Patents by Inventor Takashi Saito
Takashi Saito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12383987Abstract: Provided are a solder alloy and a solder joint which have high tensile strength, can suppress Ni leaching and can suppress generation of voids at a bonded interface. The solder alloy has an alloy composition consisting of, by mass %, —Ag: 1.0 to 4.0%, Cu: 0.1 to 1.0%, Ni: 0.005 to 0.3%, Co: 0.003 to 0.1%, and Ge: 0.001 to 0.015% with the balance being Sn The alloy composition satisfies the following relation (1): 0.00030<(Ni/Co)×(1/Ag)×Ge<0.05 ??(1) Co, Ag, and Ge in the relation (1) each represent the contents (mass %) in the alloy composition.Type: GrantFiled: July 29, 2020Date of Patent: August 12, 2025Assignee: Senju Metal Industry Co., Ltd.Inventors: Yuuki Iijima, Shunsaku Yoshikawa, Takashi Saito, Kanta Dei
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Patent number: 12377500Abstract: Provided are a lead-free and antimony-free solder alloy, a solder ball, and a solder joint that have improved shear strength obtained by grain minuteness at a bonded interface and can suppress fusion failure. The lead-free and antimony-free solder alloy having an alloy composition consisting of, by mass %, 0.1 to 4.5% of Ag, 0.20 to 0.85% of Cu, 0.2 to 5.00% of Bi, 0.005 to 0.09% of Ni, and 0.0005 to 0.0090% of Ge with the balance being Sn, and the alloy composition satisfies the following relations (1) and (2): 0.013?(Ag+Cu+Ni+Bi)×Ge?0.027 (1), Sn×Cu×Ni?5.0 (2). Ag, Cu, Ni, Bi, Ge, and Sn in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.Type: GrantFiled: February 8, 2021Date of Patent: August 5, 2025Assignee: Senju Metal Industry Co., Ltd.Inventors: Yuuki Iijima, Shunsaku Yoshikawa, Takashi Saito, Kanta Dei, Takahiro Matsufuji
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Publication number: 20250244413Abstract: A magnetic sensor includes at least one MR element and at least one magnetic field generator. The MR element includes a magnetization pinned layer and a free layer. The magnetic field generator includes a ferromagnetic portion and an antiferromagnetic portion to be exchange-coupled with the ferromagnetic portion. A manufacturing method of the magnetic sensor includes a process of forming the at least one magnetoresistive element and a process of forming the at least one magnetic field generator. The process of forming the magnetic field generator includes a process of forming at least one initial magnetic field generator including an initial ferromagnetic portion that later becomes the ferromagnetic portion and the antiferromagnetic portion, and a process of fixing a magnetization direction of the initial ferromagnetic portion so that the initial ferromagnetic portion becomes the ferromagnetic portion by using laser light and an external magnetic field.Type: ApplicationFiled: January 22, 2025Publication date: July 31, 2025Applicant: TDK CORPORATIONInventors: Hirokazu TAKAHASHI, Takashi Saito
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Publication number: 20250244417Abstract: A magnetic sensor includes at least one MR element, a ferromagnetic layer disposed to overlap the at least one MR element when viewed in a first direction, an insulating layer disposed on both sides of the at least one MR element in a second direction, an underlying layer disposed on the at least one MR element, the first ferromagnetic layer, and the insulating layer, and an antiferromagnetic layer disposed on the underlying layer. The antiferromagnetic layer includes an antiferromagnetic portion that faces the ferromagnetic layer via the underlying layer, and a non-facing part that faces the at least one MR element and the insulating layer via the underlying layer but does not face the ferromagnetic layer.Type: ApplicationFiled: January 22, 2025Publication date: July 31, 2025Applicant: TDK CorporationInventors: Takashi Saito, Hidekazu Kojima, Hirokazu Takahashi, Satoshi Miura
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Publication number: 20250244416Abstract: A magnetic sensor includes at least one MR element, a ferromagnetic layer disposed to overlap the at least one MR element when viewed in a first direction, an insulating layer disposed on both sides of the at least one MR element in a second direction, and an antiferromagnetic layer disposed on the at least one MR element, the ferromagnetic layer, and the insulating layer. The antiferromagnetic layer includes an antiferromagnetic portion that faces the ferromagnetic layer, and a non-facing part that faces the at least one MR element and the insulating layer but does not face the ferromagnetic layer. No magnetic layer is present between the at least one MR element and the antiferromagnetic layer.Type: ApplicationFiled: January 22, 2025Publication date: July 31, 2025Applicant: TDK CorporationInventors: Takashi SAITO, Hidekazu KOJIMA, Hirokazu TAKAHASHI, Satoshi MIURA
