Abstract: An object of technology disclosed herein is to improve cooling performance for plural heat generating bodies. A cooling system includes a heat dissipating section, plural heat receiving sections, and a bypass section. The heat dissipation section dissipates heat from a coolant by exchanging heat with an external fluid. The plural heat receiving sections are connected in parallel to the heat dissipating section, and heat generated by respective heat generating bodies is absorbed by the coolant. The bypass section couples at least one of the heat receiving sections out of the plurality of heat receiving sections to another heat receiving section.

Abstract: An object of technology disclosed herein is improving cooling efficiency. A heat exchanger includes plural pipes and a tank. The plural pipes are arrayed side-by-side. The tank couples together end portions of neighboring pipes among the plurality of pipes, and allows a coolant to flow from one of the neighboring pipes to another of the neighboring pipes.

Abstract: A cooling device includes: an evaporator that vaporizes a part of a refrigerant by heat generated by an electronic component; a condenser that cools the refrigerant; a refrigerant circulation loop coupled to the evaporator and the condenser, an inside of the refrigerant circulation loop is depressurized; and a pump that circulates the refrigerant, wherein a filling ratio of the liquid refrigerant to a volume of the refrigerant circulation loop is 50% or more.

Abstract: An electronic device includes a wiring board including a first electrode and a second electrode, a semiconductor device mounted on the wiring board and including a first terminal and a second terminal, an interposer provided between the wiring board and the semiconductor device, the interposer including a conductive pad and a sheet supporting the conductive pad, the conductive pad having a first surface on a side of the wiring board and a second surface on a side of the semiconductor device, a first solder connecting the first electrode positioned outside of an area in which the interposer is disposed with the first terminal positioned outside of the area, a second solder connecting the second electrode positioned inside of the area with the first surface of the conductive pad, and a third solder connecting the second terminal positioned inside of the area with the second surface of the conductive pad.

Abstract: A superconductive filter includes a superconductive filter substrate having a dielectric substrate and a plurality of resonator patterns formed on a surface of the dielectric substrate, the plurality of resonator patterns including a superconductive material; a package accommodating the superconductive filter substrate; and an intermediate substrate disposed between an inner surface of the package and the superconductive filter substrate, and thermally coupling the package and the superconductive filter substrate wherein a difference between a degree of contraction of the intermediate substrate and the degree of contraction of the dielectric substrate is smaller than a difference between the degree of contraction of the dielectric substrate and the degree of contraction of the package, when the package, the intermediate substrate, and the dielectric substrate are cooled from room temperature to a critical temperature of the resonator patterns.

Abstract: A filter includes a dielectric substrate; an electrode layer continuously formed covering a first side of the dielectric substrate; a disk-shaped electrode pattern provided on a second side of the dielectric substrate, the disk-shaped electrode pattern and the electrode layer holding the dielectric substrate therebetween; a ground slot having an opening that is formed asymmetrically with respect to the center of a circular area included in the electrode layer and exposes the dielectric substrate, the circular area and the disk-shaped electrode pattern holding the dielectric substrate therebetween.

Abstract: The coaxial connector 10 to be connected with a coaxial cable has a surface covering layer 20 formed of a metal material which causes an eutectic reaction with In on the surface of a terminal 12 which is a core conductor. Because of the surface covering layer 20 of a metal material which causes the eutectic reaction with In formed on the surface of the terminal of the coaxial connector, the terminal of the coaxial connector and the electrode of a superconductor device can be jointed to each other by the solder layer of In-based solder at a relatively low temperature. Thus, the discharge of oxygen from the inside of the superconductor film of a superconductor filter can be suppressed, and the decrease of the critical temperature TC can be suppressed.

Abstract: An electronic device includes a wiring board; a semiconductor device arranged at an upper side of the wiring board with an electrically conductive member being arranged therebetween; a covering member arranged at an upper side of the semiconductor device; and a supporting member arranged at a lower side of the wiring board, the supporting member having a convex portion facing the wiring board, the supporting member being connected to the covering member and supporting the wiring board at the convex portion.

Abstract: An electronic device includes an electronic component mounted on a substrate; a cooling system for cooling the electronic component; and a fastening structure for fastening the cooling system to the substrate. The fastening structure includes a first magnet provided to one of the substrate and the cooling system, a second magnetic material fixed to the other of the substrate and the cooling system and magnetically coupled with the first magnet, and a magnetic shield that covers a part or all of the first magnet except for a coupling face to be coupled with the second magnetic material.

