Patents by Inventor Takeshi Yasui

Takeshi Yasui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210010557
    Abstract: The valve includes a valve case; an annular valve body, an outer peripheral end of which is a free end movable to both sides in an axial direction with respect to the valve case; a facing portion provided in the valve case, the facing portion including an annular facing surface which is located on an outer peripheral side of the valve body and is configured to face the free end with a gap; and first and second valve stoppers which are located on both sides respectively in the axial direction of the valve body. The first and second valve stoppers, respectively, have a plurality of support portions that are configured to support different positions of the valve body in a radial direction at different heights when the valve body deflects.
    Type: Application
    Filed: April 2, 2019
    Publication date: January 14, 2021
    Applicant: KYB Corporation
    Inventors: Kazuyuki KIMISHIMA, Takeshi YASUI
  • Publication number: 20200402774
    Abstract: Described herein is a technique capable of suppressing sputtering on an inner peripheral surface of a process vessel when a process gas is plasma-excited in the process vessel. According to one aspect thereof, a substrate processing apparatus includes: a process vessel accommodating a process chamber where a process gas is excited into plasma; a gas supplier supplying the process gas into the process chamber; a coil wound around an outer peripheral surface of the process vessel and spaced apart therefrom, wherein a high frequency power is supplied to the coil; and an electrostatic shield disposed between the outer peripheral surface and the coil, wherein the electrostatic shield includes: a partition extending in a circumferential direction to partition between a part of the coil and the outer peripheral surface; and an opening extending in the circumferential direction and opened between another part of the coil and the outer peripheral surface.
    Type: Application
    Filed: September 8, 2020
    Publication date: December 24, 2020
    Inventors: Takeshi YASUI, Katsunori FUNAKI, Yasutoshi TSUBOTA, Koichiro HARADA
  • Patent number: 10837906
    Abstract: According to the present invention, a measurement device includes a light emitting part configured to emit a plurality of spectral lights each including two or more spectra distributed at mutually different frequencies by causing adjacent frequency intervals to be different from each other, a focusing part configured to focus light by causing two or more spectra to overlap in an overlapping region in each of a plurality of different focal point regions of a sample and to be shifted from each other, and a detecting part configured to acquire a signal of fluorescence beats which emits light by interference light beats in each of a plurality of overlapping regions in the sample and includes information of the sample.
    Type: Grant
    Filed: August 9, 2018
    Date of Patent: November 17, 2020
    Assignee: JAPAN SCIENCE AND TECHNOLOGY AGENCY
    Inventors: Takeshi Yasui, Tetsuo Iwata, Yasuhiro Mizutani, Takeo Minamikawa, Takahiko Mizuno, Eiji Hase, Hirotsugu Yamamoto
  • Patent number: 10830685
    Abstract: Provided is a device for electrical measurement designed to be able to perform high sensitivity detection by reading not only changes in steady-state current, but also the occurrence of transient current, and an electrical measurement apparatus including the device for electrical measurement. The device for electrical measurement includes a substrate on which are formed at least a sample separation channel and a sample migration channel, as well as a sample measuring unit, with one end of the sample separation channel formed to connect to one end of the sample migration channel, and the sample measuring unit including a first measuring unit connected to the sample migration channel, and a second measuring unit connected to the sample migration channel from the reverse side to the first measuring unit.
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: November 10, 2020
    Assignee: NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY
    Inventors: Yoshinobu Baba, Noritada Kaji, Takao Yasui, Tomoji Kawai, Takeshi Yanagida
  • Patent number: 10822684
    Abstract: A hot-dip galvanized steel sheet includes a base steel sheet and a hot-dip galvanized layer formed on at least one surface of the base steel sheet, in which the hot-dip galvanized layer includes Fe in a content of more than 0% to 5% or less, Al in a content of more than 0% to 1.0% or less, and columnar grains formed by a ? phase on the surface of the steel sheet, further, 20% or more of the entire interface between the hot-dip galvanized layer and the base steel sheet is coated with the ? phase, and a ratio of an interface formed between ? grains in which coarse oxides are present among ? grains and the base steel sheet with respect to the entire interface between the ? phase and the base steel sheet in the hot-dip galvanized layer is 50% or less, the base steel sheet has predetermined chemical components and a refined layer in direct contact with the interface between the base steel sheet and the hot-dip galvanized layer, an average thickness of the refined layer is 0.1 to 5.
