Abstract: A music box includes a star wheel, a stopper, a sun wheel, a motor, a sensor, and a controller. The star wheel is configured to rotate about a first shaft. The sun wheel is fixed on a second shaft and engages the star wheel. The motor is configured to rotate the first shaft and the second shaft. The sensor is configured to detect a rotation state of the sun wheel. The controller is configured to: read a music data; control the motor to rotate at a rotational speed based on a temp; determine a start timing at which the stopper starts to release the star wheel based on a sound output timing and the rotation state; calibrate the start timing to a calibrated start timing based on a value related to the rotational speed; and control the stopper to release the star wheel at the calibrated start timing.

Abstract: In a pan coating apparatus including a rotary drum which rotates about a horizontal rotation axis, an air supply chamber having a larger sectional area than that of an opening portion is arranged on a front stage with respect to the front-surface opening portion of the rotary drum. The air supply chamber is formed in a chamber door attached to a front of a casing, and has one end side communicating to the opening portion and another end side connected to an air supply duct via an air supply hole. The air flowing into the air supply chamber from the air supply duct is reduced in flow rate in the air supply chamber and supplied from the opening portion into the rotary drum with the air flow thereof in a stable state.

Abstract: A semiconductor apparatus includes a first semiconductor chip, a second semiconductor chip, and a flare prevention plate. On the first semiconductor chip, a photoelectric conversion unit configured to perform photoelectric conversion on light received in a light receiving area is formed. The second semiconductor chip is electrically connected to the first semiconductor chip, the second semiconductor chip being disposed on a surface of the first semiconductor chip on a side of the light receiving area. The flare prevention plate is disposed on the second semiconductor chip, the flare prevention plate being configured to block light, the flare prevention plate being in contact with the second semiconductor chip.

Abstract: A spray gun (31) is attached to a multi-function unit (32) movable in a horizontal direction and a perpendicular direction. The spray gun (31) is mounted to a support holder (33), and the support holder (33) is connected to a support arm (35) of the multi-function unit (32). The support arm (35) is attached to a unit cover (36) which is openable/closable with respect to a casing (2). The support holder (33) and the support arm (35) can hide and house a liquid hose and an air hose therein so that the hoses and the like are arranged in an apparatus in such a state as to be completely free from being exposed. An installation position of the spray gun (31) can be finely adjusted by the multi-function unit (32) during a coating process, thereby enabling a control for keeping constant distances between tablet surfaces and the spray gun (31).

Abstract: A spray gun (31) is attached to a multi-function unit (32) movable in a horizontal direction and a perpendicular direction. The spray gun (31) is mounted to a support holder (33), and the support holder (33) is connected to a support arm (35) of the multi-function unit (32). The support arm (35) is attached to a unit cover (36) which is openable/closable with respect to a casing (2). The support holder (33) and the support arm (35) can hide and house a liquid hose and an air hose therein so that the hoses and the like are arranged in an apparatus in such a state as to be completely free from being exposed. An installation position of the spray gun (31) can be finely adjusted by the multi-function unit (32) during a coating process, thereby enabling a control for keeping constant distances between tablet surfaces and the spray gun (31).

Abstract: A circuit board having a plurality of first holes formed in a semiconductor substrate to extend therethrough; insulating layers formed on a back surface of the semiconductor substrate in the plurality of first holes, the insulating layers between the back surface and the first holes being differed in thickness; second holes formed in the insulating layers to communicate with the first holes; and an electro-conductive layer formed inside of the first holes and the second holes to extend through the semiconductor substrate.

Abstract: A semiconductor device includes: a mounted body in which a wiring pattern is formed on a first main surface; a semiconductor chip mounted on the surface of the mounted body on which the wiring pattern is formed; an underfill material which is filled between the mounted body and the semiconductor chip and forms a fillet on an outer peripheral part of the semiconductor chip; and an injection section which is disposed on the mounted body and on an outside of a side section, on which the fillet is formed to be longest, of four side sections defining a chip mount area on which the semiconductor chip is mounted, and guides the underfill material to between the mounted body and the semiconductor chip.

Abstract: A method of manufacturing a circuit board including forming a plurality of first holes in a semiconductor substrate, each of the first holes being opened toward a front surface of the semiconductor substrate, filling a bottom side of the plurality of first holes with an insulating layer, filling the first holes filled with the insulating layer on the bottom side thereof with a first electro-conductive layer, polishing the semiconductor substrate from the back surface thereof until the respective insulating layers filled in the plurality of first holes are exposed, and forming a second hole in each of the exposed insulating layers so as to reach the first electro-conductive layer, and forming a second electro-conductive layer by filling each second hole with the second electro-conductive layer to connect the first electro-conductive layer.

