Patents by Inventor Takashi Kumagai

Takashi Kumagai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220019293
    Abstract: An eyeglasses-type wearable device of an embodiment can handle various data inputs. The device includes right and left eye frames corresponding to positions of right and left eyes and nose pads corresponding to a position of a nose. Eye motion detection electrodes (sightline detection sensor electrodes) are provided with the nose pads to detect the eye motion of a user. Transmitter/receiver electrodes (capacitance sensor electrodes) of a gesture detector are provided with a part of the right and left eye frames to detect a gesture of the user. Various data inputs are achieved by a combination of input A corresponding to a gesture of the user detected by the gesture detector and input B corresponding to the eye motion of the user detected by the eye motion detector.
    Type: Application
    Filed: September 29, 2021
    Publication date: January 20, 2022
    Inventors: Hiroaki Komaki, Akira Tanaka, Kenichi Doniwa, Hiroki Kumagai, Takashi Sudo, Yasuhiro Kanishima, Nobuhide Okabayashi
  • Patent number: 11215592
    Abstract: There is provided a separation method in which a target component in a solution can be separated simply but safely and efficiently without contamination from the environment. This method includes: providing a solution containing a target component, and a reaction reagent; while continuously feeding the solution and the reaction reagent to a flow path, intermittently injecting bubbles into the flow path to produce a gas-liquid slug flow in which a mixed liquid containing the solution and the reaction reagent is segmented into a plurality of droplets by the bubbles; continuing the feed of the gas-liquid slug flow in the flow path, thereby facilitating the mixing of the solution and the reaction reagent, and the gasification of the target component by the mixing, in each droplet, and the movement of a target component-derived gas produced by the gasification to the bubbles; and recovering the target component-derived gas with an absorbing liquid.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: January 4, 2022
    Assignees: MITSUI MINING & SMELTING CO., LTD., BL TEC K.K.
    Inventors: Makoto Nagaoka, Fumihiro Yoshinaga, Atsumi Koyanagi, Shunichi Hatamoto, Yozo Ishihara, Makiko Kumagai, Takashi Nishimura
  • Patent number: 11206729
    Abstract: Provided is a highly reliable power circuit device. The power circuit device includes a printed substrate, a power circuit, and a housing. The power circuit is formed on the printed substrate. The housing is connected with the printed substrate. The power circuit includes secondary-side switching elements, at least one smoothing choke coil, and smoothing capacitors. Portions of a smoothing choke coil core serving as a core of the smoothing choke coil are inserted in opening portions formed in the printed substrate. A winding of the smoothing choke coil is formed on the printed substrate. The smoothing choke coil is located between a region C in which the smoothing capacitors are arranged and regions A and B serving as a second region in which primary-side switching elements and the secondary-side switching elements serving as electric elements are arranged.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: December 21, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shota Sato, Koji Nakajima, Takashi Kumagai, Yuji Shirakata
  • Publication number: 20210327630
    Abstract: Inside a first case outer frame portion as an outer frame of the first case, a plurality of first core pieces and a partition to separate a pair of adjacent first core pieces among the plurality of first core pieces are disposed. The first case has a shape capable of accommodating at least a part of the second core piece. The first case outer frame portion includes a first case accommodating portion as a portion of the first case outer frame portion that is capable of accommodating the plurality of first core pieces, and a first case cover portion to cover a space inside the first case accommodating portion.
