Patents by Inventor Teru Nakanishi

Teru Nakanishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated electronic device having flip-chip connection with circuit board
    Patent number: 5977637
    Abstract: An integrated electronic device having an electric connection between a first electrode of a semiconductor chip and a second electrode of a circuit board. One embodiment according to the present invention is a method for fabricating an integrated electronic device having an electric connection between a first electrode of a semiconductor chip and a second electrode of a circuit board, both surfaces of the first and second electrodes having an adhesive tendency to molten metal, the method comprising the steps of forming a metal bump on the first electrode, the metal bump being made of a soldering metal alloy consisting of a solid phase component and a liquid phase component at an operating temperature; and forming an electric connection between the first electrode and the second electrode by heating the soldering metal alloy so as to adhere to the surface of the second electrode.
    Type: Grant
    Filed: December 19, 1996
    Date of Patent: November 2, 1999
    Assignee: Fujitsu Limited
    Inventors: Toshiya Akamatsu, Kazuaki Karasawa, Teru Nakanishi, Kozo Shimizu
  • Integrated electronic device having flip-chip connection with circuit board and fabrication method thereof
    Patent number: 5611481
    Abstract: An integrated electronic device having an electric connection between a first electrode of a semiconductor chip and a second electrode of a circuit board. One embodiment according to the present invention is a method for fabricating an integrated electronic device having an electric connection between a first electrode of a semiconductor chip and a second electrode of a circuit board, both surfaces of the first and second electrodes having an adhesive tendency to molten metal, the method comprising the steps of forming a metal bump on the first electrode, the metal bump being made of a soldering metal alloy consisting of a solid phase component and a liquid phase component at an operating temperature; and forming an electric connection between the first electrode and the second electrode by heating the soldering metal alloy so as to adhere to the surface of the second electrode.
    Type: Grant
    Filed: July 19, 1995
    Date of Patent: March 18, 1997
    Assignee: Fujitsu Limited
    Inventors: Toshiya Akamatsu, Kazuaki Karasawa, Teru Nakanishi, Kozo Shimizu
  • Process for flip chip connecting a semiconductor chip
    Patent number: 5284796
    Abstract: A process for a flip chip connection of a semiconductor chip includes the steps of forming a plurality of stud bumps on the semiconductor chip, on which a plurality of solder bumps are formed, in the vicinity of the outer periphery thereof and on the outside of the solder bumps, providing a cut groove between a plurality of the solder bumps and the stud bumps, mating the solder bumps on the semiconductor chip and the corresponding solder bumps on the circuit board and heating for subsequent integration of the mating solder bumps, and breaking way the outer peripheral portion of the semiconductor chip along the cutting groove after a flip chip connection in order to remove the stud bumps.
    Type: Grant
    Filed: September 2, 1992
    Date of Patent: February 8, 1994
    Assignee: Fujitsu Limited
    Inventors: Teru Nakanishi, Kazuaki Karasawa, Masayuki Ochiai, Kaoru Hashimoto