Patents by Inventor Takashi Saito

Takashi Saito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11845825
    Abstract: A method for manufacturing a rubber-reinforced styrenic resin powder comprising 40% by mass or more of a rubbery polymer, satisfying the following conditions (1) to (4): (1) at least first and second coagulation baths are provided; (2) the first and second coagulation baths are connected; (3) an emulsified dispersion of fatty acid amide is supplied to the connecting part in an amount of 0.2 parts by mass to 2.0 parts by mass (solid content) with respect to 100 parts by mass (solid content) of a slurry; and (4) a temperature in the second coagulation bath is equal to or higher than a temperature in the first coagulation bath.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: December 19, 2023
    Assignee: NIPPON A&L INC.
    Inventor: Takashi Saito
  • Patent number: 11833838
    Abstract: Provided is an ink jet recording method capable of recording an image with a tertiary color, less causing color shift even with use of a recording apparatus having an ink inlet port. The ink jet recording method includes recording an image, with use of an ink jet recording apparatus that includes a plurality of aqueous inks; an ink storage portion that independently stores the aqueous inks; a recording head having formed therein an ejection orifice through which each aqueous ink is ejected; and a tube through which each aqueous ink is supplied from the ink storage portion to the recording head. The ink storage portion has provided thereto an inlet port through which the aqueous ink is filled, the tube is formed of a resin material, a cyan ink contains a phthalocyanine pigment, and both of a yellow ink and a magenta ink individually contain an azo pigment.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: December 5, 2023
    Assignee: Canon Kabushiki Kaisha
    Inventors: Maki Motomura, Tomohiro Yamashita, Takashi Saito, Arihiro Saito
  • Publication number: 20230380551
    Abstract: A method for manufacturing a fastener stringer according to the present invention, include a dyeing step for dyeing a fastener stringer including an element row fixed to a side edge portion of a tape made of fiber, a dye cleaning step for removing excess dye from the fastener stringer, a water repellent treatment step for adhering a non-fluorine-based water repellent agent to the fastener stringer, and a pre-dyeing degreasing step for degreasing oil and fat adhered to the fastener stringer by a wet process.
    Type: Application
    Filed: June 28, 2023
    Publication date: November 30, 2023
    Inventors: Toshiyuki Jyogan, Takashi Saito
  • Patent number: 11827033
    Abstract: An ink jet recording method for recording an image uses an ink jet recording apparatus that includes an aqueous ink, a first ink storage portion that stores the aqueous ink, a second ink storage portion that stores the aqueous ink without impregnating it into an absorbent, and a recording head. The second ink storage portion and the recording head compose therein an ink flow path through which the aqueous ink is supplied, a filter that partitions an upstream side and a downstream side of the ink flow path is arranged, and a ratio (A/B) of volume A (mL) of the ink flow path to the upstream side and volume B (mL) of the ink flow path on the downstream side is 5 or more, the aqueous ink contains a coloring material, a nonionic surfactant, and a first water-soluble organic solvent having a relative dielectric constant of 30.0 or less.
    Type: Grant
    Filed: July 19, 2021
    Date of Patent: November 28, 2023
    Assignee: Canon Kabushiki Kaisha
    Inventors: Tomohiro Yamashita, Takashi Saito, Arihiro Saito, Maki Motomura
  • Publication number: 20230369276
    Abstract: Provided is a method of manufacturing a semiconductor device that can lead a surface of sinter paste to be flattened before depositing a power semiconductor chip so as to achieve high-density packaging. The manufacturing method applies sinter paste having a surface provided with a projection to a main surface of a conductive plate, dries the sinter paste, flattens the surface of the sinter paste by applying a pressure to the sinter paste so as to squash the projection on the surface of the sinter paste, deposits a semiconductor chip on the main surface of the conductive plate with the sinter paste interposed, and sinters the sinter paste by heating and pressure application to form a bonding layer so as to bond the conductive plate and the semiconductor chip together via the bonding layer.