    Type: Application
    Filed: September 11, 2019
    Publication date: October 21, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Atsushi HOSOKAWA, Takashi KUMAGAI, Tomohito FUKUDA, Kenji NISHIZAKA, Shohei HIGASHITANI
  • Patent number: 11094452
    Abstract: A power converter includes a magnetic core, a plurality of windings, a plurality of metal sidewalls, a first insulating member, and a second insulating member. The plurality of windings are each wound around the magnetic core and bent to have a portion extending in a direction in which the magnetic core extends. The plurality of metal sidewalls are disposed outside the plurality of windings and extend in the direction in which the magnetic core extends. The first insulating member is disposed between the plurality of windings and between the windings and the magnetic core. The second insulating member is disposed on an outside of the plurality of windings and in contact with each of the plurality of sidewalls and each of the plurality of windings. The second insulating member has a thermal conductivity higher than a thermal conductivity of the first insulating member.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: August 17, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Koji Nakajima, Takashi Kumagai, Jun Tahara
  • Patent number: 11049640
    Abstract: A circuit device and a power converter include a core, a coil surrounding at least a part of the core, and a first heat transfer member being in surface contact with the core. A temperature rise of the core can thus be prevented or reduced.
    Type: Grant
    Filed: January 4, 2017
    Date of Patent: June 29, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kenta Fujii, Koji Nakajima, Yuji Shirakata, Jun Tahara, Takashi Kumagai
  • Publication number: 20210185817
    Abstract: A circuit device includes a core, a first circuit board, a second circuit board, a heat dissipation member, a first heat transfer member, and a second heat transfer member. The first circuit board includes a first coil pattern surrounding at least a part of the core. The second circuit board includes a second coil pattern surrounding at least a part of the core. The first heat transfer member is in surface contact with the first circuit board and the heat dissipation member. The second heat transfer member is in surface contact with the first circuit board and the second circuit board.
    Type: Application
    Filed: July 11, 2019
    Publication date: June 17, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kenta FUJII, Takashi KUMAGAI, Tomohito FUKUDA, Takashi HIRATSUKA, Koichi AOKI
  • Patent number: 11031177
    Abstract: A power converter includes a magnetic core and a plurality of windings. The plurality of windings are each wound around the magnetic core and bent to have a portion extending in the direction in which the magnetic core extends. Each of the plurality of windings is bent to include a region located farthest out from the magnetic core among all of the plurality of windings.
    Type: Grant
    Filed: August 24, 2016
    Date of Patent: June 8, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Koji Nakajima, Takashi Kumagai, Jun Tahara
  • Publication number: 20210090255
    Abstract: A recording medium stores therein a program for causing a computer to execute processing includes: acquiring images of N or less each including teeth adjacent to each other; arranging and displaying, in N image display areas capable of displaying the images in association with an arrangement of teeth, each of the images, in association with each of the N image display areas, a selection area for selecting presence or absence of an image and input areas for inputting information indicating a condition of each tooth included in an image displayed in each of the N image display areas; receiving a selection content in the selection area or input contents in the input areas or combination of the selection content and the input contents; and generating learning information in which a condition of each of the teeth and an image of each of the teeth are associated with each other.
    Type: Application
    Filed: December 8, 2020
    Publication date: March 25, 2021
    Applicant: FUJITSU LIMITED
    Inventors: Takashi Kumagai, Tadashi Fujioka, Chikashi Kigure, Kazuhiko Katayama, Yuji Deki, Shirin Aoki, Fumiyuki Takehisa, Tsugumasa Yamamoto, Wataru Oura
  • Publication number: 20210065957
    Abstract: The present invention has an object of providing a reactor including cores with higher heat dissipation and a coil with less eddy-current loss. A reactor according to the present invention includes: a plurality of divided cores having a shape obtained by dividing an annular core in a circumferential direction, the divided cores being made of a soft magnetic material; a core gap part disposed between the divided cores in the annular core formed by combining the plurality of divided cores, the core gap part being made of a non-magnetic material; annular heat-dissipating cases that house the divided cores and the core gap part; and a coil wound around the heat-dissipating cases, wherein the heat-dissipating cases are made of a material whose thermal conductivity is as high as 100 W/(m·K) or more.
