Abstract: A semiconductor device according to the present invention includes a semiconductor chip having a functional surface formed with a functional element, an electrode pad provided directly on the functional element on the functional surface of the semiconductor chip, a protective resin layer laminated on the functional surface of the semiconductor chip, an external connection terminal provided on the protective resin layer in opposed relation to the electrode pad, and a post extending through the protective resin layer in a direction in which the electrode pad and the external connection terminal are opposed to each other for connection between the electrode pad and the external connection terminal.

Abstract: A semiconductor device (1, 1A, 21, 31, 41, 51) provided with a first semiconductor chip (3) having a first functional surface (3F) formed with a first functional element (3a), a protective resin layer (12) provided on the first functional surface, and an external connection terminal (10, 19, 52) provided on a peripheral portion of the first functional surface for external electrical connection, the external connection terminal having a bottom surface (10B, 19BB) exposed from a bottom surface (12B) of the protective resin layer facing away from the first functional surface and a side surface (10S, 19BS) exposed from a side surface (12S) of the protective resin layer.