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Publication number: 20250244418Abstract: A magnetic sensor includes an MR element, at least one yoke, and at least one magnetic field generator. The at least one yoke includes a magnetic layer made of a soft magnetic material, and is adjacent to the MR element and spaced at a distance apart from each other. The at least one magnetic field generator includes a ferromagnetic portion made of a ferromagnetic material and an antiferromagnetic portion made of an antiferromagnetic material and exchange-coupled with the ferromagnetic portion, and is configured to generate a magnetic field to be applied to the at least one yoke.Type: ApplicationFiled: January 22, 2025Publication date: July 31, 2025Applicant: TDK CorporationInventors: Takashi SAITO, Hidekazu Kojima, Hirokazu Takahashi, Satoshi Miura, Norikazu Ota
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Publication number: 20250226276Abstract: A semiconductor device includes a conductive plate having a main surface, a semiconductor chip arranged to be opposed to the main surface of the conductive plate, a sintered bonding layer arranged between the conductive plate and the semiconductor chip, a sealing resin provided to seal the semiconductor chip and the sintered bonding layer, and a primer layer arranged between the sintered bonding layer and the sealing resin, wherein a first outer edge of a bonding interface between the sintered bonding layer and the conductive plate is located on the inside of an outer circumference of the semiconductor chip and is located on the inside of a second outer edge of a bonding interface between the sintered bonding layer and the semiconductor chip.Type: ApplicationFiled: March 28, 2025Publication date: July 10, 2025Applicant: FUJI ELECTRIC CO., LTD.Inventor: Takashi SAITO
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Publication number: 20250206097Abstract: The present disclosure relates to a stabilizer control device. In the stabilizer control device, a control unit is configured to operate an actuator of an active stabilizer of a vehicle and tilt a vehicle body of the vehicle to a right side or a left side when a user gets in and out of the vehicle.Type: ApplicationFiled: September 18, 2024Publication date: June 26, 2025Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventor: Takashi SAITO
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Publication number: 20250177621Abstract: A sensor assembly stores calibration information thereon even after a blood circuit is filled with fluid. A pressure sensor element 42 measures a value of pressure in a fluid flow channel 45. A storage unit 51 which is integrated with sensor element 42 stores, as calibration information, a calibration value determined in advance according to a value indicated by the pressure sensor element 42 in a state in which the pressure sensor element 42 is opened to atmospheric pressure and in which the internal pressure in a fluid flow channel 45 of the pressure sensor element 42 is equal to the atmospheric pressure. Measured pressure values and the calibration value are provided to a control unit which adjusts the measured values on the basis of the calibration information.Type: ApplicationFiled: February 12, 2025Publication date: June 5, 2025Inventors: Takashi Saito, Junji Inoue
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Patent number: 12318519Abstract: A cover member (36) that forms an end of a housing (26) of an oxygenator (10) has a recessed wall portion (88) recessed relative to a cover main body (74) further toward a side of a gas exchange unit (30) than an inner surface (74a). A pressure control hole (86) is formed through a main body (74) of the cover member (36), and a sampling port (90a) is disposed in the second recessed wall portion (88) to collect gas guided out from the gas exchange unit (30). The sampling port (90a) faces, at its inner opening portion (92), a second outlet side end face (31b) of the gas exchange unit (30).Type: GrantFiled: February 24, 2022Date of Patent: June 3, 2025Assignee: Terumo Kabushiki KaishaInventor: Takashi Saito
