Patents by Inventor Te Wang

Te Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • White LED
    Patent number: 8981373
    Abstract: A white LED is provided. The white LED includes a P-type layer, a tunneling structure, an N-type layer, an N-type electrode, and a P-type electrode. The tunneling structure is disposed over the P-type layer. The tunneling structure includes a first barrier layer, an active layer and a second barrier layer. The first barrier layer includes a first metal oxide layer. The active layer includes a second metal oxide layer. The second barrier layer includes a third metal oxide layer. The N-type layer is disposed over the tunneling structure. The N-type electrode and the P-type electrode are respectively contacted with the N-type layer and the P-type layer. An energy gap of the second metal oxide layer is lower than an energy gap of the first metal oxide layer and is lower than an energy gap of the third metal oxide layer.
    Type: Grant
    Filed: January 2, 2014
    Date of Patent: March 17, 2015
    Assignee: Opto Tech Corporation
    Inventors: Lung-Han Peng, Yao-Te Wang, Po-Chun Yeh, Po-Ting Lee
  • APERTURE FOR PHOTOLITHOGRAPHY
    Publication number: 20150036116
    Abstract: An aperture is configured to be disposed between an illumination source and a semiconductor substrate in a photolithography system. The aperture includes a light-transmission portion with a non-planar thickness profile to compensate the discrepancy of wave-fronts of the light beams of different orders.
    Type: Application
    Filed: August 2, 2013
    Publication date: February 5, 2015
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Te-Hsien Hsieh, Shih-Ming Kuo, Ming-Jui Chen, Cheng-Te Wang, Jing-Yi Lee
  • COVER STRUCTURE FOR AN AIRTIGHT CONTAINER
    Publication number: 20150008219
    Abstract: An airtight container includes a cover, a container and two airtight members. The cover is assembled with the container. The cover has an exhaust part and a releasing part defined therein. The two airtight members are mounted in the exhaust part and the releasing part of the cover respectively. Each airtight member having an inlet and an air gap defined at two ends thereof respectively. The air gap communicates with the inlet. The inlet of one airtight member opened toward an inside of the container and the air gap opened toward an outside of the container, the inlet of another airtight member opened toward the outside of the container and the air gap opened toward the inside of the container. Therefore, the container could be sealed or unsealed by pressing the cover to the container or detaching the cover from the container.
    Type: Application
    Filed: July 2, 2013
    Publication date: January 8, 2015
    Inventor: Jui-Te Wang
  • Method for arranging a plurality of wires in pipe
    Patent number: 8925900
    Abstract: In a method for arranging a plurality of wires in a pipe, length of a each wire is determined in accordance with locations a plurality of holes on a surface of the pipe, and each of the plurality of wires on a lead stick is fastened in accordance with the locations of the plurality of holes on the surface of the pipe. Ends of the wires are perpendicularly connected to the surface of the lead stick. The lead stick are inserted into the pipe, and the ends of the plurality of wires are extended from the plurality of holes.
    Type: Grant
    Filed: October 26, 2012
    Date of Patent: January 6, 2015
    Assignees: GDS Software (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventors: Chi-Chih Wang, Bing-Yu He, Tzu-Te Wang, Po-Wei Hung, Yao-Feng Li, Zhi-Qiang Wang
  • Termination circuits capable of receiving data signals in different formats for performing impedance matching
    Patent number: 8912819
    Abstract: A termination circuit is provided. The termination circuit includes a first receiving terminal, a second receiving terminal, a first resistive device, a second resistive device, a third resistive device, a fourth resistive device and a first switch. The first receiving terminal receives a first data signal. The second receiving terminal receives a second data signal. The first resistive device is coupled between a supply voltage and the first receiving terminal. The second resistive device is coupled between the supply voltage and the second receiving terminal. The third resistive device is coupled between the first receiving terminal and a first node. The fourth resistive device is coupled between the second receiving terminal and the first node. The first switch is coupled between the supply voltage and the first node.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: December 16, 2014
    Assignee: MediaTek Inc.
    Inventors: Qui-Ting Chen, Huai-Te Wang
  • DISTRIBUTED DATA PROCESSING SYSTEM, DISTRIBUTED DATA PROCESSING METHOD AND WIRELESS TERMINAL POINT THEREOF
    Publication number: 20140365670
    Abstract: A distributed data processing system, a distributed data processing method and a wireless terminal point thereof are disclosed, where the distributed data process system includes a first access controller, a plurality of second access controllers and a wireless terminal point (WTP). When receiving a list containing address information of the second access controllers from the first access controller, the WTP selects one of the second access controllers to serve as a designated second access controller and connects the designated second access controller.
