Patents by Inventor Takashi Kumagai
Takashi Kumagai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12227644Abstract: The present invention relates to a polyamide resin composition that is excellent in mechanical characteristics, bonding properties and calcium chloride resistance and is suitably bonded to an acid-modified polyolefin, wherein the polyamide resin composition includes 70 to 99 mass % of an aliphatic polyamide resin (A) having an amino group concentration of 46 to 110 ?mol/g, 0 to 18 mass % of an aromatic polyamide resin (B), 0.01 to 0.50 mass % of a polyalkylene glycol alkyl ether (C), 0.01 to 0.50 mass % of a polyolefin wax (D) and 0 to 22.98 mass % of a component (E) other than (A) to (D), and the total of (A) to (E) is 100 mass %, and wherein the acid-modified polyolefin having an amount of acid modification of 8 to 100 ?mol/g.Type: GrantFiled: March 19, 2021Date of Patent: February 18, 2025Assignee: UBE CORPORATIONInventors: Tetsuya Yasui, Akane Sakamoto, Yuki Suedomi, Hitoshi Kodama, Kosuke Oishi, Takashi Kumagai, Mikako Fujita
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Patent number: 12224677Abstract: A power source device includes a capacitive load; and an AC power source, as a voltage source, which applies AC voltage to the capacitive load. A series circuit composed of an inductor and a capacitor is connected to the AC power source. A series circuit composed of a load inductor and the capacitive load is connected in parallel to one of the inductor or the capacitor. If an inductance of the inductor is defined as Lp, a capacitance of the capacitor is defined as Cp, an inductance of the load inductor is defined as Ls, an equivalent capacitance of the capacitive load is defined as Cs, and a frequency of the AC power source is defined as fv, the following expressions are satisfied, 0.8/((2?·fv){circumflex over (?)}2)<Lp·Cp<1.2/((2?·fv){circumflex over (?)}2) 0.8/((2?·fv){circumflex over (?)}2)<Ls·Cs<1.2/((2?·fv){circumflex over (?)}2).Type: GrantFiled: January 27, 2021Date of Patent: February 11, 2025Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Taichiro Tamida, Shingo Tsuda, Daisuke Takauchi, Takashi Kumagai
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Publication number: 20240422952Abstract: A power conversion device includes: a case having a side wall and a bottom wall; a plurality of first heat dissipation plates, a plurality of second heat dissipation plates, a plurality of circuit components and a sealing material that are disposed in the case; and a printed wiring board electrically connected to the plurality of circuit components and attached to the case. An inner wall surface of the bottom wall has a normal along a first direction. The plurality of first heat dissipation plates each extend in a second direction orthogonal to the first direction, and are spaced from one another and arranged in a third direction orthogonal to the first direction and the second direction. The plurality of second heat dissipation plates each extend in the third direction, and are spaced from one another and arranged in the second direction.Type: ApplicationFiled: September 7, 2022Publication date: December 19, 2024Applicant: Mitsubishi Electric CorporationInventors: Norikazu HATTORI, Kenta FUJII, Yukiko MORI, Takashi KUMAGAI, Yoshikazu TSUNODA, Yuji SHIRAKATA
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Publication number: 20240388214Abstract: A power conversion device includes a housing, a plurality of circuit components accommodated in the housing, at least one heat dissipation plate accommodated in the housing, and a substrate. Each of the plurality of circuit components includes an element body and a current-carrying terminal electrically connected to an electrode surface of the element body. The substrate is electrically connected to the current-carrying terminal. The at least one heat dissipation plate is disposed between two adjacent circuit components of the plurality of circuit components and thermally connected to the housing.Type: ApplicationFiled: September 14, 2022Publication date: November 21, 2024Applicant: Mitsubishi Electric CorporationInventors: Yukiko MORI, Kenta FUJII, Yoshikazu TSUNODA, Takashi KUMAGAI, Yuji SHIRAKATA, Norikazu HATTORI, Yoshimichi SAITO
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Patent number: 12119155Abstract: The present invention has an object of providing a reactor including cores with higher heat dissipation and a coil with less eddy-current loss. A reactor according to the present invention includes: a plurality of divided cores having a shape obtained by dividing an annular core in a circumferential direction, the divided cores being made of a soft magnetic material; a core gap part disposed between the divided cores in the annular core formed by combining the plurality of divided cores, the core gap part being made of a non-magnetic material; annular heat-dissipating cases that house the divided cores and the core gap part; and a coil wound around the heat-dissipating cases, wherein the heat-dissipating cases are made of a material whose thermal conductivity is as high as 100 W/(m·K) or more.Type: GrantFiled: March 6, 2019Date of Patent: October 15, 2024Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Tomohito Fukuda, Takashi Kumagai, Hideo Noda, Kazuyuki Shibata, Masanori Kageyama