    Type: Application
    Filed: March 6, 2019
    Publication date: March 4, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Tomohito FUKUDA, Takashi KUMAGAI, Hideo NODA, Kazuyuki SHIBATA, Masanori KAGEYAMA
  • Publication number: 20210057243
    Abstract: A substrate processing system installed on a floor face is provided. The substrate processing system includes a substrate transfer module, a supporting table including a top plate disposed separately from the floor face, a plurality of substrate processing modules disposed on the top plate and coupled to the substrate transfer module along a lateral side of the substrate transfer module, and a plurality of power units disposed below the top plate. Further, the plurality of power units correspond to the plurality of substrate processing modules, respectively, and each of the power units is configured to supply electric power to the corresponding processing module.
    Type: Application
    Filed: August 20, 2020
    Publication date: February 25, 2021
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Suguru MOTEGI, Takashi KUMAGAI, Akira KODASHIMA, Keisuke YOSHIMURA
  • Publication number: 20210043480
    Abstract: A substrate processing system includes a first chamber, a second chamber, and a cooling passage. The first chamber has therein a space for processing a substrate transferred from a first transfer chamber maintained in a vacuum atmosphere. The second chamber is disposed below the first chamber to be vertically aligned with the first chamber and configured to communicate with the first transfer chamber and a second transfer chamber maintained in an atmospheric atmosphere. The second chamber has substantially the same footprint as a footprint of the first chamber. Further, a cooling passage is disposed between the first chamber and the second chamber and configured to allow a coolant to flow therethrough.
    Type: Application
    Filed: August 4, 2020
    Publication date: February 11, 2021
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Suguru MOTEGI, Takashi KUMAGAI, Akira KODASHIMA
  • Publication number: 20200388550
    Abstract: The present invention relates to a semiconductor device including a printed circuit board, an electronic component, and a heat diffusion part. The printed circuit board includes an insulation layer, first and second conductor layers disposed respectively on first and second main faces of the insulation layer, a plurality of heat radiation vias penetrating from the first conductor layer to the second conductor layer on the insulation layer, and a conductor film covering inner side walls of the heat radiation vias. The heat radiation vias are provided at positions overlapping the electronic component and the heat radiation part in plan view viewed from the first main face of the printed circuit board. The heat diffusion part is disposed overlapping at least some of the heat radiation vias in plan view viewed from the second main face of the printed circuit board.
    Type: Application
    Filed: December 11, 2018
    Publication date: December 10, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Shuji WAKAIKI, Shota SATO, Kenta FUJII, Takashi KUMAGAI
  • Publication number: 20200367353
    Abstract: A circuit device capable of significantly improving heat dissipation performance of a printed circuit board without increasing the size includes a printed circuit board, a mounted component, a non-solid metal spacer, a cooler, and a resin layer. The mounted component is at least partially disposed on at least one main surface of printed circuit board. The non-solid metal spacer is disposed at least on one main surface of the printed circuit board. The cooler is disposed at the non-solid metal spacer on the opposite side to the printed circuit board. The resin layer is disposed between the non-solid metal spacer and the cooler. The non-solid metal spacer has a shape that allows at least one hollow portion to be formed between the printed circuit board and the cooler.
    Type: Application
    Filed: January 18, 2019
    Publication date: November 19, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hiroyuki YAHARA, Kenta FUJII, Yuji SHIRAKATA, Tomohito FUKUDA, Takashi KUMAGAI, Koji NAKAJIMA
  • Publication number: 20200343155
    Abstract: A power conversion device that provides high heat dissipation and is easy to assemble. A power conversion device includes: a first heat dissipator; a second heat dissipator; a printed board having a first circuit pattern formed thereon; a first insulating member provided between first heat dissipator and printed board; a switching element including an electrode portion electrically bonded to first circuit pattern with a first bonding member interposed therebetween; a first fixing member bonded to an exposed surface of electrode portion; a heat dissipating member having one end bonded to first fixing member, and the other end provided between the switching element and second heat dissipator; a second insulating member sandwiched between second heat dissipator and switching element; and an installation portion.
