Abstract: To reduce the disturbance between adjacent memory cells, an improved ONO flash memory array is implanted with a pocket on one side of the channel of each memory cell or two pockets of different concentrations on both sides of the channel, thereby resulting in memory cells with asymmetric pockets. Consequently, no disturbances occurred between adjacent memory cells when the ONO flash memory array is programmed or erased by band-to-band techniques, and the disturbances between adjacent memory cells are also suppressed during reading process.

Abstract: A method of operating a non-volatile memory cell, wherein the non-volatile memory cell includes a word line, a first bit line, and a second bit line, the method includes programming the memory cell that includes applying a high positive bias to the first bit line, applying a ground bias to the second bit line, and applying a high negative bias to the word line, wherein positively-charged holes tunnel through the dielectric layer into the trapping layer.

Abstract: An electro-static discharge (ESD) protection circuit for a dual polarity I/O pad is provided. The protection circuit includes a substrate of first type; a deep well region of second type disposed in the first type substrate; a well region of first type disposed in the second type deep well region; a first transistor disposed over the well region of first type, wherein the first transistor has a first source, a first gate and a first drain; a second transistor disposed over the substrate of first type, wherein the second transistor has a second source, a second gate and a second drain, and the second source is connected with the first drain, and both of them are disposed in a portion of the well region of first type, the deep well region of second type and the substrate of first type; a first doped region is disposed in the first type well region and laterally adjacent to the first source; a second doped region is disposed in the substrate of first type and laterally adjacent to the second drain.

Abstract: A method for programming and erasing a non-volatile memory with a nitride tunneling layer is described. The non-volatile memory is programmed by applying a first voltage to the gate and grounding the substrate to turn on a channel between the source and the drain, and applying a second voltage to the drain and grounding the source to induce a current in the channel and thereby to generate hot electrons therein. The hot electrons are injected into a charge-trapping layer of the non-volatile and trapped therein through the nitride tunneling layer. The non-volatile memory is erased by applying a first positive bias to the drain, applying a second positive bias to the gate, and grounding the source and the substrate to generate hot electron holes in the channel region. The hot electron holes are injected into the charge-trapping layer through the nitride tunneling layer.

Abstract: An erasing method for the memory cells of a non-volatile memory is provided. Each memory cell comprises a gate, a source, a drain, an electron-trapping layer and a substrate. The data within the memory cell is erased by applying a first voltage to the control gate, applying a second voltage to the source, applying a third voltage to the drain and applying a fourth voltage to the substrate. The electrons are pulled from the electron-trapping layer into the channel by negative gate F-N tunneling effect.

Abstract: A method of operating a non-volatile memory cell, wherein the non-volatile memory cell includes a word line, a first bit line, and a second bit line, the method includes programming the memory cell that includes applying a high positive bias to the first bit line, applying a ground bias to the second bit line, and applying a high negative bias to the word line, wherein positively-charged holes tunnel through the dielectric layer into the trapping layer.

Abstract: In an ESD protection structure and method utilizing substrate triggering for a high-voltage tolerant pad on a substrate, an ESD protection device has a source connected to the pad and a gate and a drain both connected to a ground, and a substrate-triggering control circuit is used to keep the substrate at a low voltage during a normal operation, and pumping the substrate to a high voltage during an ESD event for the ESD protection device to be triggered much easier. The substrate-triggering control circuit is implemented with an active device, thereby reducing the chip size for the circuit and the loading effect on the pad.

Abstract: To reduce the disturbance between adjacent memory cells, an improved ONO flash memory array is implanted with a pocket on one side of the channel of each memory cell or two pockets of different concentrations on both sides of the channel, thereby resulting in memory cells with asymmetric pockets. Consequently, no disturbances occurred between adjacent memory cells when the ONO flash memory array is programmed or erased by band-to-band techniques, and the disturbances between adjacent memory cells are also suppressed during reading process.

Abstract: A method of manufacturing chalcogenide memory in a semiconductor substrate.

Abstract: The invention provides a nonvolatile memory and corresponding method having an optimal memory erase function and, more particularly, a method for erasing a nonvolatile memory comprising a source, a gate, a drain, a channel and a trapping layer. The method according to a preferred embodiment of the invention generally comprises the steps of applying a non-zero gate voltage to the gate, applying a non-zero source voltage to the source, applying a non-zero drain voltage to the drain in each erase shot wherein the drain voltage is generally higher in magnitude than the source voltage, generating hot holes in the nonvolatile memory, injecting the generated hot holes in the trapping layer near drain junction, and accordingly erasing the nonvolatile memory.

Abstract: A macro model of a programmable NROM for simulating the characters of the NROM under programming operation. Charges are stored in a portion of the nitride material layer to for a charge trapped region when the NROM is programmed. A normal MOS symbol element and a short channel MOS symbol element are respectively represent a MOS without having the charge trapped region and a MOS with a charge trapped region. Moreover, the normal MOS symbol element is series with the short channel MOS symbol element, wherein a source of the short channel MOS symbol element is coupled with a drain of the normal MOS symbol element.

