Abstract: A power converter includes a magnetic core, a plurality of windings, a plurality of metal sidewalls, a first insulating member, and a second insulating member. The plurality of windings are each wound around the magnetic core and bent to have a portion extending in a direction in which the magnetic core extends. The plurality of metal sidewalls are disposed outside the plurality of windings and extend in the direction in which the magnetic core extends. The first insulating member is disposed between the plurality of windings and between the windings and the magnetic core. The second insulating member is disposed on an outside of the plurality of windings and in contact with each of the plurality of sidewalls and each of the plurality of windings. The second insulating member has a thermal conductivity higher than a thermal conductivity of the first insulating member.

Abstract: A circuit device and a power converter include a core, a coil surrounding at least a part of the core, and a first heat transfer member being in surface contact with the core. A temperature rise of the core can thus be prevented or reduced.

Abstract: A circuit device includes a core, a first circuit board, a second circuit board, a heat dissipation member, a first heat transfer member, and a second heat transfer member. The first circuit board includes a first coil pattern surrounding at least a part of the core. The second circuit board includes a second coil pattern surrounding at least a part of the core. The first heat transfer member is in surface contact with the first circuit board and the heat dissipation member. The second heat transfer member is in surface contact with the first circuit board and the second circuit board.

Abstract: A power converter includes a magnetic core and a plurality of windings. The plurality of windings are each wound around the magnetic core and bent to have a portion extending in the direction in which the magnetic core extends. Each of the plurality of windings is bent to include a region located farthest out from the magnetic core among all of the plurality of windings.

Abstract: A recording medium stores therein a program for causing a computer to execute processing includes: acquiring images of N or less each including teeth adjacent to each other; arranging and displaying, in N image display areas capable of displaying the images in association with an arrangement of teeth, each of the images, in association with each of the N image display areas, a selection area for selecting presence or absence of an image and input areas for inputting information indicating a condition of each tooth included in an image displayed in each of the N image display areas; receiving a selection content in the selection area or input contents in the input areas or combination of the selection content and the input contents; and generating learning information in which a condition of each of the teeth and an image of each of the teeth are associated with each other.

Abstract: The present invention has an object of providing a reactor including cores with higher heat dissipation and a coil with less eddy-current loss. A reactor according to the present invention includes: a plurality of divided cores having a shape obtained by dividing an annular core in a circumferential direction, the divided cores being made of a soft magnetic material; a core gap part disposed between the divided cores in the annular core formed by combining the plurality of divided cores, the core gap part being made of a non-magnetic material; annular heat-dissipating cases that house the divided cores and the core gap part; and a coil wound around the heat-dissipating cases, wherein the heat-dissipating cases are made of a material whose thermal conductivity is as high as 100 W/(m·K) or more.

Abstract: A substrate processing system installed on a floor face is provided. The substrate processing system includes a substrate transfer module, a supporting table including a top plate disposed separately from the floor face, a plurality of substrate processing modules disposed on the top plate and coupled to the substrate transfer module along a lateral side of the substrate transfer module, and a plurality of power units disposed below the top plate. Further, the plurality of power units correspond to the plurality of substrate processing modules, respectively, and each of the power units is configured to supply electric power to the corresponding processing module.

Abstract: A substrate processing system includes a first chamber, a second chamber, and a cooling passage. The first chamber has therein a space for processing a substrate transferred from a first transfer chamber maintained in a vacuum atmosphere. The second chamber is disposed below the first chamber to be vertically aligned with the first chamber and configured to communicate with the first transfer chamber and a second transfer chamber maintained in an atmospheric atmosphere. The second chamber has substantially the same footprint as a footprint of the first chamber. Further, a cooling passage is disposed between the first chamber and the second chamber and configured to allow a coolant to flow therethrough.

Abstract: The present invention relates to a semiconductor device including a printed circuit board, an electronic component, and a heat diffusion part. The printed circuit board includes an insulation layer, first and second conductor layers disposed respectively on first and second main faces of the insulation layer, a plurality of heat radiation vias penetrating from the first conductor layer to the second conductor layer on the insulation layer, and a conductor film covering inner side walls of the heat radiation vias. The heat radiation vias are provided at positions overlapping the electronic component and the heat radiation part in plan view viewed from the first main face of the printed circuit board. The heat diffusion part is disposed overlapping at least some of the heat radiation vias in plan view viewed from the second main face of the printed circuit board.

Abstract: A circuit device capable of significantly improving heat dissipation performance of a printed circuit board without increasing the size includes a printed circuit board, a mounted component, a non-solid metal spacer, a cooler, and a resin layer. The mounted component is at least partially disposed on at least one main surface of printed circuit board. The non-solid metal spacer is disposed at least on one main surface of the printed circuit board. The cooler is disposed at the non-solid metal spacer on the opposite side to the printed circuit board. The resin layer is disposed between the non-solid metal spacer and the cooler. The non-solid metal spacer has a shape that allows at least one hollow portion to be formed between the printed circuit board and the cooler.

