Patents by Inventor Takashi Saito

Takashi Saito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11607753
    Abstract: A solder alloy has an alloy composition consisting of, in mass %, Cu: 0.1% to 2.0%, Ni: 0.01% to 0.4%, P: 0.001% to 0.08%, and Ge: 0.001% to 0.08%, with the balance being Sn. The alloy composition satisfies the following relations (1) to (3): (Cu+5Ni)?0.945% (relation (1)), (P+Ge)?0.15% (relation (2)), 2.0?(Cu+5Ni)/(P+Ge)?1000 (relation (3)). In the above relations (1) to (3), Cu, Ni, P, and Ge each represents a content (mass %) thereof in the solder alloy.
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: March 21, 2023
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Shunsaku Yoshikawa, Takashi Saito, Takahiro Matsufuji, Naoko Izumita, Yuuki Iijima, Kanta Dei
  • Publication number: 20230073604
    Abstract: There is provided a resin-sealing apparatus that supplies an appropriate amount of sheet-shaped resin for each workpiece, thereby improving the molding quality of a molded product without production of resin dust, such that no redundant resin is produced on a molded product. The resin-sealing apparatus includes a resin supply part that supplies a sheet-shaped resin by cutting out an amount of sheet-shaped resin appropriate for one-time compression molding from a long resin sheet formed to have a predetermined width and a predetermined thickness depending on an amount of resin required for each workpiece, and a transport part that transports the appropriate amount of sheet-shaped resin supplied by the resin supply part to a sealing mold.
    Type: Application
    Filed: November 14, 2022
    Publication date: March 9, 2023
    Applicant: APIC YAMADA CORPORATION
    Inventor: Takashi Saito
  • Publication number: 20230068294
    Abstract: Provided are a lead-free and antimony-free solder alloy, a solder ball, and a solder joint that have improved shear strength obtained by grain minuteness at a bonded interface and can suppress fusion failure. The lead-free and antimony-free solder alloy having an alloy composition consisting of, by mass%, 0.1 to 4.5% of Ag, 0.20 to 0.85% of Cu, 0.2 to 5.00% of Bi, 0.005 to 0.09% of Ni, and 0.0005 to 0.0090% of Ge with the balance being Sn, and the alloy composition satisfies the following relations (1) and (2): 0.013 ? (Ag + Cu + Ni + Bi) x Ge ? 0.027 (1), Sn x Cu x Ni ? 5.0 (2). Ag, Cu, Ni, Bi, Ge, and Sn in the relations (1) and (2) each represent the contents (mass%) in the alloy composition.
    Type: Application
    Filed: February 8, 2021
    Publication date: March 2, 2023
    Inventors: Yuuki Iijima, Shunsaku Yoshikawa, Takashi Saito, Kanta Dei, Takahiro Matsufuji
  • Publication number: 20230060857
    Abstract: Provided are a lead-free and antimony-free solder alloy, a solder ball, and a solder joint, which have improved shear strength obtained by grain minuteness at a bonded interface and can suppress fusion failure. The lead-free and antimony-free solder alloy has an alloy composition consisting of, by mass %, 0.1 to 4.5% of Ag, 0.20 to 0.85% of Cu, 0.005 to 0.090% of Ni, and 0.0005 to 0.0090% of Ge with the balance being Sn, and the alloy composition satisfies the following relations (1) and (2): 0.006?(Ag+Cu+Ni)×Ge<0.023 (1), (Sn/Cu)×(Ni×Ge)/(Ni +Ge)<0.89 (2). Ag, Cu, Ni, Ge, and Sn in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.
    Type: Application
    Filed: February 8, 2021
    Publication date: March 2, 2023
    Inventors: Yuuki Iijima, Shunsaku Yoshikawa, Takashi Saito, Kanta Dei, Takahiro Matsufuji
  • Patent number: 11577344
    Abstract: A solder alloy has an alloy composition consisting of, in mass %, Ag: 0 to 4%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.3%, Sb: 5.1 to 7.5%, Bi: 0.1 to 4.5%, Co: 0.001 to 0.3%, P: 0.001 to 0.2%, and the balance being Sn.
    Type: Grant
    Filed: July 28, 2021
    Date of Patent: February 14, 2023
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Yuuki Iijima, Shunsaku Yoshikawa, Takashi Saito
  • Publication number: 20220386747
    Abstract: A knitted fastener stringer has a chain stich yarn disposed on the innermost edge wale furthest from the tape body portion of an element attaching portion is the thickest of all the chain stich yarns used in a fastener tape. This enables a distance of a gap formed between left and right fastener tapes to be smaller when a slide fastener is formed by two knitted fastener stringers.
