Abstract: A substrate processing system installed on a floor face is provided. The substrate processing system includes a substrate transfer module, a supporting table including a top plate disposed separately from the floor face, a plurality of substrate processing modules disposed on the top plate and coupled to the substrate transfer module along a lateral side of the substrate transfer module, and a plurality of power units disposed below the top plate. Further, the plurality of power units correspond to the plurality of substrate processing modules, respectively, and each of the power units is configured to supply electric power to the corresponding processing module.

Abstract: A core cooling structure includes a core and a housing. The core includes an upper core and a lower core. The core is attached to the housing. The upper core includes a heat dissipation fin that extends along a magnetic path and is disposed at an interval in a direction intersecting the magnetic path. The lower core is attached so as to be fitted into the housing.

Abstract: A laminated coil includes planar coils and a first insulating member. The planar coils are arranged in a first direction intersecting a first surface. The first insulating member is in a film form and arranged between a pair of planar coils adjacent to each other in the first direction. At least one of the planar coils is wound to have a plurality of turns spaced apart from each other in a second direction along the first surface. A second insulating member is arranged between the turns adjacent to each other in the second direction of at least one of the planar coils.

Abstract: A circuit device capable of significantly improving heat dissipation performance of a printed circuit board without increasing the size includes a printed circuit board, a mounted component, a non-solid metal spacer, a cooler, and a resin layer. The mounted component is at least partially disposed on at least one main surface of printed circuit board. The non-solid metal spacer is disposed at least on one main surface of the printed circuit board. The cooler is disposed at the non-solid metal spacer on the opposite side to the printed circuit board. The resin layer is disposed between the non-solid metal spacer and the cooler. The non-solid metal spacer has a shape that allows at least one hollow portion to be formed between the printed circuit board and the cooler.

Abstract: A coil device includes: a core having a first surface and a second surface located opposite to the first surface; a coil member including a first portion and a second portion that are spaced apart from each other in a first direction along the first surface; and a support portion in contact with the first surface and the second surface to support the core. The core includes a middle leg sandwiched between the first portion and the second portion in the first direction. The core is provided with a first slit as a first recessed portion recessed relative to the first surface and reaching the middle leg. The support portion includes a first protruding portion disposed inside the first slit and in contact with the middle leg.

Abstract: In a coil device of a power conversion device, a laminated coil includes planar coils laminated on a surface of a support. A plurality of cores are spaced apart from each other and aligned in a longitudinal direction of the planar coils, and each core includes a portion around which the laminated coil is wound on the surface of the support. A first protruding member (is arranged between a pair of cores adjacent to each other with respect to a longitudinal direction and is fixed to the support. A first fixing member is arranged above the first protruding member. The laminated coil is sandwiched and fixed between the first fixing member and the first protruding member such that a first surface is in contact with the first protruding member and a second surface is in contact with the first fixing member.

Abstract: A coil apparatus includes a coil unit including a coil, a base core that is a first core component, and a core module that is a second core component. The first core component includes a center leg that is a leg around which the coil is wound. The second core component includes a plurality of core segments arranged in a row with gaps between them. The second core component is connected to the leg to form a magnetic path together with the first core component.

Abstract: Provided is a highly reliable power circuit device. The power circuit device includes a printed substrate, a power circuit, and a housing. The power circuit is formed on the printed substrate. The housing is connected with the printed substrate. The power circuit includes secondary-side switching elements, at least one smoothing choke coil, and smoothing capacitors. Portions of a smoothing choke coil core serving as a core of the smoothing choke coil are inserted in opening portions formed in the printed substrate. A winding of the smoothing choke coil is formed on the printed substrate. The smoothing choke coil is located between a region C in which the smoothing capacitors are arranged and regions A and B serving as a second region in which primary-side switching elements and the secondary-side switching elements serving as electric elements are arranged.

Abstract: Inside a first case outer frame portion as an outer frame of the first case, a plurality of first core pieces and a partition to separate a pair of adjacent first core pieces among the plurality of first core pieces are disposed. The first case has a shape capable of accommodating at least a part of the second core piece. The first case outer frame portion includes a first case accommodating portion as a portion of the first case outer frame portion that is capable of accommodating the plurality of first core pieces, and a first case cover portion to cover a space inside the first case accommodating portion.

Abstract: A power converter includes a magnetic core, a plurality of windings, a plurality of metal sidewalls, a first insulating member, and a second insulating member. The plurality of windings are each wound around the magnetic core and bent to have a portion extending in a direction in which the magnetic core extends. The plurality of metal sidewalls are disposed outside the plurality of windings and extend in the direction in which the magnetic core extends. The first insulating member is disposed between the plurality of windings and between the windings and the magnetic core. The second insulating member is disposed on an outside of the plurality of windings and in contact with each of the plurality of sidewalls and each of the plurality of windings. The second insulating member has a thermal conductivity higher than a thermal conductivity of the first insulating member.