    Type: Application
    Filed: July 27, 2023
    Publication date: November 16, 2023
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventor: Takashi SAITO
  • Publication number: 20230355111
    Abstract: A biological information detector detects biological information of an object person. The biological information detector includes a reception antenna that receives radio waves transmitted from a transmission antenna through the object person, and a signal acquisition unit that acquires a reception signal corresponding to a radio wave received by the reception antenna when the radio waves are transmitted from the transmission antenna. The biological information detector further includes a calculation unit that calculates the biological information based on the received signal acquired by the signal acquisition unit. The calculation unit extracts a signal component generated due to movement of a heart of the object person based on the received signal, and calculates a blood pressure of the object person as the biological information based on the signal component.
    Type: Application
    Filed: July 17, 2023
    Publication date: November 9, 2023
    Inventors: Syunsuke SHIBATA, Takashi SAITO, Goro UEDA
  • Publication number: 20230335527
    Abstract: Provided is a semiconductor device including a bonding layer made from sintered material and having a configuration capable of avoiding a variation in life span. The semiconductor device includes a conductive plate having a main surface, a semiconductor chip deposited to be opposed to the main surface of the conductive plate, and a bonding layer including porous sintered material and arranged between the conductive plate and the semiconductor chip, wherein a first outer edge of a bonding interface between the bonding layer and the conductive plate is located on the inside of an outer circumference of the semiconductor chip and is located on the inside of a second outer edge of a bonding interface between the bonding layer and the semiconductor chip.
    Type: Application
    Filed: June 26, 2023
    Publication date: October 19, 2023
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventor: Takashi SAITO
  • Publication number: 20230282611
    Abstract: When a semiconductor unit is heated, a heater having a flat heating surface is used for performing heating in a state in which a lower surface of an insulated circuit board is placed on the heating surface. When the semiconductor unit is cooled, a cooler having a cooling surface including a pair of support portions is used for performing cooling in which a lower surface of a pair of outer regions of the insulated circuit board are respectively placed to be contact with the pair of support portions, and in which a central region between the pair of outer regions of the insulated circuit board is pressed downward so as to be downward convex.
    Type: Application
    Filed: January 25, 2023
    Publication date: September 7, 2023
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Hiroki TAKAHASHI, Tsunehiro NAKAJIMA, Takashi SAITO
  • Patent number: 11744332
    Abstract: A method for manufacturing a fastener stringer according to the present invention, include a dyeing step for dyeing a fastener stringer including an element row fixed to a side edge portion of a tape made of fiber, a dye cleaning step for removing excess dye from the fastener stringer, a water repellent treatment step for adhering a non-fluorine-based water repellent agent to the fastener stringer, and a pre-dyeing degreasing step for degreasing oil and fat adhered to the fastener stringer by a wet process.
    Type: Grant
    Filed: December 25, 2020
    Date of Patent: September 5, 2023
    Assignee: YKK Corporation
    Inventors: Toshiyuki Jyogan, Takashi Saito
  • Publication number: 20230266316
    Abstract: An object of the present invention is to demonstrate the existence of a heterodimer of somatostatin receptor subtype 1 (SSTR1) and somatostatin receptor subtype 4 (SSTR4) and also to provide a method for screening a factor that binds to such a heterodimer and the heterodimer that can be used in the screening method. A transformant expressing a heterodimer of somatostatin receptor subtype 1 and somatostatin receptor subtype 4, into which DNA encoding somatostatin receptor subtype 1 and DNA encoding somatostatin receptor subtype 4 have been introduced. A method for screening a compound that interacts with a heterodimer of somatostatin receptor subtype 1 and somatostatin receptor subtype 4, comprising selecting the compound that interacts with the heterodimer from test compounds.