    Type: Application
    Filed: October 16, 2019
    Publication date: December 8, 2022
    Inventors: Norio Uozumi, Takashi Saito
  • Publication number: 20220383901
    Abstract: Provided is a sputtering target to be used for forming a granular magnetic thin film in which FePt magnetic grains are isolated by an oxide and which constitutes a heat-assisted magnetic recording medium having enhanced uniaxial magnetic anisotropy, thermal stability, and SNR (signal-to-noise ratio). The sputtering target for a heat-assisted magnetic recording medium contains an FePt alloy and a nonmagnetic material as main components, where the nonmagnetic material is an oxide having a melting point of 800° C. or higher and 1100° C. or lower.
    Type: Application
    Filed: October 27, 2020
    Publication date: December 1, 2022
    Inventors: Kim Kong Tham, Ryousuke Kushibiki, Shin Saito, Takashi Saito
  • Patent number: 11508491
    Abstract: An irradiation target is formed into a sphere. The spherical irradiation target can be iridium metal containing natural or enriched iridium. The radiation source can be manufactured by manufacturing a spherical irradiation target, accommodating the spherical irradiation target in a rotating capsule, and rotating an axial flow impeller by a downward flow of a reactor primary coolant, whereby the rotating capsule is rotated. This radiation source provides an improved nondestructive inspection image having a high geometric resolution, and has no radiation source anisotropy and also has high target recyclability.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: November 22, 2022
    Assignee: CHIYODA TECHNOL CORPORATION
    Inventors: Hiroshi Kawamura, Hidetaka Kanazawa, Takashi Saito, Takashi Ishii
  • Publication number: 20220362201
    Abstract: An odontoblast proliferation/differentiation promoting agent contains a calcium salt of 4-(meth)acryloyloxyethyltrimellitic acid.
    Type: Application
    Filed: October 23, 2020
    Publication date: November 17, 2022
    Inventors: Takashi SAITO, Youjing QIU, Tamaki OTSUKI, Akiyo TADA, Takashi YAMAMOTO, Tatsuya ORI, Kumiko NAKAMURA, Tadashi ISHIDA
  • Publication number: 20220355420
    Abstract: A solder alloy comprises Ag: 3.1 to 4.0% by mass, Cu: 0.6 to 0.8% by mass, Bi: 1.5 to 5.5% by mass, Sb: 1.0 to 6.0% by mass, Co: 0.001 to 0.030% by mass, Fe: 0.02 to 0.05% by mass, and a balance Sn.
    Type: Application
    Filed: June 22, 2021
    Publication date: November 10, 2022
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Shunsaku YOSHIKAWA, Takashi SAITO, Yuuki IIJIMA, Kanta DEI, Takahiro MATSUFUJI
  • Publication number: 20220324061
    Abstract: Provided are a solder alloy and a solder joint which have high tensile strength, can suppress Ni leaching and can suppress generation of voids at a bonded interface. The solder alloy has an alloy composition consisting of, by mass %, Ag: 1.0 to 4.0%, Cu: 0.1 to 1.0%, Ni: 0.005 to 0.3%, Co: 0.003 to 0.1%, and Ge: 0.001 to 0.015% with the balance being Sn The alloy composition satisfies the following relation (1): 0.00030<(Ni/Co)×(1/Ag)×Ge<0.05 ??(1) Co, Ag, and Ge in the relation (1) each represent the contents (mass %) in the alloy composition.
    Type: Application
    Filed: July 29, 2020
    Publication date: October 13, 2022
    Inventors: Yuuki Iijima, Shunsaku Yoshikawa, Takashi Saito, Kanta Dei
  • Publication number: 20220310548
    Abstract: An object is to provide highly reliable semiconductor element bonding portion and semiconductor device that have high heat resistance and improved adhesion between a bonding material and a sealing resin. Provided is a semiconductor element bonding portion in which the semiconductor element 11 and an electrically conductive plate 123a are bonded to each other by a bonding layer 10 and the bonding layer 10 includes a metal nanoparticle sintered body 101 and a coupling agent 102 including an SH group.
    Type: Application
    Filed: January 28, 2022
    Publication date: September 29, 2022
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Masaaki TACHIOKA, Takashi SAITO
  • Patent number: 11442391
    Abstract: A drive control device is configured to control a plurality of drive sources configured to drive a single output shaft. The drive control device includes a control unit configured to generate a single drive control signal and transmit the drive control signal to the plurality of drive sources. The drive control device has, as operation modes, a first mode for driving the plurality of drive sources and a second mode for driving a part of the plurality of drive sources.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: September 13, 2022
    Assignee: RICOH COMPANY, LTD.