    Type: Application
    Filed: October 4, 2013
    Publication date: December 11, 2014
    Applicant: ACCTON TECHNOLOGY CORPORATION
    Inventors: Te-An WANG, Chun-Sen SUN, Chung-Jen CHEN, Tan-Chun LU
  • CROSSTALK-PROOF RECEPTACLE CONNECTOR
    Publication number: 20140342607
    Abstract: A crosstalk-proof receptacle connector includes: multiple insulative boards arranged abreast; multiple sets of terminals mounted respectively in and corresponding to the insulative boards, and each set including signal terminals and grounding terminals; multiple shielding plates corresponding to the insulative boards and corresponding to the sets of the terminals, each shielding plate mounted on one of two opposite sides of a corresponding insulative board and having multiple current-path-interrupting holes defined through the shielding plate and kept hollow without being inserted by objects, and each shielding plate connected to the grounding terminals of a corresponding set of the terminals; and an outer casing covering the insulative boards to combine the insulative boards. The crosstalk-proof receptacle connector suppresses crosstalk and improves efficiency and stability of signal transmission.
    Type: Application
    Filed: April 24, 2014
    Publication date: November 20, 2014
    Applicant: Advanced-Connectek Inc.
    Inventors: Yao-Te WANG, Kuo-Ching LEE, Ya-Ping LIANG, Jian-Li GUAN
  • Mask pattern and correcting method thereof
    Patent number: 8885917
    Abstract: A mask pattern and a correcting method thereof are provided. The correcting method includes the following steps. An original pattern having a first original contour and a second original contour is provided. The first original contour has a first original corner. The second original contour has a second original corner, which is near the first original corner. The first and second original corners are cut to form a cut pattern. An optical proximity correction (OPC) process is applied to the cut pattern to form the mask pattern.
    Type: Grant
    Filed: December 27, 2011
    Date of Patent: November 11, 2014
    Assignee: United Microelectronics Corp.
    Inventors: Te-Hsien Hsieh, Ming-Jui Chen, Cheng-Te Wang, Jing-Yi Lee
  • Process of ultra thick trench etch with multi-slope profile
    Patent number: 8884441
    Abstract: The present disclosure relates to an integrated chip (IC) having an ultra-thick metal layer formed in a metal layer trench having a rounded shape that reduces stress between an inter-level dielectric (ILD) layer and an adjacent metal layer, and a related method of formation. In some embodiments, the IC has an inter-level dielectric layer disposed above a semiconductor substrate. The ILD layer has a cavity with a sidewall having a plurality of sections, wherein respective sections have different slopes that cause the cavity to have a rounded shape. A metal layer is disposed within the cavity. The rounded shape of the cavity reduces stress between the ILD layer and the metal layer to prevent cracks from forming along an interface between the ILD layer and the metal layer.
    Type: Grant
    Filed: February 18, 2013
    Date of Patent: November 11, 2014
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Hung Hsueh, Wei-Te Wang, Shao-Yu Chen, Chun-Liang Fan, Kuan-Chi Tsai
  • CROSSTALK-PROOF RECEPTACLE CONNECTOR
    Publication number: 20140295705
    Abstract: A crosstalk-proof receptacle connector has multiple insulative boards, multiple sets of terminals, multiple sets of shielding plates and an outer casing. The insulative boards are arranged abreast. The sets of the terminals are mounted respectively in the insulative boards. The terminals of each set are classified into signal terminals and grounding terminals. Each set of the shielding plates is mounted on one of two opposite sides of a corresponding insulative board. The shielding plates of each set are spaced apart without contacting one another. Each shielding plate has multiple folding sections capable of interrupting signal noise. The outer casing covers the insulative boards to combine the insulative boards. The sets of the shielding plates decrease signal interference of the receptacle connector and improve signal transmission efficiency and stability.
    Type: Application
    Filed: March 21, 2014
    Publication date: October 2, 2014
    Applicant: Advanced-Connectek Inc.