Abstract: A method for programming and erasing a non-volatile memory with a nitride tunneling layer is described. The non-volatile memory is programmed by applying a first voltage to the gate and grounding the substrate to turn on a channel between the source and the drain, and applying a second voltage to the drain and grounding the source to induce a current in the channel and thereby to generate hot electrons therein. The hot electrons are injected into a charge-trapping layer of the non-volatile and trapped therein through the nitride tunneling layer. The non-volatile memory is erased by applying a first positive bias to the drain, applying a second positive bias to the gate, and grounding the source and the substrate to generate hot electron holes in the channel region. The hot electron holes are injected into the charge-trapping layer through the nitride tunneling layer.

Abstract: A method of narrowing the threshold voltage distribution in a memory. The method includes separating the erase and erase identification of odd memory cells from the erase and erase identification of even memory cells in an advanced non-volatile memory so that the distribution of the threshold voltage is narrowed.

Abstract: The invention discloses an ESD (Electro Static Discharge) protection circuit, including a resistor device, a capacitor device and a PMOS device. The resistor device is connected in series between a power supply and the capacitor device. The capacitor device is connected in series between the resistor device and the ground. A gate electrode of the PMOS device is connected between the resistor device and the capacitor device. A bulk electrode of the PMOS device is interconnected to a first electrode of the PMOS device, and the first electrode is connected to the power supply. Alternatively, another ESD protection circuit for multiple power supplies includes at least two aforementioned ESD protection circuits, and a common ESD bus. The ESD protection circuits are connected to separate power supplies, and both connected to the common ESD bus. By using the ESD protection circuit, there is no noise between the separate power supplies, and an ESD current could be discharged easily and safely.

Abstract: An erasing method for the memory cells of a non-volatile memory is provided. Each memory cell comprises a gate, a source, a drain, an electron-trapping layer and a substrate. The data within the memory cell is erased by applying a first voltage to the control gate, applying a second voltage to the source, applying a third voltage to the drain and applying a fourth voltage to the substrate. The electrons are pulled from the electron-trapping layer into the channel by negative gate F-N tunneling effect.

Abstract: A non-volatile memory device is described, comprising a plurality of memory cells, a plurality of word lines, a plurality of drain lines, and a plurality of source lines, wherein two adjacent memory cells in a column constitute a cell pair, and all cell pairs are arranged in rows and columns. The two memory cells in each cell pair share a source region, and two adjacent cell pairs in a column share a drain region. The source regions and the gates of the memory cells in the same row are coupled to a source line and a word line, respectively, and the drain regions of the memory cells in the same column are coupled to a drain line.

Abstract: A method for fabricating a non-volatile memory having a P-type floating gate is described. A tunneling layer is formed on a substrate and then a first patterned polysilicon layer is formed on the tunneling layer. A buried drain is formed in the substrate beside the first polysilicon layer and then an insulating structure is formed on the tunneling layer on the buried drain. Thereafter, a second polysilicon layer is formed on the first polysilicon layer to constitute a floating gate together with the first polysilicon layer. A P-type ion is implanted into the second polysilicon layer and then a dielectric layer and a control gate are sequentially formed on the floating gate. A thermal process is then performed to make the P-type, ion in the second polysilicon layer diffuse into the first polysilicon layer.

Abstract: A transistor device that includes at least two transistors, each transistor including a source region, a drain region, and a shallow trench isolation formed between and contiguous with the source and drain regions, wherein the shallow trench isolation electrically isolates the source and drain regions to minimize the short-channel effects, a conductor layer disposed over the source region, shallow trench isolation, and drain region, wherein the conductor layer electrically connects the source and drain regions to serve as a channel region, a gate oxide disposed over the conductor layer, and a gate structure formed over the gate oxide.

Abstract: A gate-equivalent-potential circuit and method for an I/O pad ESD protection arrangement including used and unused MOS fingers connected to the I/O pad comprises a switch connected between the gates of the MOS fingers, an ESD detector connected to the switch to turn on the switch upon an ESD event and a gate-modulated circuit connected to the gate of the unused finger to couple a voltage thereto to reduce the triggering voltage of the transistors within the fingers.

Abstract: An I/O pad ESD protection circuit is composed of a SCR circuit, a first diode, a second diode, and an anti-latch-up circuit. The SCR circuit has a first connection terminal and a second connection terminal, respectively coupled to the I/O pad and the ground voltage, so as to discharge the electrostatic charges. The anti-latch-up circuit has two terminals, which are respectively coupled to the voltage source and the ground voltage, and another connection terminal, used to send an anti-latch-up signal to the SCR for changing the activating rate. The latch-up phenomenon is avoided.