    Inventors: Keisuke Sugiyama, Hidehiko Fujiwara, Jun Yamada, Takashi Saito, Ikuhisa Okamoto
  • Patent number: 11384992
    Abstract: A heat exchanger includes a first flow channel and a second flow channel that are alternately stacked in a stacking direction, each of the first flow channel and the second flow channel including: upstream parts disposed parallel to one another in a direction perpendicular to the stacking direction and to a direction in which the flow channels extend; downstream parts disposed parallel to one another in a direction perpendicular to the stacking direction and to a direction in which the flow channels extend; and branching/merging parts configured to branch the flow channels immediately upstream of the branching/merging parts into two divergent channels and merge the divergent channels adjacent to one another to form next flow channels, between the upstream parts and the downstream parts, wherein the branching/merging parts are provided in a plurality of stages between the upstream parts and the downstream parts.
    Type: Grant
    Filed: August 29, 2017
    Date of Patent: July 12, 2022
    Assignee: WELCON Inc.
    Inventors: Yutaka Suzuki, Takashi Saito, Hiroaki Kimura, Shingo Ikarashi
  • Patent number: 11377321
    Abstract: A post-processing device for processing a sheet includes a post-processing section for post-processing a sheet; a buffer section for temporarily staying a plurality of sheets at an upstream of the post-processing section; and a conveying section for conveying, one by one, the plurality of sheets stayed at the buffer section to the post-processing section.
    Type: Grant
    Filed: October 1, 2019
    Date of Patent: July 5, 2022
    Assignee: CANON FINETECH NISCA INC.
    Inventor: Takashi Saito
  • Publication number: 20220189650
    Abstract: An irradiation target is formed into a sphere. The spherical irradiation target can be iridium metal containing natural or enriched iridium. The radiation source can be manufactured by manufacturing a spherical irradiation target, accommodating the spherical irradiation target in a rotating capsule, and rotating an axial flow impeller by a downward flow of a reactor primary coolant, whereby the rotating capsule is rotated. This radiation source provides an improved nondestructive inspection image having a high geometric resolution, and has no radiation source anisotropy and also has high target recyclability.
    Type: Application
    Filed: December 15, 2020
    Publication date: June 16, 2022
    Applicant: CHIYODA TECHNOL CORPORATION
    Inventors: Hiroshi KAWAMURA, Hidetaka KANAZAWA, Takashi SAITO, Takashi ISHII
  • Publication number: 20220176024
    Abstract: A cover member (36) that forms an end of a housing (26) of an oxygenator (10) has a recessed wall portion (88) recessed relative to a cover main body (74) further toward a side of a gas exchange unit (30) than an inner surface (74a). A pressure control hole (86) is formed through a main body (74) of the cover member (36), and a sampling port (90a) is disposed in the second recessed wall portion (88) to collect gas guided out from the gas exchange unit (30). The sampling port (90a) faces, at its inner opening portion (92), a second outlet side end face (31b) of the gas exchange unit (30).
    Type: Application
    Filed: February 24, 2022
    Publication date: June 9, 2022
    Inventor: Takashi Saito
  • Publication number: 20220176709
    Abstract: Provided is an ink jet recording method by which even when a multicolor image is recorded with an ink jet recording apparatus including an ink storage portion having an ink inlet port arranged in its upper portion by applying a plurality of aqueous inks each comprising a pigment to a recording medium, an image excellent in abrasion resistance can be stably recorded over along time period. The method is an ink jet recording method for recording an image on a recording medium with an ink jet recording apparatus including: a plurality of aqueous inks each comprising a pigment; an ink storage portion; a recording head; and an ink supply path. The aqueous inks include a first ink to be applied earlier to the recording medium and a second ink to be applied later to the recording medium, and the first ink has a redispersibility index of 0.90 or more.
    Type: Application
    Filed: December 3, 2021
    Publication date: June 9, 2022
    Inventors: Takashi Saito, Tomohiro Yamashita, Arihiro Saito, Maki Motomura
  • Publication number: 20220161465
    Abstract: There is provided a resin-sealing apparatus that supplies an appropriate amount of sheet-shaped resin for each workpiece, thereby improving the molding quality of a molded product without production of resin dust, such that no redundant resin is produced on a molded product. The resin-sealing apparatus includes a resin supply part that supplies a sheet-shaped resin by cutting out an amount of sheet-shaped resin appropriate for one-time compression molding from a long resin sheet formed to have a predetermined width and a predetermined thickness depending on an amount of resin required for each workpiece, and a transport part that transports the appropriate amount of sheet-shaped resin supplied by the resin supply part to a sealing mold.
    Type: Application
    Filed: September 30, 2021
    Publication date: May 26, 2022
    Applicant: APIC YAMADA CORPORATION
    Inventor: TAKASHI SAITO
  • Publication number: 20220154333
    Abstract: A vaporizer is provided that is capable of heating source material mist under precise temperature management and thereby able to acquire a gas source material which can be adjusted to a prescribed temperature and which has a very low level of variation in temperature and that produces almost no precipitate. The vaporizer heats and vaporizes a source material mist to obtain a gas source material for film forming.
    Type: Application
    Filed: April 17, 2019
    Publication date: May 19, 2022
    Inventors: Yutaka SUZUKI, Takashi SAITO