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Patent number: 12073983Abstract: In a coil device of a power conversion device, a laminated coil includes planar coils laminated on a surface of a support. A plurality of cores are spaced apart from each other and aligned in a longitudinal direction of the planar coils, and each core includes a portion around which the laminated coil is wound on the surface of the support. A first protruding member (is arranged between a pair of cores adjacent to each other with respect to a longitudinal direction and is fixed to the support. A first fixing member is arranged above the first protruding member. The laminated coil is sandwiched and fixed between the first fixing member and the first protruding member such that a first surface is in contact with the first protruding member and a second surface is in contact with the first fixing member.Type: GrantFiled: March 6, 2020Date of Patent: August 27, 2024Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Kenta Fujii, Takashi Kumagai, Tomohito Fukuda
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Publication number: 20240244796Abstract: A circuit device includes: a first heat sink having a first upper surface; a plurality of first partition plates and second partition plates attached to the first upper surface; a sealing material; a first circuit component; and a printed wiring board. A normal direction of the first upper surface is along a first direction. The first partition plates extend in a second direction orthogonal to the first direction. The second partition plates extend in a third direction orthogonal to the first direction and the second direction. The sealing material is made to fill a space defined by two adjacent first partition plates, two adjacent second partition plates, and the first upper surface. The first circuit component is disposed in the sealing material. The printed wiring board is disposed on the first partition plate and the second partition plate, and is electrically connected to the first circuit component.Type: ApplicationFiled: June 14, 2022Publication date: July 18, 2024Applicant: Mitsubishi Electric CorporationInventors: Yoshikazu TSUNODA, Takashi KUMAGAI, Tomohito FUKUDA, Yuji SHIRAKATA, Kenta FUJII
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Publication number: 20240244754Abstract: A circuit device includes: a heat sink having an upper surface orthogonal to a first direction; a plurality of first partition plates attached to the upper surface and extending in a second direction orthogonal to the first direction; a plurality of second partition plates attached to the upper surface and extending in a third direction orthogonal to the first direction and the second direction; a circuit component; a substrate electrically connected to the circuit component; and a first heat transfer member. The circuit component is housed in a space surrounded by two adjacent first partition plates, two adjacent second partition plates, and the upper surface. The first heat transfer member is disposed between the first partition plate and the circuit component.Type: ApplicationFiled: June 14, 2022Publication date: July 18, 2024Applicant: Mitsubishi Electric CorporationInventors: Yoshimichi SAITO, Yoshikazu TSUNODA, Kenta FUJII, Takashi KUMAGAI, Tomohito FUKUDA, Yuji SHIRAKATA
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Publication number: 20240177914Abstract: A coil device includes a core having a loop-shaped magnetic path and a first winding part. The first winding part is wound around the core so as to pass through an inner region of the core surrounded by the core. In the inner region of the core and an outer region of the core, a metal base substrate in which a coil pattern is formed with an insulating layer interposed on a metal base body is disposed. A cooling body is thermally bonded to a side of the metal base body opposite to a side where the insulating layer and the coil pattern are formed. The first winding part includes the coil pattern.Type: ApplicationFiled: May 19, 2022Publication date: May 30, 2024Applicant: Mitsubishi Electric CorporationInventors: Hiroyuki KIYONAGA, Kenta FUJII, Takashi KUMAGAI, Tomohito FUKUDA, Koji NAKAJIMA
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Publication number: 20240147884Abstract: A working machine may work by moving frontward on a ground. The working machine may include: a battery; an electric motor comprising a stator and a rotor and configured to be driven by electric power supplied from the battery; a working unit configured to work on the ground by being rotated about a rotary axis by the electric motor, the rotary axis being substantially parallel to a virtual ground perpendicular to an up-down direction; and a transmitting unit configured to transmit rotation of the electric motor to the working unit. When the working machine is viewed from a front side with the working machine being in a working posture, the battery, the electric motor, and the working unit may be separate from each other in the up-down direction and the working unit may be disposed below the battery and the electric motor.Type: ApplicationFiled: November 2, 2023Publication date: May 9, 2024Applicant: MAKITA CORPORATIONInventors: Kunito SHINDO, Takayoshi Iio, Yuuta Matsuura, Takashi Kumagai
