Abstract: An actuator includes a movable beam supported on a substrate by a supporting portion, and having a first movable end and a second movable end. The second movable end is opposite to the first movable end with respect to the supporting portion. A first drive beam is connected to the movable beam at around the second movable end. The first drive beam is fixed on the substrate at an end portion of the first drive beam. A second drive beam is connected to the movable beam at a location between the supporting portion and the first movable end. The second drive beam is fixed on the substrate at another end portion of the second drive beam.

Abstract: A variable-capacitance element includes: a first electrode and a second electrode which are fixed on a substrate with a spacing; a movable electrode; an actuator which is supported on a supporting portion provided on the substrate to drive the movable electrode. The movable electrode is put in an electrically connecting state with the second electrode, when the movable electrode is driven to a first position by the actuator, and the movable electrode is put in an electrically non-connected state with the second electrode, when the movable electrode is driven to a second position by the actuator. The movable electrode is constituted to be always put in an electrically non-connected state with the first electrode.

Abstract: A piezoelectric driving type MEMS apparatus includes: a supporting portion provided on a substrate; and a piezoelectric actuator, which is supported on the supporting portion, including a piezoelectric film and a driving electrode configured to drive the piezoelectric film, the piezoelectric film in the piezoelectric actuator having at least one slit extending along a longitudinal direction of the piezoelectric actuator.

Abstract: A semiconductor device of this invention includes a first circuit for initializing a predetermined circuit in accordance with the level of a power source voltage, a second circuit for controlling the output from the first circuit by activation or deactivation, and an activation control circuit for activating or deactivating the second circuit in accordance with external input.

Abstract: A semiconductor device having a surface MEMS element, includes a semiconductor substrate, and an actuator which is arranged above the semiconductor substrate via a space and has a lower electrode, an upper electrode, and a piezoelectric layer sandwiched between the lower electrode and the upper electrode, at least an entire surface of the piezoelectric layer being substantially flat.

Abstract: A semiconductor memory device includes: a device substrate having a semiconductor layer separated by a dielectric layer from a base substrate; a memory cell array having a plurality of memory cells formed and arranged on the semiconductor layer of the device substrate, each the memory cell having a MOS transistor structure with a body in an electrically floating state to store data based on a majority carrier accumulation state of the body; and a sense amplifier circuit configured to read out data of a selected memory cell in the memory cell array to store the read data in a data latch, then transfer the read data to an output circuit and write back the read data into the selected memory cell.

Abstract: A semiconductor device of this invention includes a first circuit for initializing a predetermined circuit in accordance with the level of a power source voltage, a second circuit for controlling the output from the first circuit by activation or deactivation, and an activation control circuit for activating or deactivating the second circuit in accordance with external input.

Abstract: A semiconductor memory device having a data latch circuit has plural bit lines to which a reprogrammable memory cell is connected, a data bus on which data is transferred, a latch circuit latching the data transferred on the data bus, a read out circuit connected to the data bus, and a data transfer circuit group to directly transfer the data latched in the latch circuit to the read out circuit without transferring it to the memory cell.

Abstract: A non-volatile semiconductor memory device includes a memory cell array having a plurality of non-volatile memory cells, a decode circuit configured to decode address data as input thereto to select a memory cell from the memory cell array, and a data sense circuit configured to detect and amplify the data of the selected memory cell of the memory cell array. The memory cell array includes an initial setup data region with initial setup data and status data being programmed thereinto. The initial setup data is used for determination of memory operating conditions, and the status data indicates whether the initial setup data region is presently normal or not in functionality.

Abstract: A non-volatile semiconductor memory device includes a memory cell array having a plurality of non-volatile memory cells, a decode circuit configured to decode address data as input thereto to select a memory cell from the memory cell array, and a data sense circuit configured to detect and amplify the data of the selected memory cell of the memory cell array. The memory cell array includes an initial setup data region with initial setup data and status data being programmed thereinto. The initial setup data is used for determination of memory operating conditions, and the status data indicates whether the initial setup data region is presently normal or not in functionality.

Abstract: A semiconductor device includes an internal power supply terminal for supplying an internal power supply voltage, an oscillator generating a clock pulse when the internal power supply voltage becomes higher than a first voltage, a charge pump circuit charge pumping upon receiving the clock pulse, a reference voltage generator using the output voltage from the charge pump circuit as a power supply, and a voltage monitor which uses the output voltage from the charge pump circuit as a power supply, has a comparator for comparing a divided voltage of the internal power supply voltage with the reference voltage, and outputs a first signal of a first logic level as the power-on reset signal when the internal power supply voltage is higher than a second voltage. With this arrangement, a power-on reset circuit with little variation in power-on monitoring level can be provided.

