Abstract: A vaporizer is provided that is capable of heating source material mist under precise temperature management and thereby able to acquire a gas source material which can be adjusted to a prescribed temperature and which has a very low level of variation in temperature and that produces almost no precipitate. The vaporizer heats and vaporizes a source material mist to obtain a gas source material for film forming.

Abstract: A method for manufacturing a semiconductor device includes obtaining a shear stress FT at which that a value obtained by dividing a loss elastic modulus by a storage elastic modulus equals 1 for each of a plurality of candidate heat conductive greases at each of a plurality of temperatures that are within a prescribed control temperature range determined based on an operation temperature range of the semiconductor device to be manufactured; selecting a heat conductive grease, among the plurality of candidate heat conductive greases, that has a value of FT of 100 Pa or more and 200 Pa or less at each of the plurality of the temperatures within the prescribed control temperature range; and attaching a resin sealed body that includes a semiconductor element mounted on a laminated substrate therein to a cooler via the heat conductive grease that has been selected in the selecting.

Abstract: There is provided an ethyleneimine polymer (solution) capable of expressing excellent properties when used in such usages as, for example, coagulants for wastewater, papermaking chemicals such as freeness improvers and the like, enzyme immobilization agents, and adhesion improvers (for example, adhesion promoters for extrusion laminate (anchor coating agent)). To solve the above object, there is provided an ethyleneimine polymer solution including an ethyleneimine polymer and water, wherein a weight average molecular weight (Mw) of the ethyleneimine polymer is 200,000 or more, the weight average molecular weight (Mw) being measured based on pullulan by gel permeation chromatography (GPC), and a ratio of a component having a weight average molecular weight (Mw) of 30,000 or more is 60 mass % or more with respect to 100 mass % of a total amount of the ethyleneimine polymer.

Abstract: A solder alloy has an alloy composition consisting of, in mass%, Cu: 0.1% to 2.0%, Ni: 0.01% to 0.4%, P: 0.001% to 0.08%, and Ge: 0.001% to 0.08%, with the balance being Sn. The alloy composition satisfies the following relations (1) to (3): (Cu+5Ni)?0.945% (relation (1)), (P+Ge)?0.15% (relation (2)), 2.0?(Cu+5Ni)/(P+Ge)?1000 (relation (3)). In the above relations (1) to (3), Cu, Ni, P, and Ge each represents a content (mass %) thereof in the solder alloy.

Abstract: A method for manufacturing a rubber-reinforced styrenic resin powder comprising 40% by mass or more of a rubbery polymer, satisfying the following conditions (1) to (4): (1) at least first and second coagulation baths are provided; (2) the first and second coagulation baths are connected; (3) an emulsified dispersion of fatty acid amide is supplied to the connecting part in an amount of 0.2 parts by mass to 2.0 parts by mass (solid content) with respect to 100 parts by mass (solid content) of a slurry; and (4) a temperature in the second coagulation bath is equal to or higher than a temperature in the first coagulation bath.

Abstract: Disclosed is an isolated monoclonal antibody against a human Transforming Growth Factor-? (TGF-?) Latency Associated Protein (LAP) degradate, the isolated monoclonal antibody being capable of recognizing an integrin binding site in the human TGF-? LAP degradate.

Abstract: A soldering alloy includes an alloy composition consisting of 13-22 mass % of In, 0.5-2.8 mass % of Ag, 0.5-5.0 mass % of Bi, 0.002-0.05 mass % of Ni, and a balance Sn. A soldering alloy, a soldering paste, a preform solder, a soldering ball, a wire solder, a resin flux cored solder and a solder joint, each of which is composed of the soldering alloy. An electronic circuit board and a multi-layer electronic circuit board joined by using the solder joint.

Abstract: A solder alloy has an alloy composition consisting of, in mass %, Ag: 0 to 4%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.3%, Sb: 5.1 to 7.5%, Bi: 0.1 to 4.5%, Co: 0.001 to 0.3%, P: 0.001 to 0.2%, and the balance being Sn.

Abstract: An ink jet recording method for recording an image uses an ink jet recording apparatus that includes an aqueous ink, a first ink storage portion that stores the aqueous ink, a second ink storage portion that stores the aqueous ink without impregnating it into an absorbent, and a recording head. The second ink storage portion and the recording head compose therein an ink flow path through which the aqueous ink is supplied, a filter that partitions an upstream side and a downstream side of the ink flow path is arranged, and a ratio (A/B) of volume A (mL) of the ink flow path to the upstream side and volume B (mL) of the ink flow path on the downstream side is 5 or more, the aqueous ink contains a coloring material, a nonionic surfactant, and a first water-soluble organic solvent having a relative dielectric constant of 30.0 or less.

Abstract: Provided is an ink jet recording method capable of recording an image with a tertiary color, less causing color shift even with use of a recording apparatus having an ink inlet port. The ink jet recording method includes recording an image, with use of an ink jet recording apparatus that includes a plurality of aqueous inks; an ink storage portion that independently stores the aqueous inks; a recording head having formed therein an ejection orifice through which each aqueous ink is ejected; and a tube through which each aqueous ink is supplied from the ink storage portion to the recording head. The ink storage portion has provided thereto an inlet port through which the aqueous ink is filled, the tube is formed of a resin material, a cyan ink contains a phthalocyanine pigment, and both of a yellow ink and a magenta ink individually contain an azo pigment.

