Abstract: This disclosure relates to a low-resistance a multi-layer electrode and method of making a multi-layer electrode. Silicon is deposited on a substrate to form a top silicon layer. Nickel is deposited onto the top silicon layer to form a nickel layer. The substrate is annealed for a first time period and at a first temperature to form a di-nickel silicide layer with a remainder silicon layer between the di-nickel silicide layer and the substrate. Unreacted nickel of the nickel layer is removed to expose the di-nickel silicide layer. The substrate is annealed for a second time period and at a second temperature to form a nickel monosilicide layer from the di-nickel silicide layer and the remainder silicon layer such that the nickel monosilicide layer forms between a remainder di-nickel silicide layer and the substrate. The remainder di-nickel silicide layer and nickel monosilicide layer form a multi-layer electrode.

Abstract: A method is provided that includes forming a cell film stack on a substrate of a wafer, the cell film stack comprising a top silicon layer, depositing a sacrificial layer onto the top silicon layer, etching the cell film stack and the sacrificial layer to form a plurality of pillars, depositing a dielectric to fill in gaps between the plurality of pillars, planarizing the wafer to a predefined thickness for the sacrificial layer, removing the sacrificial layer, depositing nickel onto the wafer to form a nickel layer, annealing the wafer to form a di-nickel silicide layer between the nickel layer and the top silicon layer, wet etching unreacted nickel of the nickel layer to expose the di-nickel silicide layer, and annealing the wafer to form a nickel monosilicide layer from the di-nickel silicide layer and the top silicon layer, the nickel monosilicide layer forming a monosilicide electrode.

Abstract: A cross-point memory device includes first conductive line structures laterally extending along a first horizontal direction, an array of memory pillar structures overlying top surfaces of the first conductive line structures, such that each of the memory pillar structures includes a respective memory element, and second conductive line structures laterally extending along a second horizontal direction and overlying top surfaces of the array of memory pillar structures. At least one of the first conductive line structures and the second conductive line structures each includes a respective aluminum-containing rail and a respective metallic cap strip in contact with a top surface of the respective aluminum-containing rail.

Abstract: A cross-point memory device includes first conductive line structures laterally extending along a first horizontal direction, an array of memory pillar structures overlying top surfaces of the first conductive line structures, such that each of the memory pillar structures includes a respective memory element, and second conductive line structures laterally extending along a second horizontal direction and overlying top surfaces of the array of memory pillar structures. At least one of the first conductive line structures and the second conductive line structures each includes a respective aluminum-containing rail and a respective metallic cap strip in contact with a top surface of the respective aluminum-containing rail.

Abstract: A method is provided that includes forming a cell film stack on a substrate of a wafer, the cell film stack comprising a top silicon layer, depositing a sacrificial layer onto the top silicon layer, etching the cell film stack and the sacrificial layer to form a plurality of pillars, depositing a dielectric to fill in gaps between the plurality of pillars, planarizing the wafer to a predefined thickness for the sacrificial layer, removing the sacrificial layer, depositing nickel onto the wafer to form a nickel layer, annealing the wafer to form a di-nickel silicide layer between the nickel layer and the top silicon layer, wet etching unreacted nickel of the nickel layer to expose the di-nickel silicide layer, and annealing the wafer to form a nickel monosilicide layer from the di-nickel silicide layer and the top silicon layer, the nickel monosilicide layer forming a monosilicide electrode.

Abstract: This disclosure relates to a low-resistance a multi-layer electrode and method of making a multi-layer electrode. Silicon is deposited on a substrate to form a top silicon layer. Nickel is deposited onto the top silicon layer to form a nickel layer. The substrate is annealed for a first time period and at a first temperature to form a di-nickel silicide layer with a remainder silicon layer between the di-nickel silicide layer and the substrate. Unreacted nickel of the nickel layer is removed to expose the di-nickel silicide layer. The substrate is annealed for a second time period and at a second temperature to form a nickel monosilicide layer from the di-nickel silicide layer and the remainder silicon layer such that the nickel monosilicide layer forms between a remainder di-nickel silicide layer and the substrate. The remainder di-nickel silicide layer and nickel monosilicide layer form a multi-layer electrode.

Abstract: This disclosure relates to a low-resistance monosilicide electrode and method of making the monosilicide electrode. A cell film stack is first formed on a substrate of a wafer. The top layer of this cell film stack is silicon. The cell film stack is then etched to form at least one pillar. Dielectric is deposited to fill the gaps between the pillars. The wafer is then planarized to expose the top silicon layer. The exposed top silicon layer is converted into a nickel monosilicide layer by way of a thermal solid-state reaction between nickel and the silicon layer. This nickel monosilicide layer forms the monosilicide electrode.

Abstract: A resistive memory cell includes a barrier layer containing at least one of silicon and germanium, and a metal oxide layer including an oxide of a metal element that provides a reversible chemical reaction under a bidirectional electrical bias at an interface with the barrier material layer. The reversible chemical reaction is selected from a silicidation reaction between the barrier material layer and the metal element, a germanidation reaction between the barrier material layer and the metal element, oxidation of the metal element, and reduction of the metal element.

