Abstract: A heating device includes a heating roller having a resistance heat-generating layer that generates heat by passage of a current through the resistance heat-generating layer, a pressure rotating body that rotates in such a manner as to press a sheet-shaped heating target that is an object to be subjected to a heating treatment against an outer peripheral surface of the heating roller and in such a manner as to cause the heating target to pass through the outer peripheral surface of the heating roller, and an auxiliary heating unit that supplementarily heats at least an axial end region included in a heat-generating region in which heat is generated by the resistance heat-generating layer of the heating roller.

Abstract: A semiconductor device includes: a semiconductor layer; first and second vertical MOS transistors provided in the semiconductor layer; a metal layer in contact with and connected to an entire back face of the semiconductor layer; and a support bonded to the back face side of the metal layer via a conductive adhesive. In a plan view, the support is larger in area than the semiconductor layer and encompasses the semiconductor layer. A thickness of the support is greater than a thickness of the semiconductor layer. In a cross-sectional view of the semiconductor device including a center of the semiconductor layer and an outer periphery of the semiconductor layer in the plan view, a semiconductor chip resulting from excluding the support and the conductive adhesive from the semiconductor device is in a curved shape projecting in a direction away from the support.

Abstract: A fixing device includes: a fixing belt that is heated by a heat source and rotates; a pressing roller that forms a nip part at a spot where the pressing roller is in contact with the fixing belt, the pressing roller rotating; and a load adjustment mechanism that obtains a belt temperature of the fixing belt and adjusts a load at the nip part according to a state of the belt temperature relative to a predetermined temperature.

Abstract: A fixing device includes: a fixing belt; plural holding members that hold the fixing belt so that the fixing belt is rotatable; a pressing roller that presses the fixing belt against one of the plural holding members from an outer peripheral surface of the fixing belt so as to form a fixing processing portion; an applicator that applies oil to an inner peripheral surface of the fixing belt; and a first guide member that is provided for at least one holding member of the plural holding members and includes a guiding surface with which a side of the fixing belt is brought into contact, the guiding surface being formed as a slope tilting toward an outer side of a longitudinal direction of the at least one holding member.

Abstract: An image forming apparatus includes: an image forming unit that forms an unfixed image on a sheet; and a fixing device that fixes the unfixed image on the sheet, the fixing device including a fixing belt, multiple holding members that hold the fixing belt so as to allow the fixing belt to run, a pressing roller that presses the fixing belt from an outer circumferential surface side against one of the holding members to form a fixing processing part, a heater that heats the fixing belt, and a load adjustment mechanism that adjusts a load applied to the pressing roller and applies a fixing load to the pressing roller during a fixing operation. At least at the end of the fixing operation of the fixing device, the load adjustment mechanism applies, as necessary, a low load that is lower than the fixing load to the pressing roller.

Abstract: A semiconductor device includes: a semiconductor layer; first and second vertical MOS transistors provided in the semiconductor layer; a metal layer in contact with and connected to an entire back face of the semiconductor layer; and a support bonded to the back face side of the metal layer via a conductive adhesive. In a plan view, the support is larger in area than the semiconductor layer and encompasses the semiconductor layer. A thickness of the support is greater than a thickness of the semiconductor layer. In a cross-sectional view of the semiconductor device including a center of the semiconductor layer and an outer periphery of the semiconductor layer in the plan view, a semiconductor chip resulting from excluding the support and the conductive adhesive from the semiconductor device is in a curved shape projecting in a direction away from the support.

Abstract: A semiconductor device includes: a semiconductor layer; first and second vertical MOS transistors provided in the semiconductor layer; a metal layer connected to and in contact with an entire surface on a back face side of the semiconductor layer; and a support bonded to a back face side of the metal layer via an adhesive. In a plan view, the support is larger in area than the semiconductor layer and encompasses the semiconductor layer. A thickness of the support is greater than a thickness of the semiconductor layer. In a cross-sectional view, a height of the adhesive along a lateral face of the semiconductor layer does not reach a top face of the semiconductor layer. In the cross-sectional view, a semiconductor chip resulting from excluding the support and the adhesive from the semiconductor device is in a curved shape that projects in a direction toward the support.

Abstract: A memory device includes source-drain structure bodies and gate structure bodies arranged along a first direction, and global word lines. The source-drain structure body includes a bit line, and first to third semiconductor layers. The first and second semiconductor layers are of first conductivity type and the first semiconductor layer is connected to the bit line. The third semiconductor layer of a second conductivity type contacts the first and second semiconductor layers. The gate structure body includes a local word line and a charge storage film. A first source-drain structure body includes a bit line forming a first reference bit line. A first global word line connects to the local word lines in the gate structure bodies formed on both sides of the first reference bit line and to the local word lines formed in alternate gate structure bodies that are formed between the remaining plurality of source-drain structure bodies.

Abstract: A pressing device includes a first pressurization unit; a second pressurization unit that is provided to face the first pressurization unit, and sandwiches and pressurizes a medium moving in a contact region formed between the first pressurization unit and the second pressurization unit; and a contact region variable unit that changes a width dimension of the contact region along a moving direction of the medium in a state of maintaining a contact pressure on an outlet side of the contact region, in varying a contact state of the contact region.

Abstract: A fixing device includes a fixing member that has an outer peripheral surface and an inner peripheral surface, is rotatably provided, comes into contact with, of a recording material on which an image is formed, a surface on which the image is formed, and fixes the image to the recording material, a rotating member that is rotatably provided and includes, at an outer peripheral portion, a contact surface coming into contact with the inner peripheral surface of the fixing member, and a removing member that is disposed to be in contact with the outer peripheral surface of the fixing member, is rotatably provided, and removes an attached object attached to the outer peripheral surface using a rotation speed difference with respect to the fixing member.