Abstract: An EUV light generation apparatus includes: a chamber; an EUV light condensing mirror positioned inside the chamber and having a reflective surface that determines a first focal point and a second focal point, the reflective surface and the second focal point being positioned on respective sides of a first surface; at least one magnet configured to generate a magnetic field at and around the first focal point; a first gas supply unit configured to supply first gas to the reflective surface in the chamber and opened near an outer peripheral part of the reflective surface; a second gas supply unit configured to supply second gas into the chamber and opened at a position between the first surface and the second focal point; and a discharge device configured to discharge gas inside the chamber and opened at a position between the first focal point and the at least one magnet.

Abstract: The present invention provides an antibody specific to IgE antibody-producing B cells or an antibody binding fragment thereof. More specifically, the present invention provides an isolated monoclonal antibody or an antigen binding fragment thereof that binds to a peptide having a sequence consisting of an amino acid sequence set forth in SEQ ID NO: 1 or 18, and (1) binds to IgE antibody on a B cell surface and/or (2) binds to IgE antibody heated at 56° C.

Abstract: A solder alloy has an alloy composition consisting of, in mass %, Ag: from 3.2 to 3.8%, Cu: from 0.6 to 0.8%, Ni: from 0.01 to 0.2%, Sb: from 2 to 5.5%, Bi: from 1.5 to 5.5%, Co: from 0.001 to 0.1%, Ge: from 0.001 to 0.1%, and optionally at least one of Mg, Ti, Cr, Mn, Fe, Ga, Zr, Nb, Pd, Pt, Au, La and Ce: 0.1% or less in total, with the balance being Sn. The alloy composition satisfies the following relationship (1): 2.93?{(Ge/Sn)+(Bi/Ge)}×(Bi/Sn) (1). In the relationship (1), each of Sn, Ge, and Bi represents the content (mass %) in the alloy composition.

Abstract: A heat transport device comprises first flow passages through which a first fluid flows, and second flow passages through which a second fluid flows, wherein a cross-section A satisfying the following Requirement 1 to Requirement 3 can be achieved. Requirement 1 is that the cross-section A is a cross-section perpendicular to the second flow passages. Requirement 2 is that in the cross-section A, the holes of second flow passages are separated by meandering partition plates and are disposed in a layered manner. Two adjacent partition plates are a partition plate B and a partition plate C, and when comparing a point ?, which is the top point of a mountain in the partition plate B closest to the partition plate C, and a point ?, which is the bottom point of a valley in the partition plate C closest to the partition plate B, the point ? is closer to the partition plate C side than the point ?. Requirement 3 is that the first flow passages are present inside the partition plates.

Abstract: A heat transport device comprises first flow passages through which a first fluid flows, and second flow passages through which a second fluid flows, wherein a cross-section A satisfying the following Requirement 1 to Requirement 3 can be achieved. Requirement 1 is that the cross-section A is a cross-section perpendicular to the second flow passages. Requirement 2 is that the holes of the second flow passages are disposed so as to be aligned in the left-right direction and to form layers in the up-down direction; and when comparing layers with holes adjacent in the up-down direction, the holes of the second flow passages are not disposed at the same position in the left-right direction. Requirement 3 is that the first flow passages exist between the layers with holes adjacent in the up-down direction, and the first flow passages meander in the up-down direction so as to avoid the holes of the second flow passages in the layers with holes that are sandwiched in the up-down direction.

Abstract: A copper-based alloy which includes Cu, Ni, Si, Fe, and Mg, and at least one selected from the group consisting of Mo, W, and V, and in which a content of Mg is 0.02 mass % or more. The copper-based alloy exhibits wear resistance and improved weldability with respect to a substrate.

Abstract: An endoscope apparatus including a connector included in an endoscope and connected to an endoscope connection portion of a video processor, a fluid feeding apparatus including a tube configured to transmit fluid to the endoscope, a connection detector configured to detect a connection state of the tube with the connector of the endoscope, a control unit configured to detect an ON/OFF state of a power source of the fluid feeding apparatus, determine an abnormality exists when the connection detector detects that the tube is in a disconnected state with the connector of the endoscope and the power source of the fluid feeding apparatus is detected to be in an ON state, and output a notification of the determined abnormality, and a display configured to display the notification of the abnormality outputted by the control unit.

Abstract: A water repellent product includes a water repellent fabric in which a non-fluorine-based water repellent agent is applied to a fabric formed of a fiber; and a resin component attached to the water repellent fabric. The water repellent product contains substantially no cross-linking agent for chemically bonding the non-fluorine-based water repellent agent and the fiber.

Abstract: A method and a system for measuring the thermal stability factor of a magnetic tunnel junction device, a semiconductor integrated circuit, and a production management method for the semiconductor integrated circuit, capable of measuring the thermal stability factors of individual devices in a relatively short period of time and quickly performing quality control during material development and at a production site. A meter measures change in resistance value of an evaluation MTJ for a predetermined period while causing a predetermined current to flow into the evaluation MTJ maintained at a predetermined temperature. An analyzer calculates a time constant in which a low-resistance state is maintained and a time constant in which a high-resistance state is maintained from the measured change in resistance value. A thermal stability factor of the evaluation MTJ is calculated on the basis of the calculated time constants and the predetermined current flowing into the evaluation MTJ.

Abstract: A method for manufacturing a fastener stringer according to the present invention, include a dyeing step for dyeing a fastener stringer including an element row fixed to a side edge portion of a tape made of fiber, a dye cleaning step for removing excess dye from the fastener stringer, a water repellent treatment step for adhering a non-fluorine-based water repellent agent to the fastener stringer, and a pre-dyeing degreasing step for degreasing oil and fat adhered to the fastener stringer by a wet process.