Abstract: A technique for reducing cooling time for a substrate includes a substrate processing apparatus that may include: a substrate retainer configured to support a substrate; a heat-insulating unit; a transfer chamber; and a gas supply mechanism to supply a gas into the transfer chamber, the gas supply mechanism including: a first gas supply mechanism to supply the gas into an upper region of the transfer chamber. The substrate retainer is disposed such that the gas flows horizontally through the upper region; and a second gas supply mechanism to supply the gas into a lower region of the transfer chamber. The heat-insulating unit is provided such that the gas flows downward through the lower region. The first gas supply mechanism and the second gas supply mechanism are disposed along a first sidewall of the transfer chamber, and the second gas supply mechanism is disposed lower than the first gas supply mechanism.

Abstract: A discharge device according to the present disclosure includes a discharge electrode and a voltage applicator that applies a voltage to the discharge electrode and thus causes discharge that is further developed from corona discharge at the discharge electrode. The discharge is discharge in which a discharge path is intermittently formed by dielectric breakdown so as to stretch from the discharge electrode to a surrounding. This discharge can be called leader discharge. This makes it possible to increase an amount of generated active component while keeping an increase of ozone small.

Abstract: An information processing apparatus that processes information related to a rental of a battery, includes: a first acquisition unit configured to acquire performance degradation information before the rental of the battery; a second acquisition unit configured to acquire performance degradation information after the rental of the battery; and a decision unit configured to decide a treatment for a rental user of the battery, based on the performance degradation information that is acquired by the first acquisition unit and the performance degradation information that is acquired by the second acquisition unit.

Abstract: There is provided a technique that includes: a first processing module including a first process container in which at least one substrate is processed, a first utility system including a first supply system which supplies a first processing gas into the first process container and a surface of the first utility system is connected or arranged close to the first processing module; and a first vacuum pump arranged at the same level as a first exhaust port of the first process container. The first vacuum pump exhausts an inside of the first process container and includes a first intake port formed laterally at a position substantially facing the first exhaust port of the first process container. A first exhaust pipe configured to substantially linearly bring the first exhaust port into fluid communication with the first intake port and including a first valve installed in a flow path.

Abstract: A substrate processing apparatus includes: a substrate retainer configured to support a substrate; a heat-insulating unit; a transfer chamber; and a gas supply mechanism configured to supply a gas into the transfer chamber, the gas supply mechanism including: a first gas supply mechanism configured to supply the gas into an upper region of the transfer chamber, where the substrate retainer is disposed such that the gas flows horizontally through the upper region; and a second gas supply mechanism configured to supply the gas into a lower region of the transfer chamber, where the heat-insulating unit is provided such that the gas flows downward through the lower region, wherein the first gas supply mechanism and the second gas supply mechanism are disposed along a first sidewall of the transfer chamber, and the second gas supply mechanism is disposed lower than the first gas supply mechanism.

Abstract: Provided is a technique in which a heating-up time inside a process chamber is reduced. The technique includes a substrate processing apparatus including a process chamber where a substrate is processed, a substrate retainer configured to support the substrate in the process chamber, a process gas supply unit configured to supply a process gas into the process chamber, a first heater installed outside the process chamber and configured to heat an inside of the process chamber, a thermal insulating unit disposed under the substrate retainer, a second heater disposed in the thermal insulating unit and configured to heat the inside of the process chamber, and a purge gas supply unit configured to supply a purge gas into the thermal insulating unit to purge an inside of the thermal insulating unit.

Abstract: An electric discharge device according to the present disclosure includes a discharge electrode, a counter electrode, a voltage application circuit, and a liquid supply unit. The discharge electrode is a columnar electrode. The counter electrode faces the discharge electrode. The voltage application circuit applies an application voltage between the discharge electrode and the counter electrode. The liquid supply unit supplies liquid to the discharge electrode. The liquid extends and contracts along a central axis of the discharge electrode by discharge. The counter electrode includes a peripheral electrode part and a projecting electrode part. In a direction along the central axis of the discharge electrode, a tip of the liquid in a state in which the liquid extends is located at the same position as an outer peripheral edge of the peripheral electrode part or located closer to the discharge electrode than the outer peripheral edge.

Abstract: There is provided a technique that includes: a first processing module including a first process container in which at least one substrate is processed and a substrate loading port installed at a front side of the first processing module; a first utility system including a first supply system configured to supply a first processing gas into the first process container, a surface of the first utility system is connected or arranged close to a rear surface of the first processing module; and a first vacuum-exhauster arranged behind the first processing module and configured to exhaust an inside of the first process container, wherein the first vacuum-exhauster includes an outer side surface configured such that the outer side surface does not protrude more outward than an outer side surface of the first utility system.

Abstract: A vehicle control device controls a vehicle including a drive motor connected to a rotation shaft of wheels, a battery that supplies electricity to the drive motor, and an internal combustion engine connected to the drive motor. The vehicle is equipped with, as traveling modes, a normal mode, and an eco-mode having a larger regenerative braking force than the normal mode obtained such that rotational energy of the wheels is converted into electrical energy. A controller stops the internal combustion engine and switches from the normal mode to the eco-mode when detecting at least an abnormality in the internal combustion engine during traveling of the vehicle.