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Patent number: 12319751Abstract: The present invention provides an antibody specific to IgE antibody-producing B cells or an antibody binding fragment thereof. More specifically, the present invention provides an isolated monoclonal antibody or an antigen binding fragment thereof that binds to a peptide having a sequence consisting of an amino acid sequence set forth in SEQ ID NO: 1 or 18, and (1) binds to IgE antibody on a B cell surface and/or (2) binds to IgE antibody heated at 56° C.Type: GrantFiled: September 20, 2019Date of Patent: June 3, 2025Assignees: RIKEN, ANIMAL ALLERGY CLINICAL LABORATORIES INC.Inventors: Kenichi Masuda, Takashi Saito
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Publication number: 20250109314Abstract: Provided is a moisture absorption film layered product that can be photocured by using ultraviolet ray, which can achieve curing in a short time, and that has both excellent defogging properties and abrasion resistance. A moisture absorption film layered product including a moisture absorption film formed on a surface of a substrate, wherein the moisture absorption film is formed by curing a photocurable resin composition containing a siloxane resin (A) having a (meth)acryloyl group, three particular (meth)acrylate monomers (B), (C), and (D), and a photo-initiator as essential components, a blending proportion of (A):(B):(C):(D) is 0.1 to 5:35 to 55:0.5 to 10:40 to 60, (B) is a bifunctional monomer having a hydroxy group, (C) is a monofunctional monomer having an ethylene glycol chain, and (D) is a monofunctional monomer having a hydroxy group.Type: ApplicationFiled: September 20, 2024Publication date: April 3, 2025Applicants: NIPPON STEEL CHEMICAL & MATERIAL CO., LTD., Mazda Motor CorporationInventors: Takashi Saito, Tetsuya Maeda, Hiroto Matsui, Mitsuyoshi Kawabe, Daiji Katsura
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Patent number: 12264987Abstract: The present invention enables the measuring and evaluating of variations in vehicle fuel consumption and emission test results due to differences in driving style. An automatic operation device that automatically operates a test part based on a command vehicle speed includes a receiving unit, a command vehicle speed shaping unit, and an operation control unit. The receiving unit receives a driving mode set or changed by a user. The command vehicle speed shaping unit shapes a command vehicle speed r(t) based on the driving mode received by the receiving unit. The operation control unit controls an operation of the test part by a shaped command vehicle speed r?(t) obtained by the command vehicle speed shaping unit.Type: GrantFiled: March 16, 2021Date of Patent: April 1, 2025Assignee: HORIBA, LTD.Inventors: Takashi Saito, Kazuki Furukawa
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Publication number: 20250065449Abstract: A method for soldering includes applying a first solder alloy having a melting point in a temperature range higher than 210° C. to a jointed portion of a first electronic component and a substrate, and heating them in the temperature range higher than 210° C., and applying a second solder alloy having the melting point in a temperature range from than 160° C. to 210° C. to a joint portion of a second electronic component and the substrate to which the first electronic component is joined, and heating them in the temperature range from 160° C. to 210° C., wherein the second solder alloy consists of 13-22 mass % of In, 0.5-2.8 mass % of Ag, 0.5-5.0 mass % of Bi, 0.002-0.05 mass % of Ni and a balance Sn.Type: ApplicationFiled: November 15, 2024Publication date: February 27, 2025Applicant: SENJU METAL INDUSTRY CO., LTD.Inventors: Takashi SAITO, Shunsaku YOSHIKAWA, Naoko IZUMITA
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Publication number: 20250058414Abstract: Provided are a solder alloy and a solder joint formed from the soldier alloy. The solder alloy has an alloy composition of, by mass %, Ag: 1.0 to 3.7%, Cu: 0.4 to 0.8%, Sb: 0.50 to 2.90%, In: 5.00 to 10.00%, and Ni: 0.01 to 0.06%, with the balance being Sn.Type: ApplicationFiled: September 29, 2022Publication date: February 20, 2025Inventors: Takahiro Yokoyama, Takashi Saito, Shunsaku Yoshikawa, Kota Sugisawa
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Patent number: 12211768Abstract: A heat sink is a multilayer cooler for cooling a contacting heat-generating element by flowing a coolant from a fluid inlet to a fluid outlet, and includes a heat-receiving plate, a channel plate, an orifice plate, a header plate, and a bottom plate stacked in this order from the top surface and bonded by diffusion bonding. The channel plate has many cooling micropaths arranged in a matrix. The orifice plate has jet orifices for jetting a coolant into the cooling micropaths and drain orifices for draining the coolant from the cooling micropaths. The header plate includes a baffle that separates the fluid inlet from the fluid outlet. The baffle includes a plurality of parallel plates and first end plates and second end plates that alternately close openings at an end and at the opposite end of the parallel plate. The baffle and the peripheral wall define a supply channel.Type: GrantFiled: February 28, 2024Date of Patent: January 28, 2025Assignee: WELCON Inc.Inventors: Yutaka Suzuki, Takashi Saito, Shingo Ikarashi