Abstract: A circuit device and a power converter include a core, a coil surrounding at least a part of the core, and a first heat transfer member being in surface contact with the core. A temperature rise of the core can thus be prevented or reduced.

Abstract: A circuit device includes a core, a first circuit board, a second circuit board, a heat dissipation member, a first heat transfer member, and a second heat transfer member. The first circuit board includes a first coil pattern surrounding at least a part of the core. The second circuit board includes a second coil pattern surrounding at least a part of the core. The first heat transfer member is in surface contact with the first circuit board and the heat dissipation member. The second heat transfer member is in surface contact with the first circuit board and the second circuit board.

Abstract: A power converter includes a magnetic core and a plurality of windings. The plurality of windings are each wound around the magnetic core and bent to have a portion extending in the direction in which the magnetic core extends. Each of the plurality of windings is bent to include a region located farthest out from the magnetic core among all of the plurality of windings.

Abstract: A recording medium stores therein a program for causing a computer to execute processing includes: acquiring images of N or less each including teeth adjacent to each other; arranging and displaying, in N image display areas capable of displaying the images in association with an arrangement of teeth, each of the images, in association with each of the N image display areas, a selection area for selecting presence or absence of an image and input areas for inputting information indicating a condition of each tooth included in an image displayed in each of the N image display areas; receiving a selection content in the selection area or input contents in the input areas or combination of the selection content and the input contents; and generating learning information in which a condition of each of the teeth and an image of each of the teeth are associated with each other.

Abstract: The present invention has an object of providing a reactor including cores with higher heat dissipation and a coil with less eddy-current loss. A reactor according to the present invention includes: a plurality of divided cores having a shape obtained by dividing an annular core in a circumferential direction, the divided cores being made of a soft magnetic material; a core gap part disposed between the divided cores in the annular core formed by combining the plurality of divided cores, the core gap part being made of a non-magnetic material; annular heat-dissipating cases that house the divided cores and the core gap part; and a coil wound around the heat-dissipating cases, wherein the heat-dissipating cases are made of a material whose thermal conductivity is as high as 100 W/(m·K) or more.

Abstract: A substrate processing system installed on a floor face is provided. The substrate processing system includes a substrate transfer module, a supporting table including a top plate disposed separately from the floor face, a plurality of substrate processing modules disposed on the top plate and coupled to the substrate transfer module along a lateral side of the substrate transfer module, and a plurality of power units disposed below the top plate. Further, the plurality of power units correspond to the plurality of substrate processing modules, respectively, and each of the power units is configured to supply electric power to the corresponding processing module.

Abstract: A substrate processing system includes a first chamber, a second chamber, and a cooling passage. The first chamber has therein a space for processing a substrate transferred from a first transfer chamber maintained in a vacuum atmosphere. The second chamber is disposed below the first chamber to be vertically aligned with the first chamber and configured to communicate with the first transfer chamber and a second transfer chamber maintained in an atmospheric atmosphere. The second chamber has substantially the same footprint as a footprint of the first chamber. Further, a cooling passage is disposed between the first chamber and the second chamber and configured to allow a coolant to flow therethrough.

Abstract: The present invention relates to a semiconductor device including a printed circuit board, an electronic component, and a heat diffusion part. The printed circuit board includes an insulation layer, first and second conductor layers disposed respectively on first and second main faces of the insulation layer, a plurality of heat radiation vias penetrating from the first conductor layer to the second conductor layer on the insulation layer, and a conductor film covering inner side walls of the heat radiation vias. The heat radiation vias are provided at positions overlapping the electronic component and the heat radiation part in plan view viewed from the first main face of the printed circuit board. The heat diffusion part is disposed overlapping at least some of the heat radiation vias in plan view viewed from the second main face of the printed circuit board.

Abstract: A circuit device capable of significantly improving heat dissipation performance of a printed circuit board without increasing the size includes a printed circuit board, a mounted component, a non-solid metal spacer, a cooler, and a resin layer. The mounted component is at least partially disposed on at least one main surface of printed circuit board. The non-solid metal spacer is disposed at least on one main surface of the printed circuit board. The cooler is disposed at the non-solid metal spacer on the opposite side to the printed circuit board. The resin layer is disposed between the non-solid metal spacer and the cooler. The non-solid metal spacer has a shape that allows at least one hollow portion to be formed between the printed circuit board and the cooler.

Abstract: A power conversion device that provides high heat dissipation and is easy to assemble. A power conversion device includes: a first heat dissipator; a second heat dissipator; a printed board having a first circuit pattern formed thereon; a first insulating member provided between first heat dissipator and printed board; a switching element including an electrode portion electrically bonded to first circuit pattern with a first bonding member interposed therebetween; a first fixing member bonded to an exposed surface of electrode portion; a heat dissipating member having one end bonded to first fixing member, and the other end provided between the switching element and second heat dissipator; a second insulating member sandwiched between second heat dissipator and switching element; and an installation portion.