Abstract: There is provided semiconductor devices and methods of forming the same, the semiconductor devices including: a first semiconductor element having a first electrode; a second semiconductor element having a second electrode; a Sn-based micro-solder bump formed on the second electrode; and a concave bump pad including the first electrode opposite to the micro-solder bump, where the first electrode is connected to the second electrode via the micro-solder bump and the concave bump pad.

Abstract: The present technology relates to a medical system, a communication method, an imaging device, an information processing device, and an endoscope system capable of stably transmitting sensor signals output from a sensor that obtains data in a living body by wireless communication. A medical system includes a sensor that is provided in or connected to an insertion part to be inserted into a living body via an insertion aid and obtains data in the living body, and a sensor communication unit that serves as a communication unit that transmits, by wireless communication, a first sensor signal output from the sensor to an aid communication unit that serves as a communication unit provided in the insertion aid. The present technology can be applied to, for example, an endoscope system.

Abstract: The present disclosure relates to a surgery support system, a display control device, and a display control method in which a plurality of images can be displayed in an easy-to-see and efficient manner. An information processing device generates a composite image by compositing images output from a plurality of electronic instruments including a medical instrument, and adds, to the composite image, metadata related to division of the composite image. The display control device controls a display device to display, in the virtual three-dimensional space, divided images obtained by dividing the composite image into a plurality of divided regions on the basis of the metadata. The present disclosure can be applied to an endoscopic surgical system, for example.

Abstract: An electric motor includes: a stator having a sleeve shape; a rotor inside the stator; a shaft coupled to the rotor and stretching along a central axis of the stator; a board case on one end side of the stator in a direction along the central axis; a circuit board on an opposite side of the stator with the board case interposed; a heat generating component on a mounting surface, which is opposite to a surface of the circuit board oriented to a side of the stator; a casing that covers a side of the mounting surface; and a heat transfer component between a surface of the casing that faces the circuit board and the heat generating component. The board case is provided with an extension portion that extends toward the circuit board. The heat transfer component is formed with a first engagement portion with which the extension portion engages.

Abstract: A method for producing (meth)acrolein by vapor-phase catalytic oxidation of propylene or isobutylene in a multitubular reactor including a plurality of reaction tubes, the reaction tubes each including a reaction zone filled with a catalyst including molybdenum oxide and a cooling zone filled with an inert substance, wherein a temperature of a heat medium that flows outside the cooling zone is lower than a temperature of a heat medium that flows outside the reaction zone, and wherein the inert substance includes an inert substance having a major-axis length that is equal to or more than 1.7 times a major-axis length of the catalyst. A method for producing (meth)acrylic acid in which (meth)acrolein thus produced is converted to (meth)acrylic acid by vapor-phase catalytic oxidation.

Abstract: The present technology is a surgical image display system, an image processing device, and an image processing method that enable to assist grasping of a distance in a depth direction in a space in which a stereoscopic image is reproduced when a three-dimensional image is stereoscopically viewed. An image of an observation region is shot from two different viewpoints, and a three-dimensional image that reproduces a stereoscopic image of the observation region is acquired. There is generated an output image that outputs the acquired three-dimensional image and depth distortion information that represents magnitude of distortion in a depth direction in a stereoscopic image space in which a stereoscopic image of the observation region is reproduced by stereoscopically viewing the three-dimensional image. The present technology can be applied to an operative field camera system for medical facilities that shoots an image of a field of view (operative field) of a surgical site.

Abstract: A radar device includes: a transmission unit; a reception unit; an interference signal processing unit that cancels an influence of an interference signal from a beat signal; and an object detection unit that detects the object based on the beat signal. The interference signal processing unit includes: a digital converter that converts the beat signal into a time sample; a multiple resolution analysis unit that converts the time sample into time-frequency plots; an interference plot detection unit that detects an interference plot; an interference cancellation unit that cancels the influence of the interference signal; and a reverse converter that reverse converts the time-frequency plots into the time sample. The object detection unit detects the object using the reversely converted time sample.

Abstract: The power conversion device includes: a boost, converter which includes a magnetically-coupled reactor and plurality of semiconductor switching elements connected to the magnetically-coupled reactor; an inverter; a cooler for cooling the magnetically-coupled reactor; a bus bar which is a conductive wiring member; and a current sensor for detecting a magnetic flux generated around the bus bar. The magnetically-coupled reactor includes a first winding, a second winding, and a core for magnetically coupling the first winding and the second winding. The core has a composite magnetic body containing soft magnetic powder and binder, and at least parts of the first winding and the second winding are embedded in the composite magnetic body. The cooler is provided in contact with the magnetically-coupled reactor. The current sensor is provided on a side opposite to the magnetically-coupled reactor with the cooler therebetween.

Abstract: A through-hole via penetrating, in a thickness direction, through a circuit board provided with multiple wiring layers in which a conductor pattern is formed on a surface of an insulating layer, wherein the through-hole via has a first through-hole conductor that is disposed inside a hole penetrating through the circuit board and that is formed from a conductor; a second through-hole conductor that is disposed inside the hole so as to be spaced, in a circumferential direction of the hole, from the first through-hole conductor; a first land portion that connects the first through-hole conductor to the conductor pattern on one insulating layer; and a second land portion that connects the first through-hole conductor with the second through-hole conductor on another insulating layer different from the one insulating layer.

Abstract: Even in a case where a pad becomes smaller, solder connection strength is improved. A semiconductor device includes a pad, a diffusion layer, and a melting layer. The pad included by the semiconductor device includes a concave portion on a surface at which solder connection is to be performed. The diffusion layer included by the semiconductor device is disposed at the concave portion and constituted with a metal which remains on the surface of the pad while diffusing into solder upon the solder connection. The melting layer included by the semiconductor device is disposed adjacent to the diffusion layer and constituted with a metal which diffuses and melts into the solder upon the solder connection.