Abstract: A semiconductor manufacturing apparatus includes a front end module with a load port to which a conveyance container is connected on an upper surface; and a plurality of processing units configured to process a semiconductor substrate, disposed around the front end module in a plan view from a normal direction of the upper surface of the front end module, and each connected to the front end module from at least two directions in the plan view. The semiconductor substrate is conveyed between the conveyance container and the processing units via the front end module.

Abstract: A fixing device includes an endless belt-shaped section; a supply section that supplies a lubricating material to an inner surface of the belt-shaped section; a heating section that supports and rotates the belt-shaped section and generates heat during energization to heat the belt-shaped section; a power feed section that is electrically connected to an end part of the heating section and feeds power to the heating section; and a regulating section that is disposed on an outer surface side of the heating section and inside the power feed section with respect to an axial direction of rotation of the heating section to regulate movement of the lubricating material to a power feed section side.

Abstract: A fixing device includes a fixation member, a fixing member that has an outer peripheral surface and an inner peripheral surface, is rotatably provided with respect to the fixation member, comes into contact with, of a recording material on which an image is formed, a surface on which the image is formed, and fixes the image to the recording material, a rotating member that includes a contact surface, which is in contact with the inner peripheral surface of the fixing member, at an outer peripheral portion, includes a heat generating portion generating heat due to electric resistance, and is rotatable together with the heat generating portion with respect to the fixation member, and a power receiving member that includes a power receiving surface receiving power from the fixation member with a peripheral surface, has a spring characteristic of biasing the power receiving surface in a direction of the fixation member, and rotates together with the rotating member.

Abstract: A fixing device includes an endless belt, a fixing member that presses the belt against a recording medium holding an unfixed image to fix the unfixed image onto the recording medium, a restorer that is pressed against a surface of the belt after the image is fixed to restore the surface of the belt to a state before a fixing operation, and a changer that changes a pressing load of the restorer in accordance with a difference in a state of the surface of the belt between before the fixing operation and after the fixing operation.

Abstract: A fixing device includes an endless belt, multiple stretchers that stretch the belt, a heater that heats the belt including sections, section by section, sectioned in a direction crossing a rotation direction of the belt, and a switch that switches the sections heated by the heater from one to another in accordance with a position of an edge portion of the belt in the direction crossing the rotation direction of the belt.

Abstract: A belt transport device includes an endless belt, multiple stretchers that stretch the belt, a corrector that displaces one of the multiple stretchers to correct a shift of the belt toward an edge portion of the belt in an axial direction of the belt, and a lubricant applicator that applies a lubricant to an inner surface of the belt at the edge portion of the belt in the axial direction when the belt has shifted toward the edge portion in the axial direction.

Abstract: A heating device includes a heating roller that includes a resistance heating layer, a bearing that supports the heating roller to allow the heating roller to be rotatable, and a connection power feeder that is mounted on an end portion of the heating roller, is connected to the resistance heating layer, and feeds power to the resistance heating layer, in which the connection power feeder includes an annular frame that is disposed to be concentric with the heating roller and is conductively connected to the resistance heating layer, a power feed shaft of which a portion is disposed in the frame and which feeds power, and plural rolling bodies that roll while being in conductive contact with an inner peripheral surface of the frame and an outer peripheral surface of the power feed shaft, and the bearing is mounted on a portion of the end portion of the heating roller that is closer to an inside than the connection power feeder in an axial direction.

Abstract: A heating device includes a heating roller that includes a resistance heating layer, and a connection power feeder that is mounted on an end portion of the heating roller, is connected to the resistance heating layer, and feeds power to the resistance heating layer, in which the connection power feeder includes an annular frame that is disposed to be concentric with the heating roller and is conductively connected to the resistance heating layer, a power feed shaft of which a portion is disposed in the frame and which feeds power, plural rolling bodies that roll while being in conductive contact with an inner peripheral surface of the frame and an outer peripheral surface of the power feed shaft, and a non-conductive cover that holds and covers the frame and the rolling bodies in a state where a portion excluding the portion of the power feed shaft is exposed, and the connection power feeder excluding the power feed shaft is mounted on the heating roller so as to be integrally rotated with the heating roller.

Abstract: A pressing device includes a first pressurization unit; a second pressurization unit that is provided to face the first pressurization unit, and sandwiches and pressurizes a medium moving in a contact region formed between the first pressurization unit and the second pressurization unit; and a contact region variable unit that changes a width dimension of the contact region along a moving direction of the medium in a state of maintaining a contact pressure on an outlet side of the contact region, in varying a contact state of the contact region.

Abstract: A heating device includes a heating roller that includes a resistance heating layer, and a connection power feeder that is mounted on an end portion of the heating roller, is connected to the resistance heating layer, and feeds power to the resistance heating layer, in which the connection power feeder includes an annular frame that is disposed to be concentric with the heating roller and is conductively connected to the resistance heating layer, a power feed shaft of which a portion is disposed in the frame and which feeds power, plural rolling bodies that roll while being in conductive contact with an inner peripheral surface of the frame and an outer peripheral surface of the power feed shaft, and a non-conductive cover that holds and covers the frame and the rolling bodies in a state where a portion excluding the portion of the power feed shaft is exposed, and the connection power feeder excluding the power feed shaft is mounted on the heating roller so as to be integrally rotated with the heating roller.