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Patent number: 11948718Abstract: Inside a first case outer frame portion as an outer frame of the first case, a plurality of first core pieces and a partition to separate a pair of adjacent first core pieces among the plurality of first core pieces are disposed. The first case has a shape capable of accommodating at least a part of the second core piece. The first case outer frame portion includes a first case accommodating portion as a portion of the first case outer frame portion that is capable of accommodating the plurality of first core pieces, and a first case cover portion to cover a space inside the first case accommodating portion.Type: GrantFiled: September 11, 2019Date of Patent: April 2, 2024Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Atsushi Hosokawa, Takashi Kumagai, Tomohito Fukuda, Kenji Nishizaka, Shohei Higashitani
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Publication number: 20240062955Abstract: A laminate coil is formed by laminating a plurality of multilayer insulating members such that a first coil, a second coil, and a third coil each formed of a flat conductor are sandwiched between the plurality of multilayer insulating members. In the laminate coil, a through-hole is provided inside the coil in planar view. The plurality of multilayer insulating members adjacent to each other in a multilayer direction are bonded to each other at an inner end of the laminate coil positioned on the through-hole side, and an inside end of each of the first coil, the second coil, and the third coil is sealed by the multilayer insulating member.Type: ApplicationFiled: January 20, 2022Publication date: February 22, 2024Applicant: Mitsubishi Electric CorporationInventors: Kenta FUJII, Takashi KUMAGAI, Tomohito FUKUDA, Shoichiro NISHIZAWA
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Publication number: 20240055171Abstract: A transformer includes a core group and a winding group. Each of a plurality of winding layers penetrates through a plurality of closed magnetic circuits formed by a plurality of cores. When viewed from the top, the cores are disposed with spacing along conductor wires through which current of the winding layers flows, and the winding layers are disposed side by side from the inside to the outside with spacing along a direction intersecting the direction of current. With this configuration, a coil device with good heat dissipation performance, compact size, high efficiency, and low costs can be provided.Type: ApplicationFiled: February 2, 2022Publication date: February 15, 2024Applicants: Mitsubishi Electric Corporation, Nunome Electric Co., Ltd.Inventors: Takashi KUMAGAI, Kazuaki FUKUI, Yoshiaki YAMAMOTO, Kazufumi TANAKA, Kenji ASAI, Kazuya OHASHI, Koji ISHIHARA
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Publication number: 20240039419Abstract: A power source device includes a capacitive load; and an AC power source, as a voltage source, which applies AC voltage to the capacitive load. A series circuit composed of an inductor and a capacitor is connected to the AC power source. A series circuit composed of a load inductor and the capacitive load is connected in parallel to one of the inductor or the capacitor. If an inductance of the inductor is defined as Lp, a capacitance of the capacitor is defined as Cp, an inductance of the load inductor is defined as Ls, an equivalent capacitance of the capacitive load is defined as Cs, and a frequency of the AC power source is defined as fv, the following expressions are satisfied, 0.8/((2?·fv){circumflex over (?)}2)<Lp·Cp<1.2/((2?·fv){circumflex over (?)}2) 0.8/((2?·fv){circumflex over (?)}2)<Ls·Cs<1.2/((2?·fv){circumflex over (?)}2).Type: ApplicationFiled: January 27, 2021Publication date: February 1, 2024Applicant: Mitsubishi Electric CorporationInventors: Taichiro TAMIDA, Shingo TSUDA, Daisuke TAKAUCHI, Takashi KUMAGAI
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Publication number: 20230260691Abstract: A first leg portion is arranged between a second leg portion and a third leg portion. A first conductive member includes a first winding wound around the first leg portion and a second winding connected in series to the first winding and wound around the second leg portion. A second conductive member includes a third winding wound around the first leg portion and a fourth winding connected in series to the third winding and wound around the third leg portion. The first leg portion includes a first core member provided with a plurality of gaps and constituted of core pieces and a plurality of first gap members each made of a non-magnetic body and arranged in respective ones of the plurality of gaps in the first core member. Thus, influence by induction heating of the winding can be lessened and a coil can be reduced in size.Type: ApplicationFiled: August 11, 2021Publication date: August 17, 2023Applicant: Mitsubishi Electric CorporationInventors: Tomohito FUKUDA, Takashi KUMAGAI, Kazuaki FUKUI
