Abstract: The semiconductor device includes a first insulating circuit substrate; a semiconductor chip including a plurality of control electrodes, disposed on the first insulating circuit substrate; a second insulating circuit substrate including a plurality of first through-holes in which conductive members are arranged on inner walls and/or an outer periphery of ends of the first through-holes, the second insulating circuit substrate being disposed above the semiconductor chips; and first pins inserted into the first through-holes and having at one end a columnar part connected to the control electrodes of the semiconductor chips, and having at another end a head part that is wider than an inner diameter of the first through-holes.

Abstract: A semiconductor device includes semiconductor elements and a multilayer substrate including an insulating plate and a circuit board on which the semiconductor elements are arranged that is arranged on the front surface of the insulating plate. The semiconductor device also includes a printed circuit board that is arranged facing a principal surface of the multilayer substrate and in which through holes are formed, as well as conductive posts that are inserted through the through holes and are electrically connected to the semiconductor elements via bonding materials. Furthermore, the semiconductor device includes fuses that are formed between the interior walls of the through holes and the outer peripheral surfaces of the conductive posts, are electrically connected to the printed circuit board via the conductive posts, and melt at a first temperature.

Abstract: A semiconductor module includes sealing resin from which a main terminal protrudes, which seals an insulating substrate. The module includes a semiconductor element and a wiring substrate. The sealing resin has a nut housing portion in which a nut is disposed. The semiconductor module also has a busbar terminal to which a main terminal that protrudes from the sealing resin is electrically connected and which has an insertion hole facing the nut.

Abstract: To provide an education support system that is able to provide information that helps educators and students to achieve effective and efficient learning.

Abstract: To provide an education support system that allows educators to conduct adequate assessments considering handicaps or characteristics of individual students and to offer effective and efficient learning.

Abstract: A semiconductor device according to the invention includes an insulating substrate including an insulating plate, a circuit pattern that is formed on a front surface of the insulating plate, and a radiator plate that is fixed to a rear surface of the insulating plate, a semiconductor chip that is fixed to the circuit pattern, an external lead terminal that is connected to a surface electrode of the semiconductor chip through a wiring line, a molding resin that covers the insulating substrate, the semiconductor chip, the wiring line, and the external lead terminal such that a rear surface of the radiator plate and a portion of the external lead terminal are exposed, and an anchor layer including a stripe-shaped concave portion which is formed in the circuit pattern by laser beam irradiation.

Abstract: A semiconductor device is disclosed in which an implant board and a semiconductor element of a semiconductor mounting board are bonded and electrically connected through implant pins and which can be manufactured with high productivity. Implant pins are bonded to a semiconductor element and/or a circuit pattern of a semiconductor mounting board through cylindrical terminals press-fitted into the other ends of the implant pins. Press-fitting depth L2 of each of the implant pins into corresponding cylindrical terminals is adjustable, so that total length of the implant pin and cylindrical terminal which are press-fitted to each other matches up with the distance between the semiconductor element and/or the circuit pattern on the semiconductor mounting board and an implant board.

Abstract: A semiconductor device includes semiconductor elements and a multilayer substrate including an insulating plate and a circuit board on which the semiconductor elements are arranged that is arranged on the front surface of the insulating plate. The semiconductor device also includes a printed circuit board that is arranged facing a principal surface of the multilayer substrate and in which through holes are formed, as well as conductive posts that are inserted through the through holes and are electrically connected to the semiconductor elements via bonding materials. Furthermore, the semiconductor device includes fuses that are formed between the interior walls of the through holes and the outer peripheral surfaces of the conductive posts, are electrically connected to the printed circuit board via the conductive posts, and melt at a first temperature.

Abstract: A semiconductor device is fastened to a heat dissipation member such that a force directed downward acts from a metal substrate onto the heat dissipation member, with a rim portion of a storage region as a fulcrum with respect to the heat dissipation member. As a result, a heat conductive material can be spread into a thinner layer between the metal substrate and the heat dissipation member, improving the heat dissipation between the metal substrate and the heat dissipation member.

Abstract: A semiconductor module includes sealing resin from which a main terminal protrudes, which seals an insulating substrate. The module includes a semiconductor element and a wiring substrate. The sealing resin has a nut housing portion in which a nut is disposed. The semiconductor module also has a busbar terminal to which a main terminal that protrudes from the sealing resin is electrically connected and which has an insertion hole facing the nut.

Abstract: The apparatus for synchronously processing text data and voice data, comprises: a storing unit for storing text data and voice data; a text data dividing section for dividing the text data; a text data phoneme converting section for phonemically converting the divided text data; a text data phoneme conversion accumulated value calculating section for calculating accumulated values of text data phoneme conversion values; a voice data dividing section for dividing the voice data; a reading data phoneme converting section for phonemically converting the divided voice data; a voice data phoneme conversion accumulated value calculating section for calculating accumulated values of voice data phoneme conversion values; a phrase corresponding data producing section for producing phrase corresponding data; and an output section for synchronously outputting the text data and the divided voice data.