    Type: Application
    Filed: September 30, 2020
    Publication date: August 24, 2023
    Inventors: Takaomi Saido, Takashi Saito, Shoko Matsuba, Satoshi Tsubuki, Yukio Matsuba, Hiroki Arai, Naomi Mihira, Risa Takamura
  • Patent number: 11712091
    Abstract: A water repellent product includes a water repellent fabric in which a non-fluorine-based water repellent agent is applied to a fabric formed of a fiber; and a resin component attached to the water repellent fabric. The water repellent product contains substantially no cross-linking agent for chemically bonding the non-fluorine-based water repellent agent and the fiber.
    Type: Grant
    Filed: February 3, 2021
    Date of Patent: August 1, 2023
    Assignee: YKK Corporation
    Inventors: Toshiyuki Jyogan, Takashi Saito
  • Publication number: 20230226648
    Abstract: A method for step-soldering includes applying a first solder alloy having a melting point in a temperature range from 160 to 210° C. to a jointed portion of a first electronic component and a substrate, and heating them in the temperature range from 160 to 210° C., and applying a second solder alloy having the melting point in a temperature range lower than 160° C. to a joint portion of a second electronic component and the substrate, and heating them in the temperature range lower than 160° C. The first solder alloy consists of 13-22 mass % of In, 0.5-2.8 mass % of Ag, 0.5-5.0 mass % of Bi, 0.002-0.05 mass % of Ni and a balance Sn.
    Type: Application
    Filed: March 27, 2023
    Publication date: July 20, 2023
    Applicant: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Takashi SAITO, Shunsaku YOSHIKAWA, Naoko IZUMITA
  • Publication number: 20230218742
    Abstract: The present invention provides a vaccine against a coronavirus. According to the present invention, there is provided a peptide consisting of the amino acid sequence set forth in SEQ ID NO: 1 or a partial peptide of a coronavirus spike protein consisting of the amino acid sequence corresponding to the amino acid sequence of SEQ ID NO: 1 and a multiple antigen peptide containing a plurality of any of these peptides.
    Type: Application
    Filed: May 21, 2021
    Publication date: July 13, 2023
    Applicants: RIKEN, ANIMAL ALLERGY CLINICAL LABORATORIES INC.
    Inventors: Kenichi MASUDA, Takashi SAITO
  • Publication number: 20230190882
    Abstract: A tooth dentin, pulp or pulp tissue composition for treating or preventing a disease, disorder, or symptom of a tooth dentin and/or pulp or pulp tissue includes: (a) an integrin binding fragment of Laminin, the Laminin being selected from the group consisting of Laminin 511 and Laminin 411, the integrin binding fragment comprising an integrin-binding domain of the Laminin; and (b) a mixture of odontoblast and mineralized nodules secreted from the odontoblast. A coating density of the integrin binding fragment is 1 to 8 ?g/cm2. The material (b) has been mixed with the material (a) in the composition so as to form pulp capping applicable to a tooth, such that the composition is able to treat or prevent the disease, disorder or symptom of the tooth dentin and/or pulp tissue including dental caries when applied to the tooth.
    Type: Application
    Filed: November 18, 2022
    Publication date: June 22, 2023
    Inventor: Takashi Saito
  • Publication number: 20230173619
    Abstract: Provided are a lead-free and antimony-free solder alloy which has a medium-low melting point and ensures solderability even after being held at a high temperature for a long time, a solder ball, a ball grid array, and a solder joint. The lead-free and antimony-free solder alloy has an alloy composition consisting of 12 to 23% by mass of In, and 0.001 to 0.08% by mass of Ge, with the balance being Sn and unavoidable impurities. Preferably, the alloy composition has 16 to 21% by mass of In; the alloy composition has 0.005 to 0.01% by mass of Ge; the alloy composition has 0.005 to 0.009% by mass of Ge; U and Th as the unavoidable impurities are each included in an amount of 5 mass ppb or less; and As and Pb as the unavoidable impurities are each included in an amount of 5 mass ppm or less.