    Type: Application
    Filed: January 9, 2019
    Publication date: October 29, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hiroyuki KIYONAGA, Kenta FUJII, Tomohito FUKUDA, Shuji WAKAIKI, Takashi KUMAGAI, Hiroshi IKARASHI
  • Publication number: 20200098660
    Abstract: A semiconductor device includes a printed board, an electronic component, and a thermal diffuser. The electronic component and the thermal diffuser are bonded onto one main surface of the printed board. The electronic component and the thermal diffuser are electrically and thermally bonded to each other by a bonding material. The printed board includes an insulating layer and a plurality of radiation vias penetrating from the main surface to the other main surface of the printed board. At least a part of the plurality of radiation vias overlaps the electronic component, and at least another part of the plurality of radiation vias overlaps the thermal diffuser. At least a part of the plurality of radiation vias is disposed so as to overlap a heat radiator at a transmission viewpoint from the main surface of the printed board.
    Type: Application
    Filed: May 21, 2018
    Publication date: March 26, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Shuji WAKAIKI, Shota SATO, Kenta FUJII, Takashi KUMAGAI
  • Patent number: 10529478
    Abstract: An air core type reactor unit, includes a first insulating plate which is provided with a first insulating spacer on one side, a first ferromagnetic member metal plate fixed to an insulating plate, two or more air core coils each having an air core part and formed of coil layers with the separation of an air gap, a second insulating plate, which is provided with a second insulating spacer on another side thereof and has a width smaller than an inside diameter of the coil, to incorporate more air into, a second ferromagnetic member metal plate fixed to an insulating plate, and an insulating stick passing through the air core part of the air core coils, wherein the air core coils are arranged in parallel, and held and fixed between the first insulating plate and the second insulating plate through the first insulating spacer and the second insulating spacer.
    Type: Grant
    Filed: August 9, 2016
    Date of Patent: January 7, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Toshihiro Yoshida, Hajime Nakatani, Daisuke Takauchi, Takashi Kumagai, Kenji Shimohata, Taichiro Tamida
  • Patent number: 10491180
    Abstract: A board-type noise filter having higher noise removal performance than that of a conventional noise filter, and an electronic device including the board-type noise filter are provided. The board-type noise filter includes: a printed wiring board having a wiring pattern formed thereon; a choke coil including a core having a toroidal shape; a frame ground portion fixed to the printed wiring board at a position overlapping with a hollow portion of the choke coil when the toroidal shape of the choke coil is seen in plan view, the frame ground portion being capable of being grounded to a frame ground; and a capacitor having a first terminal connected to the frame ground portion through the wiring pattern.
    Type: Grant
    Filed: April 27, 2016
    Date of Patent: November 26, 2019
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kazuya Yamamoto, Takashi Kumagai
  • Patent number: 10404178
    Abstract: An insulation type step-up converter includes a core, first and second primary-side coils, a secondary-side coil, and a switching element. The core includes a middle leg, and first and second outer legs. The switching element is configured such that it can be controlled to be on/off so that electric currents flowing simultaneously in the first and second primary-side coils are opposite in direction to each other.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: September 3, 2019
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Koji Nakajima, Takashi Kumagai, Yuji Shirakata, Yujiro Kido
  • Publication number: 20190221354
    Abstract: An air core type reactor unit, includes a first insulating plate which is provided with a first insulating spacer on one side, a first ferromagnetic member metal plate fixed to an insulating plate, two or more air core coils each having an air core part and formed of coil layers with the separation of an air gap, a second insulating plate, which is provided with a second insulating spacer on another side thereof and has a width smaller than an inside diameter of the coil, to incorporate more air into, a second ferromagnetic member metal plate fixed to an insulating plate, and an insulating stick passing through the air core part of the air core coils, wherein the air core coils are arranged in parallel, and held and fixed between the first insulating plate and the second insulating plate through the first insulating spacer and the second insulating spacer.
    Type: Application
    Filed: August 9, 2016
    Publication date: July 18, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Toshihiro YOSHIDA, Hajime Nakatani, Daisuke Takauchi, Takashi Kumagai, Kenji Shimohata, Taichiro Tamida