Abstract: A semiconductor memory device includes: a device substrate having a semiconductor layer separated by a dielectric layer from a base substrate; a memory cell array having a plurality of memory cells formed and arranged on the semiconductor layer of the device substrate, each the memory cell having a MOS transistor structure with a body in an electrically floating state to store data based on a majority carrier accumulation state of the body; and a sense amplifier circuit configured to perform data read out of the memory cell array, the sense amplifier circuit including a bipolar transistor for performing current amplification of a memory cell selected during data reading.

Abstract: A semiconductor memory device having a data latch circuit has plural bit lines to which a reprogrammable memory cell is connected, a data bus on which data is transferred, a latch circuit latching the data transferred on the data bus, a read out circuit connected to the data bus, and a data transfer circuit group to directly transfer the data latched in the latch circuit to the read out circuit without transferring it to the memory cell.

Abstract: A semiconductor memory device includes: a device substrate having a semiconductor layer separated by a dielectric layer from a base substrate; a memory cell array having a plurality of memory cells formed and arranged on the semiconductor layer of the device substrate, each the memory cell having a MOS transistor structure with a body in an electrically floating state to store data based on a majority carrier accumulation state of the body; and a sense amplifier circuit configured to read out data of a selected memory cell in the memory cell array to store the read data in a data latch, then transfer the read data to an output circuit and write back the read data into the selected memory cell.

Abstract: A semiconductor device includes a memory cell array, latch circuits, first to third circuits and a current control circuit. The memory cell array includes NAND cells arranged therein. The latch circuits temporarily hold data read out from the memory cell array. The first circuit generates a first current varying in proportion to “1” or “0” of binary logic data of one end of the plurality of latch circuits. The second circuit generates a second current which is preset. The third circuit compares the first current with the second current. The value of “1” or “0” of binary logic data of the one end of the plurality of latch circuits is detected based on a result of the comparison between the first current and the second current.

Abstract: An INVSRC node and a SAREF node are previously precharged. After a potential on a bit line is reset, the bit line (BLS node) is precharged. In this event, a clamp MOS transistor in a sense amplifier is in ON state, and an SA node is also precharged simultaneously. A precharge level is set to a value lower than a threshold voltage of an inverter. Subsequently, when SAEN transitions to “H,” a sense operation is performed. For reading data “0,” the SA node is rapidly increased to Vdd. For reading data “1,” the SA node slowly approaches to Vss. A change in the potential at the SA node is detected by the inverter.

Abstract: A semiconductor memory device having a data latch circuit has plural bit lines to which a reprogrammable memory cell is connected, a data bus on which data is transferred, a latch circuit latching the data transferred on the data bus, a read out circuit connected to the data bus, and a data transfer circuit group to directly transfer the data latched in the latch circuit to the read out circuit without transferring it to the memory cell.

Abstract: A semiconductor integrated circuit device includes: a substrate; a first conductivity type of semiconductor layers arranged above the substrate as being insulated from the substrate and insulated from each other; cell transistors formed on the respective semiconductor layers, each of which has a second conductivity type of source, drain layers and a gate electrode to store data in a channel body thereof corresponding to an accumulation state of majority carriers; and the first conductivity type of emitter layers formed in the respective semiconductor layers to be contacted to the respective drain layers of the cell transistors so as to constitute PN junctions therebetween, the emitter layers serving for injecting majority carriers into the respective channel bodies of the cell transistors.

Abstract: In a method of testing a nonvolatile semiconductor memory integrated on a semiconductor chip comprising a memory cell array, a first register that stores an address of a defective region in the memory cell array, a plurality of internal voltage generator circuits, and a second register, the second register storing a trimming value for setting an internal voltage value generated by each of the internal voltage generator circuits, the testing method carries out resetting the address of the defective region stored in the first register and the trimming value stored in the second register, and setting the address of the defective region stored in the first register and the trimming value stored in the second register to a value according to a property of each of the semiconductor chips, wherein the testing is carried out without turning a power supply off after the power supply has been turned on.

Abstract: A semiconductor memory device includes: a device substrate having a semiconductor layer separated by a dielectric layer from a base substrate; a memory cell array having a plurality of memory cells formed and arranged on the semiconductor layer of the device substrate, each the memory cell having a MOS transistor structure with a body in an electrically floating state to store data based on a majority carrier accumulation state of the body; and a sense amplifier circuit configured to perform data read out of the memory cell array, the sense amplifier circuit including a bipolar transistor for performing current amplification of a memory cell selected during data reading.