    Inventors: Kuo-Ching LEE, Jian-Li GUAN, Ya-Ping LIANG, Yao-Te WANG
  • METHOD FOR MANUFACTURING MAGNET-CONDUCTIVE DEVICE AND GLUE-INJECTABLE PUNCH STRUCTURE THEREOF
    Publication number: 20140284837
    Abstract: A method for manufacturing a magnet-conductive device includes performing a punch process to a plate by a glue-injectable punch structure, wherein the glue-injectable punch structure includes a punch head and a control member. The punch head comprises an accommodating cavity, an injection hole and an inlet, and a supply channel is formed by the accommodating cavity, the injection hole and the inlet. The control member selectively obstructs the supply channel or permits the supply channel into conduction. By using the method for manufacturing the magnet-conductive device, the stack between plural plates is simplified, and the coupling strength between adjacent plates is enhanced. In addition, this invention considers the gel between adjacent plates to be insulating medium to lower the iron loss of the magnet-conductive plates.
    Type: Application
    Filed: March 7, 2014
    Publication date: September 25, 2014
    Applicant: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
    Inventors: Kuo-Yin Tu, Hsing-Chih Tsai, Hsin-Te Wang, Yi-Wei Sun
  • TERMINATION CIRCUITS CAPABLE OF RECEIVING DATA SIGNALS IN DIFFERENT FORMATS FOR PERFORMING IMPEDANCE MATCHING
    Publication number: 20140266298
    Abstract: A termination circuit is provided. The termination circuit includes a first receiving terminal, a second receiving terminal, a first resistive device, a second resistive device, a third resistive device, a fourth resistive device and a first switch. The first receiving terminal receives a first data signal. The second receiving terminal receives a second data signal. The first resistive device is coupled between a supply voltage and the first receiving terminal. The second resistive device is coupled between the supply voltage and the second receiving terminal. The third resistive device is coupled between the first receiving terminal and a first node. The fourth resistive device is coupled between the second receiving terminal and the first node. The first switch is coupled between the supply voltage and the first node.
    Type: Application
    Filed: March 18, 2013
    Publication date: September 18, 2014
    Applicant: MEDIATEK INC.
    Inventors: Qui-Ting CHEN, Huai-Te WANG
  • Streetlight system and method for escaping from disaster using the same
    Patent number: 8836540
    Abstract: A streetlight system includes a plurality of streetlights, disaster warning systems positioned at each of the streetlights and a control center electrically connected with the disaster warning systems. The streetlights are positioned at roadways. Each of the disaster warning systems includes a control system and a broadcasting system. When the control center receives a disaster alert signal, the control center transmits information of disaster shelters and evacuating routes to control system, and the broadcasting system broadcasts information of the disaster shelters and the evacuating routes to people for leading people to escape.
    Type: Grant
    Filed: December 5, 2012
    Date of Patent: September 16, 2014
    Assignees: GDS Software (ShenZhen) Co., Ltd, Hon Hai Precision Industry Co., Ltd.
    Inventors: Chi-Chih Wang, Tzu-Te Wang, Bo Ming
  • MASK SET FOR DOUBLE EXPOSURE PROCESS AND METHOD OF USING THE MASK SET
    Publication number: 20140258946
    Abstract: A mask set for double exposure process and method of using said mask set. The mask set is provided with a first mask pattern having a first base and a plurality of first teeth and protruding portions, and a second mask pattern having a second base and a plurality of second teeth, wherein the second base may at least partially overlap the first base such that each of the protruding portions at least partially overlaps one of the second teeth.
    Type: Application
    Filed: May 26, 2014
    Publication date: September 11, 2014
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Fang Kuo, Ming-Jui Chen, Ting-Cheng Tseng, Cheng-Te Wang
  • SURFACE MOUNT CONNECTOR
    Publication number: 20140242850
    Abstract: An electrical connector includes a housing and a terminal module assembly. The terminal module assembly includes pairs of first terminal assemblies and second terminal assemblies. Each first terminal assembly comprises a first terminal block with at least one first protrusion and at least one first recess, and a plurality of first terminals securely extending through the first terminal block. Each second terminal assembly comprises a second terminal block with at least one second protrusion and at least one second recess and a plurality of second terminals securely extending through the second terminal block. The first protrusion is engaged with the second recess, the second protrusion is engaged with the first recess, and bottom surfaces of the first and second protrusions are secured in notches on the top surface of a interior wall when the terminal module assembly is received in the housing.