Abstract: A resistive memory cell includes a barrier layer containing at least one of silicon and germanium, and a metal oxide layer including an oxide of a metal element that provides a reversible chemical reaction under a bidirectional electrical bias at an interface with the barrier material layer. The reversible chemical reaction is selected from a silicidation reaction between the barrier material layer and the metal element, a germanidation reaction between the barrier material layer and the metal element, oxidation of the metal element, and reduction of the metal element.

Abstract: An alternating material stack of insulator lines and first electrically conductive material layers is formed over a substrate, and is patterned to provide alternating stacks of insulating layers and first electrically conductive lines. A metal can be selectively deposited on the physically exposed sidewalls of the first electrically conductive material layers to form metal lines, while not growing from the surfaces of the insulator lines. The metal lines are oxidized to form metal oxide lines that are self-aligned to the sidewalls of the first electrically conductive lines. Vertically extending second electrically conductive lines can be formed as a two-dimensional array of generally pillar-shaped structures between the alternating stacks of the insulator lines and the first electrically conductive lines. Each portion of the metal oxide lines at junctions of first and second electrically conductive lines constitute a resistive memory element for a resistive random access memory (ReRAM) device.

Abstract: A stack of layers is formed that includes first, second, and third dielectric layers. Contact plugs are then formed extending through the stack. Then a fourth dielectric layer is formed over the stack and contact plugs and trenches are formed through the fourth and third dielectric layers, extending to the second dielectric layer and exposing contact plugs.

Abstract: Isolation is provided by forming a first trench, depositing a cover layer on the bottom and sidewalls of the first trench, selectively removing the cover layer from the bottom and forming a second trench extending from the bottom of the first trench. The second trench is then substantially filled by thermal oxide formed by oxidation and the first trench is subsequently filled with a deposited dielectric.

Abstract: An initial etch forms a trench over first contact areas of a plurality of NAND strings, the initial etch also forming individual openings over second contact areas of the plurality of NAND strings. Material is added in the trench to reduce an area of exposed bottom surface of the trench while maintaining the individual openings without substantial reduction of bottom surface area. Subsequent further etching extends the trench and the plurality of individual openings.

Abstract: A wide trench having a width W1 and narrow trenches having a width W2 that is less than W1 are formed in a dielectric layer, the wide trench extending deeper in outer regions than in a central region. A trench modification step changes the width of the wide trench and reduces a depth difference between the outer regions and the central region of the wide trench.

Abstract: An alternating material stack of insulator lines and first electrically conductive material layers is formed over a substrate, and is patterned to provide alternating stacks of insulating layers and first electrically conductive lines. A metal can be selectively deposited on the physically exposed sidewalls of the first electrically conductive material layers to form metal lines, while not growing from the surfaces of the insulator lines. The metal lines are oxidized to form metal oxide lines that are self-aligned to the sidewalls of the first electrically conductive lines. Vertically extending second electrically conductive lines can be formed as a two-dimensional array of generally pillar-shaped structures between the alternating stacks of the insulator lines and the first electrically conductive lines. Each portion of the metal oxide lines at junctions of first and second electrically conductive lines constitute a resistive memory element for a resistive random access memory (ReRAM) device.

Abstract: A wide trench having a width W1 and narrow trenches having a width W2 that is less than W1 are formed in a dielectric layer, the wide trench extending deeper in outer regions than in a central region. A trench modification step changes the width of the wide trench and reduces a depth difference between the outer regions and the central region of the wide trench.

Abstract: A NAND flash memory includes active areas separated by STI structures in a substrate with a layer of a first dielectric over the substrate. Portions of a second dielectric extend over the STI structures and another layer of the first dielectric extends over both the layer and portions, with contact holes extending through the dielectric layers at locations over the active areas in the semiconductor substrate.

Abstract: An integrated circuit connection structure includes a contact plug extending vertically in a first dielectric, a conductive line formed of a metal extending horizontally in the first dielectric, and a contact plug extension that extends between a top surface of the contact plug and the conductive line. The plug extension is formed of the metal, has a bottom surface that lies in contact with the top surface of the contact plug, and is bounded on at least one side by a portion of a second dielectric material.

Abstract: Dummy bit lines of are formed in a sacrificial layer at locations where bit lines are to be formed, with bit lines separated by trenches that extend through the sacrificial layer. Enclosed air gap structures are formed in the trenches between the dummy bit lines. Subsequently, the dummy bit lines are replaced with metal to form bit lines.

Abstract: An initial etch forms a trench over first contact areas of a plurality of NAND strings, the initial etch also forming individual openings over second contact areas of the plurality of NAND strings. Material is added in the trench to reduce an area of exposed bottom surface of the trench while maintaining the individual openings without substantial reduction of bottom surface area. Subsequent further etching extends the trench and the plurality of individual openings.