Abstract: Provided is a semiconductor device including a drive circuit which is provided on one surface of a semiconductor substrate and drives a light emitting element, one of or a plurality of the light emitting elements which is provided on another surface of the semiconductor substrate, and a through electrode which penetrates the semiconductor substrate and electrically connects the drive circuit with the light emitting element.

Abstract: A solid-state imaging device capable of achieving a further decrease in size such as a further decrease in height, a further increase in speed of wiring, and a further increase in density of wiring is to be provided. A solid-state imaging device to be provided includes: a first semiconductor device including a semiconductor layer in which a photoelectric conversion unit that photoelectrically converts incident light and a penetrating via are provided, a first connecting portion and a second connecting portion on the surface side of the semiconductor layer on the side that receives the light, and a connecting wiring line that connects the first connecting portion, the second connecting portion, and the penetrating via; and a second semiconductor device that is mounted on the first semiconductor device with the first connecting portion. The solid-state imaging device is connected to an external terminal by the second connecting portion.

Abstract: A method of loading granules into reaction tubes of a vertical multitube reactor installed in a vertical direction by dropping the granules from above each of the reaction tubes in a state that a linear member is inserted and suspended in the reaction tube. The reaction tube has an effective length of 1000 mm or more. The linear member includes a small-diameter portion positioned on an upper side and a large-diameter portion continuously extending from the small-diameter portion. The small-diameter portion has an outer diameter (Ra) of 5.0 mm or less, and the large-diameter portion has an outer diameter (Rb) of 5.0 to 15.0 mm larger than the outer diameter (Ra). A length of the small-diameter portion from an upper end of the reaction tube is 10.0 mm or more. A distance between an upper surface of a granule loaded layer formed inside the reaction tube and a lower end of the linear member inserted in the reaction tube is 100 mm or more.

Abstract: Even in a case where a pad becomes smaller, solder connection strength is improved. A semiconductor device includes a pad, a diffusion layer, and a melting layer. The pad included by the semiconductor device includes a concave portion on a surface at which solder connection is to be performed. The diffusion layer included by the semiconductor device is disposed at the concave portion and constituted with a metal which remains on the surface of the pad while diffusing into solder upon the solder connection. The melting layer included by the semiconductor device is disposed adjacent to the diffusion layer and constituted with a metal which diffuses and melts into the solder upon the solder connection.

Abstract: The present disclosure relates to a surgery support system, a display control device, and a display control method in which a plurality of images can be displayed in an easy-to-see and efficient manner. An information processing device generates a composite image by compositing images output from a plurality of electronic instruments including a medical instrument, and adds, to the composite image, metadata related to division of the composite image. The display control device controls a display device to display, in the virtual three-dimensional space, divided images obtained by dividing the composite image into a plurality of divided regions on the basis of the metadata. The present disclosure can be applied to an endoscopic surgical system, for example.

Abstract: An imaging device includes a first semiconductor element including at least one bump pad that has a concave shape. The at least one bump pad includes a first metal layer and a second metal layer on the first metal layer. The imaging device includes a second semiconductor element including at least one electrode. The imaging device includes a microbump electrically connecting the at least one bump pad to the at least one electrode. The microbump includes a diffused portion of the second metal layer, and first semiconductor element or the second semiconductor element includes a pixel unit.

Abstract: An electric motor includes a frame and a bracket to constitute an outer case, a stator having a cylindrical shape accommodated in the frame, a rotor arranged inner side of the stator, a circuit board placed on a side of the stator which is close to the bracket, a heat-generating component mounted on the circuit board, and a heat sink mounted on the circuit board and thermally connected to the heat-generating component, wherein a first heat-radiating adhesive layer, an insulating sheet, and a second heat-radiating adhesive layer are arranged between the bracket and the heat sink in this order from a side close to the heat sink, and the bracket and the heat sink are thermally connected to each other.

Abstract: In a liquid-cooling-type cooler, an inlet header region and an outlet header region are formed by a partition member. If an inflow direction of a coolant to an inflow port is defined as a Y direction and a direction perpendicular to the Y direction is defined as an X direction, the partition member guides a coolant, which has flowed in the Y direction into the inlet header region, to an inlet flow path while deflecting an advancing direction of the coolant by a partition wall, thereby causing the coolant, which has passed through the header region, to flow into the entire area of the inlet flow path at an approximately equal flow rate and to further flow in the X direction into one side surface of each of heat dissipation regions at an even flow rate. Accordingly, a uniform cooling effect is obtained on mounting surfaces on heat generating elements.

Abstract: An imaging device includes a first semiconductor element including at least one bump pad that has a concave shape. The at least one bump pad includes a first metal layer and a second metal layer on the first metal layer. The imaging device includes a second semiconductor element including at least one electrode. The imaging device includes a microbump electrically connecting the at least one bump pad to the at least one electrode. The microbump includes a diffused portion of the second metal layer, and first semiconductor element or the second semiconductor element includes a pixel unit.

Abstract: A presser foot device includes a wall portion, a pair of opposed portions, a pin, and an abutting portion. The wall portion extends in a first direction and a second direction intersecting the first direction. The pair of opposed portions extend in one direction of a third direction intersecting the first direction and the second direction from the wall portion, and face each other. The pin extends in the second direction between the pair of opposed portions, and engages with a groove provided in the presser foot holder. The abutting portion is provided with respect to the pin on one direction side of the first direction, and is provided on the one direction side of the third direction of an end surface in the one direction of the third direction, of the pair of opposed portions. The abutting portion abuts against the presser foot holder in the second direction.