Abstract: A control system for a quay crane a mounting platform position acquisition device, a land-side position acquisition device, a transportation vehicle position acquisition device, and a control device. The control system 30 is configured such that, when the control device predicts that a standby time will occur for a land-side cargo handling device based on a vehicle stop position, a current position of a relay mounting platform, a current position of the land-side cargo handling device, and a current position of an in-terminal transportation vehicle, the control device performs control that moves the relay mounting platform to a relay position which equalizes an actual land-side cycle time for the land-side cargo handling device including the standby time and a sea-side cycle time for a sea-side cargo handling device with each other.

Abstract: One aspect of an invention is a power receiving apparatus, configured to be able to receive electric power from a plurality of battery units each including a processor configured to control a power feeding function, the power receiving apparatus comprising a plurality of connection portions capable of electrically connecting the plurality of battery units, wherein the plurality of connection portions are configured such that voltages supplied to the plurality of processors of the plurality of battery units have different values when the plurality of battery units are electrically connected to the connection portions

Abstract: Provided is a technique in which a heating-up time inside a process chamber is reduced. The technique includes a substrate processing apparatus including a process chamber where a substrate is processed, a substrate retainer configured to support the substrate in the process chamber, a process gas supply unit configured to supply a process gas into the process chamber, a first heater installed outside the process chamber and configured to heat an inside of the process chamber, a thermal insulating unit disposed under the substrate retainer, a second heater disposed in the thermal insulating unit and configured to heat the inside of the process chamber, and a purge gas supply unit configured to supply a purge gas into the thermal insulating unit to purge an inside of the thermal insulating unit.

Abstract: There is provided a substrate processing apparatus including: a transfer region communicating with a process chamber where substrates are processed; a first shelf region installed above the transfer region and having a first shelf storing transfer vessels accommodating the substrates; a second shelf region installed below a stage part where the vessels to be transferred to and from an external device are loaded, and having a second shelf stacking and storing the transfer vessels; and a transfer vessel transfer robot installed inside a housing accommodating the transfer region, the first shelf region and the second shelf region and transferring the vessels to and from the stage part, the first shelf, the second shelf, and the transfer region. The transfer vessel transfer robot includes: a main body base part; a first table part; a first driving part; a second table part; a second driving part; and a vessel support part.

Abstract: Provided is a technique capable of purging a adiabatic region without adversely affecting a processing region. A process chamber including a processing region for processing a substrate and a adiabatic region located below the processing region is included inside. A first exhaust portion for discharging an atmosphere of the processing region, and a second exhaust portion for discharging an atmosphere of the adiabatic region, formed at a position overlapping with the adiabatic region in a height direction, are included.

Abstract: There is provided a technique that includes: a first processing module including a first process container in which at least one substrate is processed and a substrate loading port installed at a front side of the first processing module; a first utility system including a first supply system configured to supply a first processing gas into the first process container, a surface of the first utility system is connected or arranged close to a rear surface of the first processing module; and a first vacuum-exhauster arranged behind the first processing module and configured to exhaust an inside of the first process container, wherein the first vacuum-exhauster includes an outer side surface configured such that the outer side surface does not protrude more outward than an outer side surface of the first utility system.

Abstract: A substrate processing apparatus including a transfer chamber; upper gas supply mechanism that supplies a gas into an upper region of the transfer chamber through a first gas supply port; and lower gas supply mechanism that supplies the gas into a lower region of the transfer chamber through a second gas supply port. The upper gas supply mechanism includes a first buffer chamber disposed at a back surface of the first gas supply port; a pair of upper ducts disposed at both sides of the first buffer chamber; and a first ventilation unit disposed at lower ends of the pair of upper ducts. The lower gas supply mechanism includes a second buffer chamber disposed at a back surface of the second gas supply port; a lower duct disposed at lower surface of the second buffer chamber; and a second ventilation unit disposed at a lower end of the lower duct.

Abstract: A voltage application device includes a voltage application circuit. The voltage application circuit applies application voltage between discharge electrode and counter electrode which face each other with a clearance left from each other to generate a discharge. The voltage application device forms discharge path partially and dielectrically broken between discharge electrode and counter electrode when a discharge is generated. Discharge path includes first dielectric breakdown region formed around discharge electrode, and second dielectric breakdown region formed around counter electrode.

Abstract: A substrate processing apparatus including a transfer chamber; upper gas supply mechanism that supplies a gas into an upper region of the transfer chamber through a first gas supply port; and lower gas supply mechanism that supplies the gas into a lower region of the transfer chamber through a second gas supply port. The upper gas supply mechanism includes a first buffer chamber disposed at a back surface of the first gas supply port; a pair of upper ducts disposed at both sides of the first buffer chamber; and a first ventilation unit disposed at lower ends of the pair of upper ducts. The lower gas supply mechanism includes a second buffer chamber disposed at a back surface of the second gas supply port; a lower duct disposed at lower surface of the second buffer chamber; and a second ventilation unit disposed at a lower end of the lower duct.

Abstract: A substrate processing apparatus includes: a substrate holding member configured to hold a plurality of substrates; a reaction tube configured to accommodate the substrate holding member and process the substrates; a processing gas supply system configured to supply a processing gas into the reaction tube; and an exhaust system configured to exhaust an internal atmosphere of the reaction tube. The reaction tube includes: a cylindrical portion; a gas supply area formed outside one side wall of the cylindrical portion and connected to the processing gas supply system; and a gas exhaust area formed outside the other side wall of the cylindrical portion opposed to the gas supply area and connected to the exhaust system. Each of the gas supply area and the gas exhaust area has an inner wall which partitions the interior of each of the gas supply area and the gas exhaust area into a plurality of spaces.