    Type: Application
    Filed: May 6, 2014
    Publication date: August 28, 2014
    Applicant: ADVANCED CONNECTEK INC.
    Inventors: Kou-Ching LEE, Jian-Li GUAN, Ya-Ping LIANG, Yao-Te WANG
  • Process of Ultra Thick Trench Etch with Multi-Slope Profile
    Publication number: 20140231955
    Abstract: The present disclosure relates to an integrated chip (IC) having an ultra-thick metal layer formed in a metal layer trench having a rounded shape that reduces stress between an inter-level dielectric (ILD) layer and an adjacent metal layer, and a related method of formation. In some embodiments, the IC has an inter-level dielectric layer disposed above a semiconductor substrate. The ILD layer has a cavity with a sidewall having a plurality of sections, wherein respective sections have different slopes that cause the cavity to have a rounded shape. A metal layer is disposed within the cavity. The rounded shape of the cavity reduces stress between the ILD layer and the metal layer to prevent cracks from forming along an interface between the ILD layer and the metal layer.
    Type: Application
    Filed: February 18, 2013
    Publication date: August 21, 2014
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Hung Hsueh, Wei-Te Wang, Shao-Yu Chen, Chun-Liang Fan, Kuan-Chi Tsai
  • Method of optical proximity correction according to complexity of mask pattern
    Patent number: 8806391
    Abstract: A method of optical proximity correction (OPC) includes the following steps. At first, a layout pattern is provided to a computer system. Subsequently, the layout pattern is classified into at least a first region and at least a second region. Then, several iterations of OPC calculations are performed to the layout pattern, and a total number of OPC calculations performed in the first region is substantially larger than a total number of OPC calculations performed in the second region. Afterwards, a corrected layout pattern is outputted through the computer system onto a mask.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: August 12, 2014
    Assignee: United Microelectronics Corp.
    Inventors: Te-Hsien Hsieh, Ming-Jui Chen, Cheng-Te Wang, Shih-Ming Kuo, Jing-Yi Lee
  • White balance method and apparatus thereof
    Patent number: 8786729
    Abstract: An entered image is divided into a plurality of windows and it is determined, on a per-window basis, whether the image data within an applicable window is indicative of the color white, based upon the position of each window in the image and the continuity to its surrounding divided windows. A white balance method is performed based upon data of a window determined to be indicative of the color white. The present invention conducts a white balance process through the addition of determining the light source type weight and calculating the continuity of each divided window and its surrounding divided windows. In order the white balance process to accurately obtain the colors of an entered image even under the conditions of specific scenes with distinctive colors.
    Type: Grant
    Filed: July 17, 2012
    Date of Patent: July 22, 2014
    Assignee: Altek Corporation
    Inventors: Shih-Yuan Peng, Hsin-Te Wang, Hong-Long Chou
  • Mask set for double exposure process and method of using the mask set
    Patent number: 8778604
    Abstract: A mask set for double exposure process and method of using said mask set. The mask set is provided with a first mask pattern having a first base and a plurality of first teeth and protruding portions, and a second mask pattern having a second base and a plurality of second teeth, wherein the second base may at least partially overlap the first base such that each of the protruding portions at least partially overlaps one of the second teeth.
    Type: Grant
    Filed: April 24, 2012
    Date of Patent: July 15, 2014
    Assignee: United Microelectronics Corp.
    Inventors: Hui-Fang Kuo, Ming-Jui Chen, Ting-Cheng Tseng, Cheng-Te Wang
  • METHOD AND ASSOCIATED SYSTEM FOR DISPLAYING GRAPHIC CONTENT ON EXTENSION SCREEN
    Publication number: 20140189602
    Abstract: A method for displaying graphic content on an extension screen, comprising: when a detected user activity at a host screen is matched to one of a plurality of gestures, providing a gesture icon in response to the matched gesture; and providing a shared content according to an original content, such that a combined content, which is a combination of the shared content and the gesture icon, can be displayed on the extension screen. An associated system is also disclosed.
    Type: Application
    Filed: December 28, 2012
    Publication date: July 3, 2014
    Applicant: MEDIATEK INC.
    Inventors: Tsung-Te Wang, Hui-Wen Wang, Shiau-Wei Chiou, Hsin-Hsiung Chiu, Wei-Ting Hsieh