Abstract: An electronic device includes a wiring board including a first electrode and a second electrode, a semiconductor device mounted on the wiring board and including a first terminal and a second terminal, an interposer provided between the wiring board and the semiconductor device, the interposer including a conductive pad and a sheet supporting the conductive pad, the conductive pad having a first surface on a side of the wiring board and a second surface on a side of the semiconductor device, a first solder connecting the first electrode positioned outside of an area in which the interposer is disposed with the first terminal positioned outside of the area, a second solder connecting the second electrode positioned inside of the area with the first surface of the conductive pad, and a third solder connecting the second terminal positioned inside of the area with the second surface of the conductive pad.

Abstract: An electronic device includes an electronic component mounted on a substrate; a cooling system for cooling the electronic component; and a fastening structure for fastening the cooling system to the substrate. The fastening structure includes a first magnet provided to one of the substrate and the cooling system, a second magnetic material fixed to the other of the substrate and the cooling system and magnetically coupled with the first magnet, and a magnetic shield that covers a part or all of the first magnet except for a coupling face to be coupled with the second magnetic material.

Abstract: A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.

Abstract: In a wall of a package base made of aluminum or aluminum alloy, there is formed a through-hole, through which a semi-rigid coaxial cable passes. A central conductor of the semi-rigid coaxial cable is joined to an electrode with a solder material. The semi-rigid coaxial cable has an insulating material through which the central conductor passes and an outer conductor provided therearound. The central conductor and outer conductor are made of stainless steel, for example, and the insulating material is made of fluororesin, for example. Inside the through-hole, the wall of the package base and the outer conductor are electrically connected to each other via a stainless material within the hole formed in a cylindrical fluororesin material. The semi-rigid coaxial cable and the like are fixed to the wall with a conductive screw.

Abstract: A resonance pattern (21) made of conductive material and having a circular plan shape is formed over the principal surface of a dielectric substrate. First and second virtual straight lines mutually crossing at a right angle are defined. A first input port (22) and a first output port (23) are electromagnetically coupled to the resonance pattern at two cross points between the first virtual straight line and an outer circumference line of the resonance pattern. A second input port (24) and a second output port (25) are electromagnetically coupled to the resonance pattern at two cross points between the second virtual straight line and the outer circumference line of the resonance pattern. A first inter-port waveguide (26) propagates a high frequency signal output to the first output port to the second input port.

Abstract: An electronic device includes a wiring board; a semiconductor device arranged at an upper side of the wiring board with an electrically conductive member being arranged therebetween; a covering member arranged at an upper side of the semiconductor device; and a supporting member arranged at a lower side of the wiring board, the supporting member having a convex portion facing the wiring board, the supporting member being connected to the covering member and supporting the wiring board at the convex portion.

Abstract: An electronic device includes a circuit board having a first electrode formed on a main surface thereof, a semiconductor device disposed toward the main surface of the circuit board, the semiconductor device having a second electrode formed on a surface thereof opposed to the main surface, and a connection member electrically connecting between the first and second electrodes. The connection member includes a hollow cylindrical member and a conductive member disposed within the hollow cylindrical member.

Abstract: A resonance pattern (21) made of conductive material and having a circular plan shape is formed over the principal surface of a dielectric substrate. First and second virtual straight lines mutually crossing at a right angle are defined. A first input port (22) and a first output port (23) are electromagnetically coupled to the resonance pattern at two cross points between the first virtual straight line and an outer circumference line of the resonance pattern. A second input port (24) and a second output port (25) are electromagnetically coupled to the resonance pattern at two cross points between the second virtual straight line and the outer circumference line of the resonance pattern. A first inter-port waveguide (26) propagates a high frequency signal output to the first output port to the second input port.

Abstract: A dual-mode filter capable of providing a high degree of design freedom and/or tunability is disclosed. The dual-mode filter includes a ring resonator; an input feeder and an output feeder disposed substantially orthogonal with respect to each other and with respect to the ring resonator so as to be electromagnetically coupled to the ring resonator; and a dual-mode generating line disposed inside the ring resonator in a manner so that the dual-mode generating line does not overlap with a line extending from the input feeder or a line extending from the output feeder.

Abstract: A superconducting device comprises a dielectric substrate, and a plane-figure type resonator pattern made of a superconductive material and formed on a first face of the dielectric substrate. The resonator pattern has a notch at least a portion of which is round.

Abstract: The high-frequency circuit cooling apparatus comprises a package container 14 for housing a high-frequency circuit, a tank 16 for storing a gas to be introduced into the package container 14, a cold head 12 for cooling the package container 14 and the tank 16, pipes 24, 26 connected to the tank 16, for supplying the gas into the tank 16, pipes 18, 22 detachably connected between the tank 16 and the package container 14, for introducing the gas in the tank 16 into the package container 14, and pipes 34, 36 detachably connected to the package container 14, for discharging the gas in the package container 14.