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Publication number: 20250014920Abstract: The purpose of the present invention is to provide a sealing mold that realizes, with a simple structure, a vertical movement mechanism for setting pins. As a solution, a sealing mold (202) according to the present invention includes a vertically movable support plate (215) between a chase block (213) and a plate (251), wherein: the support plate (215) has support members (221) that support a workpiece (W); and a pushing pin (226) is provided so as to be supported by a plate (252), the pushing pin pushing the support plate (215) away from a cavity plate (211) when the plate (251) and the plate (252) are put in a state in which said plates are brought even closer to each other from a state in which the mold is closed. Representative drawing: FIG.Type: ApplicationFiled: January 25, 2022Publication date: January 9, 2025Applicant: APIC YAMADA CORPORATIONInventors: TAKASHI SAITO, Konomi Ohashi
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Patent number: 12179291Abstract: A method for step-soldering includes applying a first solder alloy having a melting point in a temperature range from 160 to 210° C. to a jointed portion of a first electronic component and a substrate, and heating them in the temperature range from 160 to 210° C., and applying a second solder alloy having the melting point in a temperature range lower than 160° C. to a joint portion of a second electronic component and the substrate, and heating them in the temperature range lower than 160° C. The first solder alloy consists of 13-22 mass % of In, 0.5-2.8 mass % of Ag, 0.5-5.0 mass % of Bi, 0.002-0.05 mass % of Ni and a balance Sn.Type: GrantFiled: March 27, 2023Date of Patent: December 31, 2024Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Takashi Saito, Shunsaku Yoshikawa, Naoko Izumita
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Publication number: 20240418638Abstract: A machine learning device used in an exhaust gas analysis device that irradiates combustion exhaust gas with light, performs a detection of light transmitted through the combustion exhaust gas, and analyzes the combustion exhaust gas based on a detection signal includes a training data reception unit that receives training data including a reference value of a specific component concentration and at least one of spectrum data obtained by irradiating the combustion exhaust gas with light or an individual component concentration selected based on an element balance formula for determining the specific component concentration, or an arithmetic value of a specific component concentration calculated using the individual component concentration in the element balance formula, and a machine learning unit that performs machine learning on a relationship between the reference value and at least one of the spectrum data, the individual component concentration, or the arithmetic value using the training data.Type: ApplicationFiled: October 26, 2022Publication date: December 19, 2024Applicant: HORIBA, LTD.Inventors: Makoto NAGAOKA, Takashi SAITO
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Publication number: 20240408864Abstract: Provided is an ink jet recording method capable of recording a high-quality image in which a positional shift between ruled lines recorded with a plurality of inks through use of a circulation serial head and variations in their line widths are reduced. The ink jet recording method includes recording an image by ejecting an ink from a recording head including, an ejection element and a first flow path and a second flow path. This method includes an ejection step and a flow step. The recording head is of a serial type. The first flow path and the second flow path are arranged in parallel to a scanning direction and have the same flow direction of the ink. Ejection orifice arrays include a first ejection orifice array. A static surface tension ?s1 of the first ink and a static surface tension ?s2 of the second ink satisfy a relationship of ?s1<?s2.Type: ApplicationFiled: June 11, 2024Publication date: December 12, 2024Inventors: TAKASHI SAITO, KOUHEI NAKAGAWA