Abstract: A semiconductor device (such as a DRAM) includes a memory array that has dynamic memory cells. In a self refresh test mode, a self refresh test mode controller monitors and/or controls various blocks and internal signals in the semiconductor device. The self refresh test mode controller may communicate with a remote testing device through various conductors including one or more DQ lines and/or one or more address lines.

Abstract: A semiconductor device (such as a DRAM) includes a memory array that has dynamic memory cells. In a self refresh test mode, a self refresh test mode controller monitors and/or controls various blocks and internal signals in the semiconductor device. The self refresh test mode controller may communicate with a remote testing device through various conductors including one or more DQ lines and/or one or more address lines.

Abstract: An improved technique and associated apparatus for timing calibration of a logic device is provided. A calibration test pattern is transferred to a logic device first at a data rate slower than normal operating speed to ensure correct capture of the pattern at the device to be calibrated. Once the pattern is correctly captured and stored, the test pattern is transmitted to the logic device at the normal operating data rate to perform timing calibration. The improved technique and apparatus permits the use of any pattern of bits as a calibration test pattern, programmable by the user or using easily-interchangeable hardware.

Abstract: An apparatus and method for independently adjusting or calibrating the characteristics of multiple drivers for output buffer circuits without significantly increasing the associated necessary circuitry is disclosed. A central control logic circuit initiates the calibration process of the drivers. A serial communication link is provided between the control logic and each of the output drivers. The serial link reduces the number of lines that are required to communicate between the central control logic and the multiple output drivers. The output drivers can be calibrated one at a time, and a handoff is made from one driver to the next to start the calibration of the subsequent driver.

Abstract: A synchronous dynamic random access memory (“SDRAM”) operates with matching read and write latencies. To prevent data collision at the memory array, the SDRAM includes interim address and interim data registers that temporarily store write addresses and input data until an available interval is located where no read data or read addresses occupy the memory array. During the available interval, data is transferred from the interim data register to a location in the memory array identified by the address in the interim array register. In one embodiment, the SDRAM also includes address and compare logic to prevent reading incorrect data from an address to which the proper data has not yet been written. In another embodiment, a system controller monitors commands and addresses and inserts no operation commands to prevent such collision of data and addresses.

Abstract: The signal integrity of a high speed heavily loaded multidrop memory bus is often degraded due the numerous impedance mismatches. The impedance mismatches causes the bus to exhibit a nonlinear frequency response, which diminishes signal integrity and limits the bandwidth of the bus. A compensating element, such as a capacitor which ties the bus to a reference plane (e.g., a ground potential), or an inductor wired in series with the bus, is located approximately midway between the memory controller and the memory slots. The use of the compensating element equalizes signal amplitudes and minimizes phase errors of signals in an interested frequency range and diminishes the amplitudes of high frequency signals which exhibit high degrees of phase error. The resulting bus structure has increased desirable harmonic content with low phase error, thereby permitting the bus to exhibit better rise time performance and permitting a higher data transfer rate.

Abstract: Optically-coupled memory systems are disclosed. In one embodiment, a system memory includes a carrier substrate, and a controller attached to the carrier substrate and operable to transmit and receive optical signals, and first and second memory modules. The module substrate of the first memory module has an aperture formed therein, the aperture being operable to provide an optical path for optical signals between the controller and an optical transmitter/receiver unit of the second memory module. Thus, the system memory provides the advantages of “free space” optical connection in a compact arrangement of memory modules. In an alternate embodiment, the first memory module includes a beam splitter attached to the module substrate proximate the aperture. In another embodiment, the first and second memory modules are staged on the carrier substrate to provide an unobstructed path for optical signals.

Abstract: A technique is provided for installing circuit components, such as memory devices, in a support, such as a socket. The device to be installed is supported in a holder or shell. The holder is positioned over a support region in the receiving socket. A manual actuator is pressed into the holder to eject the device from the holder and to install the device in the support. The holder may be configured to hold a single device, or multiple devices aligned in slots defined by partitions. A multi-device tray may be provided for indexing devices toward an ejection slot, through which the devices are installed by manual actuation of an ejecting actuator. The technique provides protection for the device prior to and during installation, and facilitates manual installation of such devices without requiring direct hand contact with the device either prior to or during installation.

Abstract: A semiconductor die assembly employing a voltage reference plane structure electrically isolated from, but in immediate proximity to, leads of a lead frame to which the die is electrically connected. A non-conductive adhesive or an adhesively-coated dielectric film is used to position the voltage reference plane on the leads. The voltage reference plane is electrically connected to a ground or other reference potential pin of the die through a connection to one of the leads. The assembly is encapsulated, preferably by transfer-molding of a filled polymer. More than one discrete voltage reference plane structure may be employed, for example, when the package is of an LOC configuration with two rows of leads, each having a voltage reference plane secured thereto, or a single voltage reference plane including major portions adhered to leads and interposed connection portions may be applied to all of the leads of an assembly.

