outer frame of the first case, a plurality of first core pieces and a partition to separate a pair of adjacent first core pieces among the plurality of first core pieces are disposed. The first case has a shape capable of accommodating at least a part of the second core piece. The first case outer frame portion includes a first case accommodating portion as a portion of the first case outer frame portion that is capable of accommodating the plurality of first core pieces, and a first case cover portion to cover a space inside the first case accommodating portion.

Abstract: A power converter includes a magnetic core, a plurality of windings, a plurality of metal sidewalls, a first insulating member, and a second insulating member. The plurality of windings are each wound around the magnetic core and bent to have a portion extending in a direction in which the magnetic core extends. The plurality of metal sidewalls are disposed outside the plurality of windings and extend in the direction in which the magnetic core extends. The first insulating member is disposed between the plurality of windings and between the windings and the magnetic core. The second insulating member is disposed on an outside of the plurality of windings and in contact with each of the plurality of sidewalls and each of the plurality of windings. The second insulating member has a thermal conductivity higher than a thermal conductivity of the first insulating member.