Abstract: Plating pre-processing is carried out before carrying out a plating process on the surface of a conducting section provided on a semiconductor wafer. A first metal film is formed on the surface of the conducting section by NiP alloy plating process. A second metal film is formed on the surface of the first metal film by immersion Ag plating process. The semiconductor wafer is diced and cut into semiconductor chips. A conductive composition containing Ag particles is applied to the surface of the second metal film which is on the front surface of the semiconductor chip. A bonding layer containing Ag particles is formed by sintering the conductive composition through heating. A metal plate is then bonded to the surface of the second metal film via the bonding layer containing Ag particles. The electronic component has high bonding strength, excellent thermal resistance and heat radiation properties.

Abstract: A thermocompression bonding structure includes a first member and a second member having a linear expansion coefficient different from that of the first member; and metal fine particles interposed between the first and second members as a bonding material to thermocompression bond the two members. The two members are disposed to apply thermal stress generating between the first member and the second member as pressurizing force on a bonding surface between the two members, and to increase temperature to thermocompression bond the first member and the second member.

Abstract: A semiconductor device is disclosed in which an implant board and a semiconductor element of a semiconductor mounting board are bonded and electrically connected through implant pins and which can be manufactured with high productivity. Implant pins are bonded to a semiconductor element and/or a circuit pattern of a semiconductor mounting board through cylindrical terminals press-fitted into the other ends of the implant pins. Press-fitting depth L2 of each of the implant pins into corresponding cylindrical terminals is adjustable, so that total length of the implant pin and cylindrical terminal which are press-fitted to each other matches up with the distance between the semiconductor element and/or the circuit pattern on the semiconductor mounting board and an implant board.

Abstract: A semiconductor device is disclosed in which an implant board and a semiconductor element of a semiconductor mounting board are bonded and electrically connected through implant pins and which can be manufactured with high productivity. Implant pins are bonded to a semiconductor element and/or a circuit pattern of a semiconductor mounting board through cylindrical terminals press-fitted into the other ends of the implant pins. Press-fitting depth L2 of each of the implant pins into corresponding cylindrical terminals is adjustable, so that total length of the implant pin and cylindrical terminal which are press-fitted to each other matches up with the distance between the semiconductor element and/or the circuit pattern on the semiconductor mounting board and an implant board.

Abstract: A method for manufacturing a semiconductor device, includes preparing a solder, a soldering article, a base material, a weight having a foot where a center of gravity of the weight is shifted from a center of the soldering article, a positioning jig having a hole for holding the soldering article in the base material, and a dam member; disposing the dam member on a side having a relatively lower height due to a warp of an edge portion of the base material; placing the positioning jig on a principal surface of the base material; placing the soldering article on the solder in the hole; placing the weight on an upper surface of the soldering article to position the center of gravity on the side having relatively lower height; and raising the temperature of the solder to a temperature equal to or higher than the melting point of the solder.

Abstract: The present invention addresses the problems of enabling a process of converting voice data playback speed even in a voice data playback device alone.

Abstract: A first metal film, of which major component is copper, is formed on a surface of a conductive portion which becomes a front surface electrode of a semiconductor element. A second metal film of which major component is silver is formed on a surface of the first metal film. A metal plate, which electrically connects the conductive portion and the other members (e.g. a circuit pattern of an insulated substrate) is bonded with a surface of the second metal film via a bonding layer containing silver particles. The second metal film does not contain nickel which decreases the bonding strength between the second metal film and the bonding layer containing silver particles. With the above configuration, an electronic component having a high bonding strength, excellent heat resistance and radiation performance, and a manufacturing method for the electronic component can be provided.

Abstract: A semiconductor device includes a frame including a first step portion provided in a ring shape in an inner circumference of one main surface of the frame, a second step portion provided in a ring shape in an inner circumference of another main surface of the frame, and an inner wall provided between the first step portion and the second step portion; a terminal leading from the first step portion to outside; a circuit board fitted to the second step portion; and an adhesive resin bonding the second step portion and the circuit board, and contacting the inner wall and the terminal.

Abstract: The apparatus for synchronously processing text data and voice data, comprises: a storing unit for storing text data and voice data; a text data dividing section for dividing the text data; a text data phoneme converting section for phonemically converting the divided text data; a text data phoneme conversion accumulated value calculating section for calculating accumulated values of text data phoneme conversion values; a voice data dividing section for dividing the voice data; a reading data phoneme converting section for phonemically converting the divided voice data; a voice data phoneme conversion accumulated value calculating section for calculating accumulated values of voice data phoneme conversion values; a phrase corresponding data producing section for producing phrase corresponding data; and an output section for synchronously outputting the text data and the divided voice data.