Abstract: The signal integrity of a high speed heavily loaded multidrop memory bus is often degraded due the numerous impedance mismatches. The impedance mismatches causes the bus to exhibit a nonlinear frequency response, which diminishes signal integrity and limits the bandwidth of the bus. A compensating element, such as a capacitor which ties the bus to a reference plane (e.g., a ground potential), or an inductor wired in series with the bus, is located approximately midway between the memory controller and the memory slots. The use of the compensating element equalizes signal amplitudes and minimizes phase errors of signals in an interested frequency range and diminishes the amplitudes of high frequency signals which exhibit high degrees of phase error. The resulting bus structure has increased desirable harmonic content with low phase error, thereby permitting the bus to exhibit better rise time performance and permitting a higher data transfer rate.

Abstract: An improved technique and associated apparatus for timing calibration of a logic device is provided. A calibration test pattern is transferred to a logic device first at a data rate slower than normal operating speed to ensure correct capture of the pattern at the device to be calibrated. Once the pattern is correctly captured and stored, the test pattern is transmitted to the logic device at the normal operating data rate to perform timing calibration. The improved technique and apparatus permits the use of any pattern of bits as a calibration test pattern, programmable by the user or using easily-interchangeable hardware.

Abstract: A method and apparatus for monitoring the response times of computer system components in order to improve computer system reliability and performance are provided. The method and apparatus are particularly applicable to computer systems with memory circuits, such as SLDRAMs, that have programmable response times. A response time monitoring circuit in the form of a phase detector includes a plurality of flip-flops with the data inputs commonly connected to receive a response ready signal from a component, such as a memory circuit, in response to a command to perform a task. Each clock input of the flip-flop is connected to a clock signal at a different phase of a response period. The outputs of the flip-flops determine the phase at which the response ready signal was generated by the component.

Abstract: A computer system includes a controller linked to a plurality of memory modules each of which has an optical memory hub and several memory devices coupled to the memory hub. The controller communicates with the memory hubs by coupling optical signals to and from the memory hubs using an optical communication path, such as one or more optical waveguides. In one example of the invention, the memory modules transmit and receive optical signals having different wavelengths. In another example of the invention, the memory modules receive optical signals corresponding to memory command and address signals at different wavelengths, but they transmit and receive optical signals corresponding to memory commands at the same wavelength.

Abstract: A computer system includes a memory hub controller coupled to a plurality of memory modules. The memory hub controller includes a memory request queue that couples memory requests and corresponding request identifier to the memory modules. Each of the memory modules accesses memory devices based on the memory requests and generates response status signals from the request identifier when the corresponding memory request is serviced. These response status signals are coupled from the memory modules to the memory hub controller along with or separate from any read data. The memory hub controller uses the response status signal to control the coupling of memory requests to the memory modules and thereby control the number of outstanding memory requests in each of the memory modules.

Abstract: A vertically mountable semiconductor device assembly including a semiconductor device and a mechanism for attaching the semiconductor device to a carrier substrate. The semiconductor device has each of its bond pads disposed proximate a single edge thereof. Preferably, at least a portion of the semiconductor device is exposed. An alignment device is attached to a carrier substrate. A mounting element on the vertically mountable semiconductor device package engages the alignment device to interconnect the semiconductor device and the alignment device. Preferably, the alignment device secures the vertically mountable semiconductor device package perpendicular relative to the carrier substrate. The distance between the bond pads and corresponding terminals on the carrier substrate is very small in order to reduce impedance. The vertically mountable semiconductor device package may also be readily user-upgradable.

Abstract: A method and apparatus for monitoring the response times of computer system components in order to improve computer system reliability and performance are provided. The method and apparatus are particularly applicable to computer systems with memory circuits, such as SLDRAMs, that have programmable response times. A response time monitoring circuit in the form of a phase detector includes a plurality of flip-flops with the data inputs commonly connected to receive a response ready signal from a component, such as a memory circuit, in response to a command to perform a task. Each clock input of the flip-flop is connected to a clock signal at a different phase of a response period. The outputs of the flip-flops determine the phase at which the response ready signal was generated by the component.

Abstract: A synchronization circuit performs bit-to-bit timing correction of respective digital signals in digital signal packets applied to a packetized memory device. Each digital signal packet includes a plurality of digital signals applied to respective latches in the packetized memory device. A clock generator circuit generates a plurality of internal clock signals responsive to the external clock signal, each internal clock signal having a corresponding phase relative to the external clock signal. A plurality of selection circuits are coupled to the clock generator circuit and each has an output coupled to a clock terminal of an associated latch. Each selection circuit applies one of the internal clock signals to clock the associated latch in response to a phase command signal. An evaluation circuit receives digital signals sequentially stored in a selected one of the latches and generates a results signal indicating whether each of the digital signals has an expected value.

Abstract: A semiconductor package for vertically surface mounting to a printed circuit board having retention apparatus for holding the package thereto.

Abstract: A semiconductor package for vertically surface mounting to a printed circuit board having retention apparatus for holding the package thereto.

Abstract: A semiconductor device (such as a DRAM) includes a memory array that has dynamic memory cells. In a self refresh test mode, a self refresh test mode controller monitors and/or controls various blocks and internal signals in the semiconductor device. The self refresh test mode controller may communicate with a remote testing device through various conductors including one or more DQ lines and/or one or more address lines.