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Publication number: 20230203305Abstract: The present invention relates to a polyamide resin composition that is excellent in mechanical characteristics, bonding properties and calcium chloride resistance and is suitably bonded to an acid-modified polyolefin, wherein the polyamide resin composition includes 70 to 99 mass % of an aliphatic polyamide resin (A) having an amino group concentration of 46 to 110 ?mol/g, 0 to 18 mass % of an aromatic polyamide resin (B), 0.01 to 0.50 mass % of a polyalkylene glycol alkyl ether (C), 0.01 to 0.50 mass % of a polyolefin wax (D) and 0 to 22.98 mass % of a component (E) other than (A) to (D), and the total of (A) to (E) is 100 mass %, and wherein the acid-modified polyolefin having an amount of acid modification of 8 to 100 ?mol/g.Type: ApplicationFiled: March 19, 2021Publication date: June 29, 2023Applicant: UBE CorporationInventors: Tetsuya YASUI, Akane SAKAMOTO, Yuki SUEDOMI, Hitoshi KODAMA, Kosuke OISHI, Takashi KUMAGAI, Mikako FUJITA
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Patent number: 11658089Abstract: The present invention relates to a semiconductor device including a printed circuit board, an electronic component, and a heat diffusion part. The printed circuit board includes an insulation layer, first and second conductor layers disposed respectively on first and second main faces of the insulation layer, a plurality of heat radiation vias penetrating from the first conductor layer to the second conductor layer on the insulation layer, and a conductor film covering inner side walls of the heat radiation vias. The heat radiation vias are provided at positions overlapping the electronic component and the heat radiation part in plan view viewed from the first main face of the printed circuit board. The heat diffusion part is disposed overlapping at least some of the heat radiation vias in plan view viewed from the second main face of the printed circuit board.Type: GrantFiled: December 11, 2018Date of Patent: May 23, 2023Assignee: MITSUBISHI ELECTRIC CORPORATIONInventors: Shuji Wakaiki, Shota Sato, Kenta Fujii, Takashi Kumagai
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Publication number: 20230143084Abstract: The present invention relates to a polyamide resin composition that is excellent in mechanical characteristics, bonding properties, calcium chloride resistance and fuel resistance and is suitably bonded to an acid-modified polyolefin, wherein the polyamide resin composition includes 40 to 93 mass % of an aliphatic polyamide resin (A) having an amino group concentration of 46 to 110 ?mol/g, 2 to 10 mass % of an aromatic polyamide resin (B), 5 to 50 mass % of reinforcing fibers (C), and 0 to 53 mass % of a component (D) other than (A) to (C), and the total amount of (A) to (D) is 100 mass %, and wherein the amount of acid modification of the acid-modified polyolefin is 5 to 100 ?mol/g.Type: ApplicationFiled: March 19, 2021Publication date: May 11, 2023Applicant: UBE CorporationInventors: Tetsuya YASUI, Akane SAKAMOTO, Yuki SUEDOMI, Hitoshi KODAMA, Kosuke OISHI, Takashi KUMAGAI, Mikako FUJITA
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Publication number: 20230015560Abstract: A substrate processing system installed on a floor face is provided. The substrate processing system includes a substrate transfer module, a supporting table including a top plate disposed separately from the floor face, a plurality of substrate processing modules disposed on the top plate and coupled to the substrate transfer module along a lateral side of the substrate transfer module, and a plurality of power units disposed below the top plate. Further, the plurality of power units correspond to the plurality of substrate processing modules, respectively, and each of the power units is configured to supply electric power to the corresponding processing module.Type: ApplicationFiled: September 29, 2022Publication date: January 19, 2023Applicant: TOKYO ELECTRON LIMITEDInventors: Suguru MOTEGI, Takashi KUMAGAI, Akira KODASHIMA, Keisuke YOSHIMURA
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Patent number: 11515183Abstract: A substrate processing system includes a first chamber, a second chamber, and a cooling passage. The first chamber has therein a space for processing a substrate transferred from a first transfer chamber maintained in a vacuum atmosphere. The second chamber is disposed below the first chamber to be vertically aligned with the first chamber and configured to communicate with the first transfer chamber and a second transfer chamber maintained in an atmospheric atmosphere. The second chamber has substantially the same footprint as a footprint of the first chamber. Further, a cooling passage is disposed between the first chamber and the second chamber and configured to allow a coolant to flow therethrough.Type: GrantFiled: August 4, 2020Date of Patent: November 29, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Suguru Motegi, Takashi Kumagai, Akira Kodashima