    Type: Grant
    Filed: November 5, 2015
    Date of Patent: November 3, 2020
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Hiroyuki Kawata, Takeshi Yasui, Kohei Ueda, Naoki Maruyama, Yuji Yamaguchi, Satoshi Uchida, Ryosuke Komami, Hayato Arai, Toyomitsu Nakamura
  • Patent number: 10822683
    Abstract: A hot-dip galvanized steel sheet includes a base steel sheet and a hot-dip galvanized layer formed on at least one surface of the base steel sheet, in which the hot-dip galvanized layer includes Fe in a content of more than 0% to 5% or less, Al in a content of more than 0% to 1.0% or less, and columnar grains formed by a ? phase on the surface of the steel sheet, further, 20% or more of the entire interface between the hot-dip galvanized layer and the base steel sheet is coated with the ? phase, and a ratio of an interface formed between ? grains in which coarse oxides are present among grains and the base steel sheet with respect to the entire interface between the ? phase and the base steel sheet in the hot-dip galvanized layer is 50% or less, the base steel sheet has predetermined chemical components and a refined layer in direct contact with the interface between the base steel sheet and the hot-dip galvanized layer, an average thickness of the refined layer is 0.1 to 5.
    Type: Grant
    Filed: November 5, 2015
    Date of Patent: November 3, 2020
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Hiroyuki Kawata, Takeshi Yasui, Kohei Ueda, Naoki Maruyama, Yuji Yamaguchi, Satoshi Uchida, Ryosuke Komami, Hayato Arai, Toyomitsu Nakamura
  • Publication number: 20200256417
    Abstract: A valve includes: a valve case; and an annular valve body, one of the inner circumference end and the outer circumference end of the valve body being formed as the free end capable of moving towards both sides in the axial direction with respect to the valve case. The valve case has the annular opposing surface capable of opposing to the free end so as to form the gap therebetween, and the guide surface that is positioned on one side of the opposing surface in the axial direction, the guide surface being continuous with the part of the opposing surface in the circumferential direction. The guide surface is inclined in the direction away from the valve body as the distance from the opposing surface is increased.
    Type: Application
    Filed: December 12, 2018
    Publication date: August 13, 2020
    Applicant: KYB Corporation
    Inventors: Kazuyuki KIMISHIMA, Tomohiko BABA, Takeshi YASUI
  • Publication number: 20200219699
    Abstract: There is provided a plasma vessel in which a process gas is plasma-excited; a substrate process chamber which is in communication with the plasma vessel; a gas supply system supplying the process gas; and a coil installed to wind around an outer periphery of the plasma vessel and supplied with high-frequency power, wherein the coil is installed such that: a distance from an inner periphery of the coil to an inner periphery of the plasma vessel at a predetermined position on the coil is different from a distance from the inner periphery of the coil to the inner periphery of the plasma vessel at another position on the coil; and a distance from the inner periphery of the coil to the inner periphery of the plasma vessel at a position at which an amplitude of a standing wave of a voltage applied to the coil is maximized is maximized.
    Type: Application
    Filed: March 17, 2020
    Publication date: July 9, 2020
    Applicant: KOKUSAI ELECTRIC CORPORATION
    Inventors: Takeshi YASUI, Katsunori FUNAKI, Masaki MUROBAYASHI, Koichiro HARADA
  • Patent number: 10704132
    Abstract: A high-strength hot-dip galvanized steel sheet excellent in impact resistance and worked portion corrosion resistance including a hot-dip galvanized plating layer on a steel sheet base material whose tensile strength is 590 MPa or more, wherein the plating layer includes projecting alloy layers being in contact with the steel sheet base material, a number density of the projecting alloy layers is 4 pieces/mm or more, wherein the steel sheet base material includes: a miniaturized layer being directly in contact with the interface between the steel sheet base material and the plating layer; a decarburized layer being in contact with the miniaturized layer; and an inner layer other than the miniaturized layer and the decarburized layer, and one or more kinds of oxides of Si and Mn are contained in layers of the miniaturized layer, the decarburized layer, and the projecting alloy layers.
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: July 7, 2020
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Takeshi Yasui, Hiroyuki Kawata, Yuji Yamaguchi, Ryosuke Komami, Satoshi Uchida, Akinobu Murasato
  • Publication number: 20200206850
    Abstract: A heat treatment method is provided in which a first steel component (11) formed with a coating (111) thereon is fitted in first holes (123, 124) of a second steel component (12) subjected to a quenching treatment. The heat treatment method includes a heating step of heating the second steel component to a first temperature (T1) equal to or higher than a tempering temperature (T0) of the second steel component and higher than a temperature of the first steel component by a temperature difference (?T) for achieving shrink fitting and a shrink-fitting step of shrink-fitting the first steel component in the first holes of the second steel component in a state of maintaining the temperature difference for achieving shrink fitting between the first steel component and the second steel component.