Abstract: A power conversion device that provides high heat dissipation and is easy to assemble. A power conversion device includes: a first heat dissipator; a second heat dissipator; a printed board having a first circuit pattern formed thereon; a first insulating member provided between first heat dissipator and printed board; a switching element including an electrode portion electrically bonded to first circuit pattern with a first bonding member interposed therebetween; a first fixing member bonded to an exposed surface of electrode portion; a heat dissipating member having one end bonded to first fixing member, and the other end provided between the switching element and second heat dissipator; a second insulating member sandwiched between second heat dissipator and switching element; and an installation portion.

Abstract: A semiconductor device includes a printed board, an electronic component, and a thermal diffuser. The electronic component and the thermal diffuser are bonded onto one main surface of the printed board. The electronic component and the thermal diffuser are electrically and thermally bonded to each other by a bonding material. The printed board includes an insulating layer and a plurality of radiation vias penetrating from the main surface to the other main surface of the printed board. At least a part of the plurality of radiation vias overlaps the electronic component, and at least another part of the plurality of radiation vias overlaps the thermal diffuser. At least a part of the plurality of radiation vias is disposed so as to overlap a heat radiator at a transmission viewpoint from the main surface of the printed board.

Abstract: An air core type reactor unit, includes a first insulating plate which is provided with a first insulating spacer on one side, a first ferromagnetic member metal plate fixed to an insulating plate, two or more air core coils each having an air core part and formed of coil layers with the separation of an air gap, a second insulating plate, which is provided with a second insulating spacer on another side thereof and has a width smaller than an inside diameter of the coil, to incorporate more air into, a second ferromagnetic member metal plate fixed to an insulating plate, and an insulating stick passing through the air core part of the air core coils, wherein the air core coils are arranged in parallel, and held and fixed between the first insulating plate and the second insulating plate through the first insulating spacer and the second insulating spacer.

Abstract: A board-type noise filter having higher noise removal performance than that of a conventional noise filter, and an electronic device including the board-type noise filter are provided. The board-type noise filter includes: a printed wiring board having a wiring pattern formed thereon; a choke coil including a core having a toroidal shape; a frame ground portion fixed to the printed wiring board at a position overlapping with a hollow portion of the choke coil when the toroidal shape of the choke coil is seen in plan view, the frame ground portion being capable of being grounded to a frame ground; and a capacitor having a first terminal connected to the frame ground portion through the wiring pattern.

Abstract: An insulation type step-up converter includes a core, first and second primary-side coils, a secondary-side coil, and a switching element. The core includes a middle leg, and first and second outer legs. The switching element is configured such that it can be controlled to be on/off so that electric currents flowing simultaneously in the first and second primary-side coils are opposite in direction to each other.

Abstract: An air core type reactor unit, includes a first insulating plate which is provided with a first insulating spacer on one side, a first ferromagnetic member metal plate fixed to an insulating plate, two or more air core coils each having an air core part and formed of coil layers with the separation of an air gap, a second insulating plate, which is provided with a second insulating spacer on another side thereof and has a width smaller than an inside diameter of the coil, to incorporate more air into, a second ferromagnetic member metal plate fixed to an insulating plate, and an insulating stick passing through the air core part of the air core coils, wherein the air core coils are arranged in parallel, and held and fixed between the first insulating plate and the second insulating plate through the first insulating spacer and the second insulating spacer.

Abstract: A power supply device for an ozone generator, which supplies electric power to the ozone generator, is configured such that: a transformer, an inverter, and a reactor are disposed inside of one housing; a flat heat exchanger which cools passing air with cooling water is disposed at a lower part inside of the housing; the transformer and the inverter are disposed above the heat exchanger; the reactor is disposed above the transformer and the inverter; a protection panel is disposed further toward the front side of the housing than the transformer and the inverter by being separated from a front door of the housing; and cooling air is circulated in the housing by means of a fan that disposed at a position inside of the front door.

Abstract: Provided is a highly reliable power circuit device. The power circuit device includes a printed substrate, a power circuit, and a housing. The power circuit is formed on the printed substrate. The housing is connected with the printed substrate. The power circuit includes secondary-side switching elements, at least one smoothing choke coil, and smoothing capacitors. Portions of a smoothing choke coil core serving as a core of the smoothing choke coil are inserted in opening portions formed in the printed substrate. A winding of the smoothing choke coil is formed on the printed substrate. The smoothing choke coil is located between a region C in which the smoothing capacitors are arranged and regions A and B serving as a second region in which primary-side switching elements and the secondary-side switching elements serving as electric elements are arranged.

Abstract: An insulation type step-up converter includes a core, first and second primary-side coils, a secondary-side coil, and a switching element. The core includes a middle leg, and first and second outer legs. The switching element is configured such that it can be controlled to be on/off so that electric currents flowing simultaneously in the first and second primary-side coils are opposite in direction to each other.

Abstract: A circuit apparatus includes: a core including a first core portion and a second core portion; and a first heat transfer member arranged between the first core portion and the second core portion. The first heat transfer member is in surface contact with a first side surface of the first core portion and a second side surface of the second core portion. The first heat transfer member is thermally connected to a coil. Thus, the rise in temperature of the core during operation of the circuit apparatuses can be more uniformly suppressed.