Abstract: A circuit board having a plurality of first holes formed in a semiconductor substrate to extend therethrough; insulating layers formed on a back surface of the semiconductor substrate in the plurality of first holes, the insulating layers between the back surface and the first holes being differed in thickness; second holes formed in the insulating layers to communicate with the first holes; and an electro-conductive layer formed inside of the first holes and the second holes to extend through the semiconductor substrate

Abstract: A method for manufacturing a semiconductor device includes the steps of providing an element forming layer on a first surface of a semiconductor substrate, and providing an external connection terminal on a second surface of the semiconductor substrate opposite to the first surface so that the external connection terminal is electrically connected to the element forming layer through a via hole. The via hole is formed through the steps of forming a buried conductor layer on the first surface so as to electrically insulate the buried conductor layer from the semiconductor substrate, forming a communication hole on the second surface so as to communicate it with the buried conductor layer, and electrically connecting the buried conductor layer and the communication hole.

Abstract: In a pan coating apparatus (10) including a rotary drum (1) which rotates about a horizontal rotation axis (O), an air supply chamber (13) having a larger sectional area than that of an opening portion (7) is arranged on a front stage with respect to the front-surface opening portion (7) of the rotary drum. The air supply chamber (13) is formed in a chamber door (11) attached to a front of a casing (2), and has one end side communicating to the opening portion (7) and another end side connected to an air supply duct (19) via an air supply hole (18). The air flowing into the air supply chamber (13) from the air supply duct (19) is reduced in flow rate in the air supply chamber (13) and supplied from the opening portion (7) into the rotary drum (1) with the air flow thereof in a stable state.

Abstract: A spray gun (31) is attached to a multi-function unit (32) movable in a horizontal direction and a perpendicular direction. The spray gun (31) is mounted to a support holder (33), and the support holder (33) is connected to a support arm (35) of the multi-function unit (32). The support arm (35) is attached to a unit cover (36) which is openable/closable with respect to a casing (2). The support holder (33) and the support arm (35) can hide and house a liquid hose and an air hose therein so that the hoses and the like are arranged in an apparatus in such a state as to be completely free from being exposed. An installation position of the spray gun (31) can be finely adjusted by the multi-function unit (32) during a coating process, thereby enabling a control for keeping constant distances between tablet surfaces and the spray gun (31).

Abstract: Disclosed herein is a semiconductor device, including: a mount body having a first principal surface on which a wiring pattern is formed; a semiconductor chip mounted above the principal surface of the mount body on which the wiring pattern is formed; an underfill material filled between the mount body and the semiconductor chip, thereby forming a fillet in an outer peripheral portion of the semiconductor chip; and an introduction portion formed outside a side portion, along which the fillet is formed so as to be longest, of four side portions which measure a chip mounting area, on the mount body, onto which the semiconductor chip is mounted, the introduction portion serving to introduce the underfill material between the mount body and the semiconductor chip.

Abstract: A semiconductor device includes: a mounted body in which a wiring pattern is formed on a first main surface; a semiconductor chip mounted on the surface of the mounted body on which the wiring pattern is formed; an underfill material which is filled between the mounted body and the semiconductor chip and forms a fillet on an outer peripheral part of the semiconductor chip; and an injection section which is disposed on the mounted body and on an outside of a side section, on which the fillet is formed to be longest, of four side sections defining a chip mount area on which the semiconductor chip is mounted, and guides the underfill material to between the mounted body and the semiconductor chip.

Abstract: A method of manufacturing a circuit board is provided. The method includes forming a plurality of first holes in a semiconductor substrate, each of the first holes being opened toward a front surface of the semiconductor substrate, filling a bottom side of the plurality of first holes with an insulating layer, filling the first holes filled with the insulating layer on the bottom side thereof with a first electro-conductive layer, polishing the semiconductor substrate from the back surface thereof until the respective insulating layers filled in the plurality of first holes are exposed, and forming a second hole in each of the exposed insulating layers so as to reach the first electro-conductive layer, and forming a second electro-conductive layer by filling each second hole with the second electro-conductive layer to connect the first electro-conductive layer.

Abstract: A method for manufacturing a semiconductor device includes the steps of providing an element forming layer on a first surface of a semiconductor substrate, and providing an external connection terminal on a second surface of the semiconductor substrate opposite to the first surface so that the external connection terminal is electrically connected to the element forming layer through a via hole. The via hole is formed through the steps of forming a buried conductor layer on the first surface so as to electrically insulate the buried conductor layer from the semiconductor substrate, forming a communication hole on the second surface so as to communicate it with the buried conductor layer, and electrically connecting the buried conductor layer and the communication hole.