    Type: Application
    Filed: March 6, 2020
    Publication date: July 2, 2020
    Applicant: NISSAN MOTOR CO., LTD.
    Inventors: Tsuyoshi Sugimoto, Ryosuke Hiraishi, Kenji Yasui, Yukichi Okayama, Kei Tanaka, Takeshi Oshio
  • Patent number: 10701850
    Abstract: When a multiple-board printed panel is defined as a panel with multiple boards of electronic circuit board patterns on which multiple electronic components are to be mounted, a work order is set such that electronic components to be held by multiple component holding tools together in one go are electronic components planned to be mounted on one circuit pattern among the multiple circuit patterns. In a case in which one of the electronic circuit board patterns of the multiple electronic circuit board patterns is a defective circuit pattern, because it is not necessary to hold electronic components planned to be mounted on that defective electronic circuit pattern, it is possible to eliminate a back and forth movement between the defective circuit pattern and a supply device of the electronic components, thereby improving throughput when performing mounting work on a multiple-board substrate that includes a defective circuit pattern.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: June 30, 2020
    Assignee: FUJI CORPORATION
    Inventors: Yoshihiro Yasui, Hiroyuki Aou, Takeshi Shibabuki
  • Publication number: 20200166457
    Abstract: According to the present invention, a measurement device includes a light emitting part configured to emit a plurality of spectral lights each including two or more spectra distributed at mutually different frequencies by causing adjacent frequency intervals to be different from each other, a focusing part configured to focus light by causing two or more spectra to overlap in an overlapping region in each of a plurality of different focal point regions of a sample and to be shifted from each other, and a detecting part configured to acquire a signal of fluorescence beats which emits light by interference light beats in each of a plurality of overlapping regions in the sample and includes information of the sample.
    Type: Application
    Filed: August 9, 2018
    Publication date: May 28, 2020
    Inventors: Takeshi YASUI, Tetsuo IWATA, Yasuhiro MIZUTANI, Takeo MINAMIKAWA, Takahiko MIZUNO, Eiji HASE, Hirotsugu YAMAMOTO
  • Patent number: 10665516
    Abstract: The present invention relates to an etching method including a reaction layer forming step of forming a reaction layer by adsorption of a gas on a surface of an etching target material, a desorption step of desorbing the reaction layer after the reaction layer forming step, and a removal step of removing the reaction layer or a deposited film, characterized in that the surface of the etching target material is etched by the reaction layer forming step and the desorption step.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: May 26, 2020
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Miyako Matsui, Kenichi Kuwahara, Naoki Yasui, Masaru Izawa, Tatehito Usui, Takeshi Ohmori
  • Patent number: 10658898
    Abstract: A method for manufacturing a neutral ring includes connecting a cut-off neutral ring to an arc-shaped connection element. The method also includes filling an insulator between the cut-off neutral ring and a connection element. The neutral ring shunts the rotor coil in three phases.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: May 19, 2020
    Assignee: Hitachi Industrial Products, Ltd.
    Inventors: Yasushi Hayasaka, Masanori Matsumoto, Yasunori Otsuki, Tetsuo Fujigaki, Yoshihiro Yasui, Motonobu Iizuka, Masaaki Endou, Atsushi Fukunaga, Takeshi Nakayama
  • Patent number: 10622269
    Abstract: The present invention relates to an etching method including a reaction layer forming step of forming a reaction layer by adsorption of a gas on a surface of an etching target material, a desorption step of desorbing the reaction layer after the reaction layer forming step, and a removal step of removing the reaction layer or a deposited film, characterized in that the surface of the etching target material is etched by the reaction layer forming step and the desorption step.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: April 14, 2020
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Miyako Matsui, Kenichi Kuwahara, Naoki Yasui, Masaru Izawa, Tatehito Usui, Takeshi Ohmori
  • Patent number: 10570568
    Abstract: An all-purpose type tissue paper. A two-ply tissue paper that does not have moisturizer applied thereon, that has a basis weight per ply of 10.0-16.0 g/m2, a paper thickness per two-ply of 120-200 ?m, a softness of not more than 1.0, a dry tensile strength (T) in the MD direction of 240-300 cN/25 mm, and an average dynamic friction coefficient of 1.40-1.65.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: February 25, 2020
    Assignees: DAIO PAPER CORPPORATION, TOHOKU UNIVERSITY
    Inventors: Shuta Yasui, Norimitsu Hirata, Hidenori Yorozu, Kazuo Hokkirigawa, Takeshi Yamaguchi, Kei Shibata, Wataru Tanabe, Shohei Matsumura
  • Publication number: 20200033248
    Abstract: In a method for analyzing samples involving the use of a device for analyzing samples, the device for analyzing samples includes at least a movement part through which a sample moves, and a measurement unit that is formed in a middle of the movement part and that measures a value of an ion current when the sample passes through the movement part. The analysis method includes at least a measurement step for measuring the value of the ion current when the sample passes through the movement part, and a determination step for determining a change over time in a quantity of ions from the value of the ion current measured in the measurement step. The quantity of ions includes a quantity of ions that have leaked from the sample during movement of the sample through the movement part.
