Abstract: An electronic module includes: a plurality of heat generating members provided over a first surface of a board; a frame joined to the first surface of the board and provided between the plurality of heat generating members that are arranged; and a lid configured to cover the first surface of the board and thermally coupled to each of the plurality of heat generating members, the frame being a grid-shaped frame or a mesh-shaped frame.

Abstract: A semiconductor apparatus includes: a substrate; a plurality of semiconductor devices mounted on a first surface of the substrate; a heat spreader coupled to a second side opposite to a first side, which is coupled to the substrate, of the plurality of semiconductor devices; an underfill provided in a gap between the substrate and the plurality of semiconductor devices; and a heat conductive resin provided between the heat spreader and the underfill.

Abstract: A cooling apparatus includes a heat sink including a plurality of fins on one surface of a base portion, and a coolant supply unit configured to supply a coolant to the fins of the heat sink, wherein a water-repellent area and a hydrophilic area are formed on a surface of each of the fins, and the hydrophilic area is formed on a base portion side of each of the fins and the water-repellent area is formed on a side away from the base portion.

Abstract: A cooling apparatus includes: an evaporator in which a coolant is housed and that evaporates the coolant; a condenser that condenses the coolant evaporated by the evaporator; a pathway section that includes a vapor path and a liquid path each placing the inside of the evaporator and the inside of the condenser in communication with each other, and that circulates the coolant between the evaporator and the condenser; a valve that is provided to at least one path out of the vapor path or the liquid path; and a pressure regulation section that increases an opening amount of the valve according to an increase in pressure inside the evaporator.

Abstract: A heat transport device includes: a heat receiving member that receives heat; a heat dissipation member that dissipates heat; a coolant circulation path that includes a main flow portion in which coolant flows and split flow portions where part of the main flow portion is split into plural flow paths, and that causes coolant to circulate between the heat receiving member and the heat dissipating member; pumps that are provided to the respective split flow portions; and a bypass flow path that forms a bypass between the respective split flow portions on an outlet side of the pumps and the main flow portion.

Abstract: A cooling apparatus includes: a circulation path of coolant; a first pump provided in the circulation path, the first pump including a first inlet and a first outlet; a second pump connected to the first pump, the second pump including a second inlet and a second outlet; a first main pipe with one end connected to the first outlet; a second main pipe with one end connected to the second inlet; a connection portion connecting another ends of the first and second main pipe; a first bypass pipe connecting the first inlet and the connection portion; and a second bypass pipe connecting the second outlet and the connection portion, wherein the first main pipe and the second bypass pipe are connected in a same direction in the connection portion, and the second main pipe and the first bypass pipe are connected in the same direction.

Abstract: A cooling device includes: a refrigerant circulation loop configured to depressurizing the inside thereof, the refrigerant circulation loop includes, an evaporator that vaporizes a part of refrigerant by heat generated by an electronic component, a condenser that cools the refrigerant, and a pump that circulates the refrigerant, wherein a filling ratio of liquid refrigerant to a volume of the refrigerant circulation loop is configured to maintain a refrigerant circulation capability of the pump.

Abstract: A cooling apparatus includes a first cooling plate, a second cooling plate provided on the first cooling plate, and a controller that performs, in a normal state, control for supplying coolant to the first cooling plate and performs, in a non-normal state other than the normal state, control for supplying the coolant to the first cooling plate and the second cooling plate.

Abstract: A cooling system, includes: an evaporator configured to take heat from a heat source by latent heat of evaporation of liquid; an aspirator configured to suck vapor generated in the evaporator and decompress an inside of the evaporator; a liquid supplying unit configured to supply liquid to the aspirator and the evaporator; and a gas mixing unit configured to mix gas into the liquid to be supplied from the liquid supplying unit to the evaporator.

Abstract: A cooling apparatus includes: an evaporator in which a coolant is housed and that evaporates the coolant; a condenser that condenses the coolant evaporated by the evaporator; a pathway section that includes a vapor path and a liquid path each placing the inside of the evaporator and the inside of the condenser in communication with each other, and that circulates the coolant between the evaporator and the condenser; a valve that is provided to at least one path out of the vapor path or the liquid path; and a pressure regulation section that increases an opening amount of the valve according to an increase in pressure inside the evaporator.

Abstract: A cooling apparatus includes: a circulation path of coolant; a first pump provided in the circulation path, the first pump including a first inlet and a first outlet; a second pump connected to the first pump, the second pump including a second inlet and a second outlet; a first main pipe with one end connected to the first outlet; a second main pipe with one end connected to the second inlet; a connection portion connecting another ends of the first and second main pipe; a first bypass pipe connecting the first inlet and the connection portion; and a second bypass pipe connecting the second outlet and the connection portion, wherein the first main pipe and the second bypass pipe are connected in a same direction in the connection portion, and the second main pipe and the first bypass pipe are connected in the same direction.

Abstract: A cooling system includes: an evaporator; a condenser; a feed pipe including a feed pipe body configured to couple an opening portion within the evaporator and the condenser, at least a portion of the feed pipe body in a longitudinal direction having an inner cross-sectional area smaller than an inner cross-sectional area of the opening portion; a return pipe configured to couple the condenser and the evaporator; and a bypass pipe configured to couple the evaporator and the feed pipe body.

Abstract: A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.

Abstract: A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.

Abstract: A cooling system, includes: an evaporator configured to take heat from a heat source by latent heat of evaporation of liquid; an aspirator configured to suck vapor generated in the evaporator and decompress an inside of the evaporator; a liquid supplying unit configured to supply liquid to the aspirator and the evaporator; and a gas mixing unit configured to mix gas into the liquid to be supplied from the liquid supplying unit to the evaporator.

Abstract: A cooling device comprising a heat receiver attached to a heat generating member and using a flow of coolant to rob heat from the heat generating member, a heat exchanger radiating off heat from the inflowing coolant to lower the temperature of the coolant, a first channel carrying the coolant from the heat receiver to the heat exchanger, a second channel carrying the coolant from the heat exchanger to the heat receiver, and a pump for making the coolant move, wherein, as the coolant, a mixed working fluid comprised of pure water or impure water containing nanoparticles plus ethanol to give an alcohol concentration of ethanol 0.1 mass % to 5 mass % is used to improve the freezing resistance.

Abstract: A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.

Abstract: A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.

Abstract: A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.

Abstract: A cooling system includes: an evaporator; a condenser; a feed pipe including a feed pipe body configured to couple an opening portion within the evaporator and the condenser, at least a portion of the feed pipe body in a longitudinal direction having an inner cross-sectional area smaller than an inner cross-sectional area of the opening portion; a return pipe configured to couple the condenser and the evaporator; and a bypass pipe configured to couple the evaporator and the feed pipe body.