    Type: Application
    Filed: April 29, 2021
    Publication date: June 8, 2023
    Inventors: Takashi Saito, Hiroki Sudo, Mai Susa
  • Patent number: 11654693
    Abstract: Provided is an ink jet recording method by which even when a multicolor image is recorded with an ink jet recording apparatus including an ink storage portion having an ink inlet port arranged in its upper portion by applying a plurality of aqueous inks each comprising a pigment to a recording medium, an image excellent in abrasion resistance can be stably recorded over along time period. The method is an ink jet recording method for recording an image on a recording medium with an ink jet recording apparatus including: a plurality of aqueous inks each comprising a pigment; an ink storage portion; a recording head; and an ink supply path. The aqueous inks include a first ink to be applied earlier to the recording medium and a second ink to be applied later to the recording medium, and the first ink has a redispersibility index of 0.90 or more.
    Type: Grant
    Filed: December 3, 2021
    Date of Patent: May 23, 2023
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takashi Saito, Tomohiro Yamashita, Arihiro Saito, Maki Motomura
  • Publication number: 20230150504
    Abstract: The present invention is intended to make it possible to automatically drive a test object without performing pre-learning for a running performance map for each vehicle. There is provided an automatic test object driving device that automatically drives a test vehicle based on a command vehicle speed, and that includes a driving actuator for performing driving operation of the test vehicle, and a driving control unit for controlling the driving actuator. The driving control unit includes a first accelerator map and a second accelerator map each of which indicates a relationship among a vehicle-speed-related value, an acceleration-related value, and an accelerator-depression-amount-related value. The driving control unit uses the first accelerator map to determine an accelerator depression amount corresponding to the command vehicle speed, and uses the second accelerator map to correct the accelerator depression amount by feeding back a vehicle speed and an acceleration of the test vehicle.
    Type: Application
    Filed: February 24, 2021
    Publication date: May 18, 2023
    Applicant: HORIBA, LTD.
    Inventors: Yoshitake ANDO, Takashi SAITO
  • Publication number: 20230142695
    Abstract: A semiconductor device includes an insulated circuit board having a conductive pattern layer, a sintered member disposed on the conductive pattern layer, a semiconductor chip placed on the sintered member, and a coating material covering the semiconductor chip. The sintered member has, on a surface thereof opposite to the conductive pattern layer, a frame shaping the outer edge of a recess. The semiconductor chip is mounted in the recess such that its top face is located closer to the conductive pattern layer than a top end of the frame.
    Type: Application
    Filed: September 27, 2022
    Publication date: May 11, 2023
    Applicant: FUJI ELECTRIC CO., LTD.
    Inventors: Yuichiro HINATA, Naoyuki KANAI, Takashi SAITO
  • Publication number: 20230129147
    Abstract: Provided are a solder alloy, a solder ball, and a solder joint which have an excellent pin contact performance and a high bonding strength. The solder alloy has an alloy composition consisting of, by mass %, Ag: 0.8 to 1.5%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.10%, and P: 0.006% to 0.009%, with the balance being Sn. The alloy composition preferably satisfies the following relations (1) and (2): 2.0?Ag×Cu×Ni/P?25, 0.500?Sn×P?0.778. Ag, Cu, Ni, P, and Sn in the relations (1) and (2) each represent the contents (mass %) in the alloy composition.
    Type: Application
    Filed: March 10, 2021
    Publication date: April 27, 2023
    Inventors: Yuuki Iijima, Hiroshi Okada, Shunsaku Yoshikawa, Takashi Saito, Kanta Dei, Takahiro Matsufuji
  • Patent number: 11633815
    Abstract: Provided is a solder paste which uses a conventional flux, and for which long-term preservation is made possible and an easy preservation method can be realized by suppressing changes in the viscosity of the paste over time. This solder paste is provided with a solder powder, a zirconium oxide powder, and a flux, and changes in the viscosity of the paste over time are suppressed.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: April 25, 2023
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Toru Hayashida, Shunsaku Yoshikawa, Takashi Saito, Kanta Dei