    Type: Application
    Filed: October 4, 2017
    Publication date: January 30, 2020
    Inventors: Hirotoshi YASAKI, Takao YASUI, Noritada KAJI, Yoshinobu BABA, Tomoji KAWAI, Satoyuki KAWANO, Kentaro DOI, Takeshi YANAGIDA, Mao FUKUYAMA
  • Patent number: 10538068
    Abstract: In an embodiment, a process for producing a functional-substance thin film material for which a required heating temperature for finishing is 100-130° C. is characterized in that a PP film 2 is releasably laminated to a surface of a PET film 1 with a non-silicone adhesive layer 3 so that the strength of adhesion of the PP film 2 by the non-silicone adhesive layer 3 is regulated so as to prevent the PP film 2 from suffering thermal deformation when a functional substance superposed in a thin film form on the other surface of the PP film 2 is heated to 100-130° C. in order to finally convert the functional substance into a functional-substance thin film material 4.
    Type: Grant
    Filed: February 5, 2015
    Date of Patent: January 21, 2020
    Assignee: YASUI SEIKI CO., LTD.
    Inventors: Takeshi Chakihara, Shuichi Iwanaga, Hiroshi Mino, Hideyuki Yamamoto, Yoshinari Yasui
  • Patent number: 10507629
    Abstract: A hot-dip galvanized steel sheet wherein the hot-dip galvanized steel sheet comprises a base steel sheet and a hot-dip galvanized layer, a ferrite phase is, by volume fraction, 40% or more and 97% or less in a range of ? thickness to ? thickness centered at a position of ¼ thickness from the surface of the base steel sheet, a hard structure is 3% or more in total, wherein the hot-dip galvanized steel sheet has the hot-dip galvanized layer in which Fe is 5.0% or less and Al is 1.0% or less, and columnar grains formed of a ? phase is 20% or more in an entire interface between the plated layer and the base steel sheet on the surface of the base steel sheet in which a ratio of a volume fraction of the hard structure in a surface layer range of 20 ?m depth in a steel sheet direction from an interface between the hot-dip galvanized layer and the base steel sheet is 0.10 times or more to 0.
    Type: Grant
    Filed: November 5, 2015
    Date of Patent: December 17, 2019
    Assignee: NIPPON STEEL CORPORATION
    Inventors: Hiroyuki Kawata, Takeshi Yasui, Kohei Ueda, Naoki Maruyama, Yuji Yamaguchi, Satoshi Uchida, Ryosuke Komami, Hayato Arai, Yasuhiro Nakashima, Toyomitsu Nakamura
  • Patent number: 10435399
    Abstract: The present invention provides a heterocyclic compound having a HDAC inhibitory action, and useful for the treatment of central nervous system diseases including neurodegenerative disease, and the like, and a medicament comprising the compound. The present invention relates to a compound represented by the formula (I): wherein each symbol is as defined in the specification, or a salt thereof.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: October 8, 2019
    Assignee: Takeda Pharmaceutical Company Limited
    Inventors: Masahiro Ito, Hideyuki Sugiyama, Osamu Kubo, Fumiaki Kikuchi, Takeshi Yasui, Keiko Kakegawa, Zenichi Ikeda, Tohru Miyazaki, Yasuyoshi Arikawa, Tomohiro Okawa, Jinichi Yonemori, Akinori Toita, Takuto Kojima, Yasutomi Asano, Ayumu Sato, Hironobu Maezaki, Shinobu Sasaki, Hironori Kokubo, Misaki Homma, Minoru Sasaki, Yasuhiro Imaeda